Penyesuai, Papan Pecah | Prototaip, Produk Fabrikasi | 1

319010351

bahagian bahagian: 24023

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: QFP, Bilangan Kedudukan: 80, Pitch: 0.031" (0.80mm),

Senarai harapan

Seeed Technology Co., Ltd

319010053

bahagian bahagian: 7250

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP, Bilangan Kedudukan: 6, 8, Pitch: 0.026" (0.65mm),

Senarai harapan

Seeed Technology Co., Ltd

319010042

bahagian bahagian: 5042

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP, Bilangan Kedudukan: 6, 8, Pitch: 0.020" (0.50mm),

Senarai harapan

Seeed Technology Co., Ltd

319010045

bahagian bahagian: 4248

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: QFP, Bilangan Kedudukan: 80, Pitch: 0.026" (0.65mm),

Senarai harapan

Seeed Technology Co., Ltd

319010352

bahagian bahagian: 23969

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: QFP, Bilangan Kedudukan: 80, Pitch: 0.020" (0.50mm),

Senarai harapan

Seeed Technology Co., Ltd

319010047

bahagian bahagian: 7199

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP, Bilangan Kedudukan: 6, 8, Pitch: 0.020" (0.50mm),

Senarai harapan