Jenis Papan Proto: SMD to PGA, Pakej Diterima: TQFP, Bilangan Kedudukan: 144, Pitch: 0.016" (0.40mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 36, Pitch: 0.035" (0.90mm),
Jenis Papan Proto: SMD to DIP, Pakej Diterima: LGA, Bilangan Kedudukan: 10, Pitch: 0.016" (0.40mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 64, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOP, Bilangan Kedudukan: 36, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 44, Pitch: 0.025" (0.64mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, Bilangan Kedudukan: 10, Pitch: 0.016" (0.40mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 14, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: PowerSOIC, Bilangan Kedudukan: 28, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 24, Pitch: 0.039" (1.00mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: PowerSOIC, Bilangan Kedudukan: 24, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to PGA, Pakej Diterima: RQFP, QFP, Bilangan Kedudukan: 240, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 24, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: BGA, Bilangan Kedudukan: 24, Pitch: 0.039" (1.00mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pitch: 0.047" (1.20mm),
Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 28, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to PGA, Pakej Diterima: PQFP, Bilangan Kedudukan: 100, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: PowerSOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 2, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: BGA, Bilangan Kedudukan: 25, Pitch: 0.039" (1.00mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to PGA, Pakej Diterima: LCC, JLCC, PLCC, Bilangan Kedudukan: 84, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: TQFP, Bilangan Kedudukan: 80, Pitch: 0.031" (0.80mm),
Jenis Papan Proto: SMD to PGA, Pakej Diterima: LQFP, PQFP, Bilangan Kedudukan: 128, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: MSOP, Bilangan Kedudukan: 12, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, MLP, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 28, Pitch: 0.026" (0.65mm),
Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, Bilangan Kedudukan: 8, Pitch: 0.038" (0.97mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 56, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, Bilangan Kedudukan: 12, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 48, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 32, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, Bilangan Kedudukan: 8, Pitch: 0.018" (0.45mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to PGA, Pakej Diterima: LQFP, Bilangan Kedudukan: 128, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOP, Bilangan Kedudukan: 8,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, TSSOP, Bilangan Kedudukan: 28, Pitch: 0.026" (0.65mm),
