Penyesuai, Papan Pecah | Prototaip, Produk Fabrikasi | 1

PA-QLD6SM18-32F-88

bahagian bahagian: 4657

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, QFN, Bilangan Kedudukan: 32, Pitch: 0.031" (0.80mm),

Senarai harapan

Logical Systems Inc.

PA-SOD6SM18-32

bahagian bahagian: 4604

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 32, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32",

Senarai harapan

Logical Systems Inc.

PA-TS1D6SM18-32

bahagian bahagian: 4651

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSOP, Bilangan Kedudukan: 32, Pitch: 0.020" (0.50mm),

Senarai harapan

Logical Systems Inc.

PA-SSD6SM18-28

bahagian bahagian: 5320

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, TSSOP, Bilangan Kedudukan: 28, Pitch: 0.026" (0.65mm),

Senarai harapan

Logical Systems Inc.

PA-SSD6SM18-32

bahagian bahagian: 4627

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, TSSOP, Bilangan Kedudukan: 32, Pitch: 0.026" (0.65mm),

Senarai harapan

Logical Systems Inc.

PA-SSD6SM18-40

bahagian bahagian: 3678

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, TSSOP, Bilangan Kedudukan: 40, Pitch: 0.026" (0.65mm),

Senarai harapan

Logical Systems Inc.

PA-SOD3SM18-18

bahagian bahagian: 8143

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 18, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32",

Senarai harapan

Logical Systems Inc.

PA-QSD3SM18-20

bahagian bahagian: 7347

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QSOP, Bilangan Kedudukan: 20, Pitch: 0.025" (0.64mm),

Senarai harapan

Logical Systems Inc.

PA-SSD3SM18-18

bahagian bahagian: 8232

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, TSSOP, Bilangan Kedudukan: 18, Pitch: 0.026" (0.65mm),

Senarai harapan

Logical Systems Inc.

PA44QL8-1D

bahagian bahagian: 3376

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFP, Bilangan Kedudukan: 44,

Senarai harapan

Logical Systems Inc.

PA-QSD3SM18-16

bahagian bahagian: 9199

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QSOP, Bilangan Kedudukan: 16, Pitch: 0.025" (0.64mm),

Senarai harapan

Logical Systems Inc.

PA-SSD6SM18-24

bahagian bahagian: 6123

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, TSSOP, Bilangan Kedudukan: 24, Pitch: 0.026" (0.65mm),

Senarai harapan

Logical Systems Inc.

PA-SSD3SM18-28

bahagian bahagian: 5244

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, TSSOP, Bilangan Kedudukan: 28, Pitch: 0.026" (0.65mm),

Senarai harapan

Logical Systems Inc.

PA-SSD3SM18-08

bahagian bahagian: 14682

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, TSSOP, Bilangan Kedudukan: 8, Pitch: 0.026" (0.65mm),

Senarai harapan

Logical Systems Inc.

PA-SOTD3SM18-06

bahagian bahagian: 14718

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 6, Pitch: 0.037" (0.95mm),

Senarai harapan

Logical Systems Inc.

PA-SOD3SM18-28

bahagian bahagian: 5254

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 28, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32",

Senarai harapan

Logical Systems Inc.

PA-MSD3SM18-10

bahagian bahagian: 14718

Jenis Papan Proto: SMD to DIP, Pakej Diterima: MSOP, Bilangan Kedudukan: 10, Pitch: 0.020" (0.50mm),

Senarai harapan

Logical Systems Inc.

PA-SSD3SM18-14

bahagian bahagian: 10487

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, TSSOP, Bilangan Kedudukan: 14, Pitch: 0.026" (0.65mm),

Senarai harapan

Logical Systems Inc.

PA-SSD3SM18-16

bahagian bahagian: 9200

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, TSSOP, Bilangan Kedudukan: 16, Pitch: 0.026" (0.65mm),

Senarai harapan

Logical Systems Inc.

PA-MSD3SM18-08

bahagian bahagian: 14712

Jenis Papan Proto: SMD to DIP, Pakej Diterima: MSOP, Bilangan Kedudukan: 8, Pitch: 0.026" (0.65mm),

Senarai harapan

Logical Systems Inc.

PA-SOD3SM18-20

bahagian bahagian: 7357

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32",

Senarai harapan

Logical Systems Inc.

PA-SSD3SM18-24

bahagian bahagian: 6119

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, TSSOP, Bilangan Kedudukan: 24, Pitch: 0.026" (0.65mm),

Senarai harapan

Logical Systems Inc.

PA-SOD3SM18-24

bahagian bahagian: 6133

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 24, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32",

Senarai harapan

Logical Systems Inc.

PA-SSD3SM18-20

bahagian bahagian: 7367

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, TSSOP, Bilangan Kedudukan: 20, Pitch: 0.026" (0.65mm),

Senarai harapan

Logical Systems Inc.

PA-SOD3SM18-14

bahagian bahagian: 10544

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 14, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32",

Senarai harapan

Logical Systems Inc.

PA-SOD3SM18-16

bahagian bahagian: 9221

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32",

Senarai harapan

Logical Systems Inc.

PA-SOD3SM18-08

bahagian bahagian: 14677

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32",

Senarai harapan