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Stensil Pateri, Templat

PA0238-S
Chip Quik Inc.

PA0238-S

bahagian bahagian: 6357

Jenis: SOIC, Bilangan Kedudukan: 44, Pitch: 0.050" (1.27mm), Dimensi Luar: 0.900" L x 1.950" W (22.86mm x 49.53mm),

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IPC0120-S
Chip Quik Inc.

IPC0120-S

bahagian bahagian: 6369

Jenis: QFN/LFCSP, Bilangan Kedudukan: 52, Pitch: 0.020" (0.50mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.315" L x 0.315" W (8.00mm x 8.00mm), Pad Pusat Termal: 0.244" L x 0.244" W (6.20mm x 6.20mm),

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PA0090-S
Chip Quik Inc.

PA0090-S

bahagian bahagian: 6386

Jenis: TSOC, Bilangan Kedudukan: 6, Pitch: 0.050" (1.27mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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PA0172-S
Chip Quik Inc.

PA0172-S

bahagian bahagian: 6337

Jenis: POS, Bilangan Kedudukan: 8, Pitch: 0.026" (0.65mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.118" L x 0.098" W (3.00mm x 2.50mm),

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PA0140-S
Chip Quik Inc.

PA0140-S

bahagian bahagian: 6327

Jenis: LLP, Bilangan Kedudukan: 24, Pitch: 0.020" (0.50mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.157" L x 0.197" W (4.00mm x 5.00mm),

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IPC0012-S
Chip Quik Inc.

IPC0012-S

bahagian bahagian: 6355

Jenis: QFN/LFCSP, Bilangan Kedudukan: 20, Pitch: 0.026" (0.65mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.197" L x 0.197" W (5.00mm x 5.00mm), Pad Pusat Termal: 0.122" L x 0.122" W (3.10mm x 3.10mm),

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PA0209-S
Chip Quik Inc.

PA0209-S

bahagian bahagian: 6374

Jenis: TSOP, Bilangan Kedudukan: 50, Pitch: 0.031" (0.80mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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PA0026-S
Chip Quik Inc.

PA0026-S

bahagian bahagian: 6393

Jenis: uMAX, Bilangan Kedudukan: 8, Pitch: 0.026" (0.65mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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PA0186-S
Chip Quik Inc.

PA0186-S

bahagian bahagian: 6322

Jenis: TO/DDPAK, Bilangan Kedudukan: 7, Pitch: 0.050" (1.27mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.400" L x 0.390" W (10.16mm x 9.91mm), Pad Pusat Termal: 0.370" L x 0.427" W (9.40mm x 10.85mm),

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PA0100-S
Chip Quik Inc.

PA0100-S

bahagian bahagian: 6416

Jenis: LGA, Bilangan Kedudukan: 16, Pitch: 0.039" (1.00mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.173" L x 0.295" W (4.40mm x 7.50mm),

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IPC0168-S
Chip Quik Inc.

IPC0168-S

bahagian bahagian: 5695

Jenis: PowerSOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Pad Pusat Termal: 0.130" L x 0.154" W (3.30mm x 3.90mm),

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PA0149-S
Chip Quik Inc.

PA0149-S

bahagian bahagian: 6338

Jenis: LLP, Bilangan Kedudukan: 60, Pitch: 0.020" (0.50mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.354" L x 0.354" W (9.00mm x 9.00mm),

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PA0148-S
Chip Quik Inc.

PA0148-S

bahagian bahagian: 6359

Jenis: LLP, Bilangan Kedudukan: 56, Pitch: 0.020" (0.50mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.354" L x 0.354" W (9.00mm x 9.00mm),

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PA0023-S
Chip Quik Inc.

PA0023-S

bahagian bahagian: 6373

Jenis: SSOP, Bilangan Kedudukan: 36, Pitch: 0.031" (0.80mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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PA0190-S
Chip Quik Inc.

PA0190-S

bahagian bahagian: 5674

Jenis: TQFP, Bilangan Kedudukan: 128, Pitch: 0.016" (0.40mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.551" L x 0.551" W (14.00mm x 14.00mm),

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PA0244-S
Chip Quik Inc.

PA0244-S

bahagian bahagian: 6387

Jenis: TO/DPAK, Bilangan Kedudukan: 5, Pitch: 0.045" (1.15mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.256" L x 0.244" W (6.50mm x 6.20mm), Pad Pusat Termal: 0.276" L x 0.236" W (7.00mm x 6.00mm),

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PA0195-S
Chip Quik Inc.

PA0195-S

bahagian bahagian: 6367

Jenis: TSSOP, Bilangan Kedudukan: 28, Pitch: 0.026" (0.65mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.173" L x 0.382" W (4.40mm x 9.70mm), Pad Pusat Termal: 0.118" L x 0.630" W (3.00mm x 16.00mm),

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PA0027-S
Chip Quik Inc.

PA0027-S

bahagian bahagian: 6194

Jenis: uMAX, Bilangan Kedudukan: 10, Pitch: 0.020" (0.50mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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IPC0136-S
Chip Quik Inc.

IPC0136-S

bahagian bahagian: 6357

Jenis: TQFP, Bilangan Kedudukan: 48, Pitch: 0.031" (0.80mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.394" L x 0.551" W (10.00mm x 14.00mm),

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PA0058-S
Chip Quik Inc.

