Permohonan: Transformer Driver, Semasa - Bekalan: 1.1mA, Voltan - Bekalan: 2.5V ~ 6V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Permohonan: Power Supplies, Semasa - Bekalan: 2.5mA, Voltan - Bekalan: 9.3V ~ 28V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad,
Permohonan: Energy Harvesting, Voltan - Bekalan: 5.7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 12-UFDFN Exposed Pad,
Permohonan: Current Sense Amp, Current Switch, Semasa - Bekalan: 600µA, Voltan - Bekalan: 5V ~ 18V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SSOP (0.154", 3.90mm Width),
Permohonan: Thermoelectric Cooler, Voltan - Bekalan: 3V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad,
Permohonan: Automotive Systems, Voltan - Bekalan: 3.7V ~ 28V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad,
Permohonan: Power Supplies, Semasa - Bekalan: 2.5mA, Voltan - Bekalan: 4.5V ~ 5.5V, Suhu Operasi: 0°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-TSSOP (0.173", 4.40mm Width),
Permohonan: Processor, Voltan - Bekalan: 2.7V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-WFQFN Exposed Pad,
Permohonan: Thermoelectric Cooler, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP Exposed Pad,
Permohonan: Handheld/Mobile Devices, OMAP™, Voltan - Bekalan: 2.7V ~ 4.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 169-LFBGA,
Permohonan: Handheld/Mobile Devices, Voltan - Bekalan: 2.5V ~ 6V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-WFQFN Exposed Pad,
Permohonan: Cellular, CDMA Handset, Voltan - Bekalan: 3V ~ 5.5V, Jenis Pemasangan: Surface Mount, Pakej / Kes: 49-WFBGA, DSBGA,
Permohonan: Handheld/Mobile Devices, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 247-TFBGA,
Permohonan: Automotive, Semasa - Bekalan: 10mA, Voltan - Bekalan: 4.7V ~ 36V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-SSOP (0.295", 7.50mm Width) Exposed Pad,
Permohonan: Processor, Semasa - Bekalan: 95µA, Voltan - Bekalan: 5.6V ~ 25V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-SOIC (0.295", 7.50mm Width),
Permohonan: Pump, Valve Controller, Voltan - Bekalan: 6V ~ 36V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 64-LQFP Exposed Pad,
Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,
Permohonan: Processor, Semasa - Bekalan: 500µA, Voltan - Bekalan: 9.5V ~ 18V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 13-SIP Formed Leads,
Permohonan: Automotive, Semasa - Bekalan: 5mA, Voltan - Bekalan: 5.5V ~ 18V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-BSSOP (0.295", 7.50mm Width),
Permohonan: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 186-LFBGA,
Permohonan: Ignition Buffer, Regulator, Semasa - Bekalan: 300µA, Voltan - Bekalan: 9V ~ 18V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 23-SIP Formed Leads,
Permohonan: System Basis Chip, Semasa - Bekalan: 7mA, Voltan - Bekalan: 3.5V ~ 28V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,
Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Permohonan: Heating Controller, Voltan - Bekalan: 4V ~ 5.5V, Suhu Operasi: -20°C ~ 85°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Jenis Pemasangan: Through Hole, Pakej / Kes: 8-DIP (0.300", 7.62mm),
Permohonan: Hardware Management Controller, Voltan - Bekalan: 4.75V ~ 13.2V, Suhu Operasi: 0°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 237-LBGA,
Permohonan: Handheld/Mobile Devices, OMAP™, Semasa - Bekalan: 8µA, Voltan - Bekalan: 2.7V ~ 5.5V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-WFQFN Exposed Pad,
Permohonan: Wireless Power Receiver, Jenis Pemasangan: Surface Mount,
Permohonan: Automotive, Voltan - Bekalan: 8V ~ 18V, Suhu Operasi: -20°C ~ 100°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Permohonan: Pulse Generator, Semasa - Bekalan: 50µA, Voltan - Bekalan: 4.75V ~ 11V, Suhu Operasi: -20°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 22-VFLGA,