PA0058-S

bahagian bahagian: 6331

Jenis: QFN/LFCSP, Bilangan Kedudukan: 8, Pitch: 0.026" (0.65mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.118" L x 0.118" W (3.00mm x 3.00mm), Pad Pusat Termal: 0.039" L x 0.197" W (1.00mm x 5.00mm),

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IPC0141-S
Chip Quik Inc.

IPC0141-S

bahagian bahagian: 6326

Jenis: PowerSSO, Bilangan Kedudukan: 36, Pitch: 0.020" (0.50mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.407" L x 0.295" W (10.35mm x 7.50mm), Pad Pusat Termal: 0.185" L x 0.217" W (4.70mm x 5.50mm),

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FPC040P030-S
Chip Quik Inc.

FPC040P030-S

bahagian bahagian: 6400

Jenis: FPC/FFC, Bilangan Kedudukan: 30, Pitch: 0.016" (0.40mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Pad Pusat Termal: 0.157" L x 0.701" W (4.00mm x 17.80mm),

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PA0091-S
Chip Quik Inc.

PA0091-S

bahagian bahagian: 6149

Jenis: TQFP, Bilangan Kedudukan: 32, Pitch: 0.031" (0.80mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.276" L x 0.276" W (7.00mm x 7.00mm),

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PA0213-S
Chip Quik Inc.

PA0213-S

bahagian bahagian: 6407

Jenis: TSOP, Bilangan Kedudukan: 86, Pitch: 0.020" (0.50mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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PA0206-S
Chip Quik Inc.

PA0206-S

bahagian bahagian: 6399

Jenis: DFN, Bilangan Kedudukan: 16, Pitch: 0.020" (0.50mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.197" L x 0.157" W (5.00mm x 4.00mm), Pad Pusat Termal: 0.096" L x 0.354" W (2.45mm x 9.00mm),

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IPC0067-S
Chip Quik Inc.

IPC0067-S

bahagian bahagian: 6319

Jenis: DFN, Bilangan Kedudukan: 10, Pitch: 0.020" (0.50mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.118" L x 0.118" W (3.00mm x 3.00mm), Pad Pusat Termal: 0.059" L x 0.079" W (1.50mm x 2.00mm),

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PA0051-S
Chip Quik Inc.

PA0051-S

bahagian bahagian: 6402

Jenis: MLP/MLF, Bilangan Kedudukan: 10, Pitch: 0.020" (0.50mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.118" L x 0.118" W (3.00mm x 3.00mm), Pad Pusat Termal: 0.039" L x 0.197" W (1.00mm x 5.00mm),

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IPC0144-S
Chip Quik Inc.

IPC0144-S

bahagian bahagian: 6360

Jenis: QFN/LFCSP, Bilangan Kedudukan: 56, Pitch: 0.016" (0.40mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.276" L x 0.276" W (7.00mm x 7.00mm), Pad Pusat Termal: 0.204" L x 0.204" W (5.18mm x 5.18mm),

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PA0050-S
Chip Quik Inc.

PA0050-S

bahagian bahagian: 6396

Jenis: MLP/MLF, Bilangan Kedudukan: 8, Pitch: 0.026" (0.65mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.118" L x 0.118" W (3.00mm x 3.00mm), Pad Pusat Termal: 0.039" L x 0.197" W (1.00mm x 5.00mm),

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PA0133-S
Chip Quik Inc.

PA0133-S

bahagian bahagian: 6388

Jenis: LLP, Bilangan Kedudukan: 6, Pitch: 0.026" (0.65mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.087" L x 0.098" W (2.20mm x 2.50mm), Pad Pusat Termal: 0.030" L x 0.197" W (0.75mm x 5.00mm),

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IPC0106-S
Chip Quik Inc.

IPC0106-S

bahagian bahagian: 6354

Jenis: DFN, Bilangan Kedudukan: 14, Pitch: 0.020" (0.50mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.157" L x 0.157" W (4.00mm x 4.00mm), Pad Pusat Termal: 0.102" L x 0.118" W (2.60mm x 3.00mm),

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PA0003-S
Chip Quik Inc.

PA0003-S

bahagian bahagian: 6348

Jenis: SOIC, Bilangan Kedudukan: 14, Pitch: 0.050" (1.27mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm),

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IPC0063-S
Chip Quik Inc.

IPC0063-S

bahagian bahagian: 6323

Jenis: DFN, Bilangan Kedudukan: 8, Pitch: 0.026" (0.65mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.118" L x 0.118" W (3.00mm x 3.00mm), Pad Pusat Termal: 0.055" L x 0.091" W (1.40mm x 2.30mm),

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PA0207-S
Chip Quik Inc.

PA0207-S

bahagian bahagian: 6330

Jenis: TSOP, Bilangan Kedudukan: 40, Pitch: 0.020" (0.50mm), Dimensi Luar: 1.350" L x 1.950" W (34.29mm x 49.53mm),

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PA0187-S
Chip Quik Inc.

PA0187-S

bahagian bahagian: 6412

Jenis: TO/DDPAK, Bilangan Kedudukan: 9, Pitch: 0.038" (0.97mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.400" L x 0.390" W (10.16mm x 9.91mm), Pad Pusat Termal: 0.370" L x 0.427" W (9.40mm x 10.85mm),

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PA0152-S
Chip Quik Inc.

PA0152-S

bahagian bahagian: 6357

Jenis: BGA, Bilangan Kedudukan: 4, Pitch: 0.020" (0.50mm), Dimensi Luar: 0.900" L x 1.300" W (22.86mm x 33.02mm), Dimensi Dalaman: 0.033" L x 0.033" W (0.85mm x 0.85mm),

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