Penyesuai, Papan Pecah

BOB-00494

BOB-00494

bahagian bahagian: 7334

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8,

Senarai harapan
BOB-00498

BOB-00498

bahagian bahagian: 24852

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 16, Pitch: 0.025" (0.64mm),

Senarai harapan
BOB-13098

BOB-13098

bahagian bahagian: 37613

Jenis Papan Proto: Through Hole to SIP, Pakej Diterima: Rotary Switch, Bilangan Kedudukan: 11,

Senarai harapan
BOB-10467

BOB-10467

bahagian bahagian: 48907

Jenis Papan Proto: Through Hole to SIP, Pakej Diterima: Tactile Switch, Bilangan Kedudukan: 6,

Senarai harapan
BOB-13005

BOB-13005

bahagian bahagian: 29363

Jenis Papan Proto: SMD to SIP, Pakej Diterima: 1/4" TRS Jack, Bilangan Kedudukan: 7,

Senarai harapan
BOB-13099

BOB-13099

bahagian bahagian: 37570

Jenis Papan Proto: Through Hole to SIP, Pakej Diterima: Rotary Potentiometer, Bilangan Kedudukan: 3,

Senarai harapan
BOB-13878

BOB-13878

bahagian bahagian: 37574

Jenis Papan Proto: Plated Through Hole to Plated Through Hole,

Senarai harapan
BOB-08891

BOB-08891

bahagian bahagian: 77168

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Pakej Diterima: Gas Sensor, Bilangan Kedudukan: 6,

Senarai harapan
BOB-11722

BOB-11722

bahagian bahagian: 24888

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Pakej Diterima: Rotary Encoder, Bilangan Kedudukan: 8,

Senarai harapan
BOB-00573

BOB-00573

bahagian bahagian: 4916

Jenis Papan Proto: Connector to Plated Through Hole, Pakej Diterima: SIM, Bilangan Kedudukan: 8,

Senarai harapan
BOB-09322

BOB-09322

bahagian bahagian: 48896

Jenis Papan Proto: Through Hole to SIP, Pakej Diterima: Photo Interrupter, Bilangan Kedudukan: 5,

Senarai harapan
BOB-00497

BOB-00497

bahagian bahagian: 24839

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 8, Pitch: 0.025" (0.64mm),

Senarai harapan
BOB-00496

BOB-00496

bahagian bahagian: 18585

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 28,

Senarai harapan
BOB-09540

BOB-09540

bahagian bahagian: 24860

Jenis Papan Proto: Through Hole to SIP, Pakej Diterima: Multiwatt, Bilangan Kedudukan: 15,

Senarai harapan
BOB-00495

BOB-00495

bahagian bahagian: 18580

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 20,

Senarai harapan
BOB-12941

BOB-12941

bahagian bahagian: 7371

Jenis Papan Proto: Connector to Plated Through Hole, Pakej Diterima: SD Card, Bilangan Kedudukan: 10,

Senarai harapan
BOB-09966

BOB-09966

bahagian bahagian: 37616

Jenis Papan Proto: Connector to Plated Through Hole, Pakej Diterima: USB - mini B, Bilangan Kedudukan: 5,

Senarai harapan
BOB-00499

BOB-00499

bahagian bahagian: 18557

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 20, Pitch: 0.025" (0.64mm),

Senarai harapan
BOB-14021

BOB-14021

bahagian bahagian: 37607

Jenis Papan Proto: Connector to Plated Through Hole, Pakej Diterima: RJ11, Bilangan Kedudukan: 6,

Senarai harapan
BOB-00500

BOB-00500

bahagian bahagian: 18574

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 28, Pitch: 0.025" (0.64mm),

Senarai harapan
BOB-09110

BOB-09110

bahagian bahagian: 37597

Jenis Papan Proto: Through Hole to SIP, Pakej Diterima: Thumb Joystick, Bilangan Kedudukan: 14,

Senarai harapan
BOB-11570

BOB-11570

bahagian bahagian: 18634

Jenis Papan Proto: Connector to Plated Through Hole, Pakej Diterima: 3.5mm TRRS, Bilangan Kedudukan: 4,

Senarai harapan
BOB-13994

BOB-13994

bahagian bahagian: 24841

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 16,

Senarai harapan
BOB-13773

BOB-13773

bahagian bahagian: 37637

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Pakej Diterima: Cherry MX Switch, Bilangan Kedudukan: 4,

Senarai harapan
BOB-00544

BOB-00544

bahagian bahagian: 18613

Jenis Papan Proto: Connector to Plated Through Hole, Pakej Diterima: microSD™ Card, Bilangan Kedudukan: 7,

Senarai harapan
BOB-13021

BOB-13021

bahagian bahagian: 14879

Jenis Papan Proto: Connector to Plated Through Hole, Pakej Diterima: RJ45, Bilangan Kedudukan: 13,

Senarai harapan
BOB-10031

BOB-10031

bahagian bahagian: 18630

Jenis Papan Proto: Connector to Plated Through Hole, Pakej Diterima: USB - micro B, Bilangan Kedudukan: 5,

Senarai harapan
BOB-12035

BOB-12035

bahagian bahagian: 37553

Jenis Papan Proto: Connector to Plated Through Hole, Pakej Diterima: USB - micro B, Bilangan Kedudukan: 5, Pitch: 0.100" (2.54mm),

Senarai harapan
BOB-12700

BOB-12700

bahagian bahagian: 18624

Jenis Papan Proto: Connector to Plated Through Hole, Pakej Diterima: USB - A, Bilangan Kedudukan: 4,

Senarai harapan
BOB-00716

BOB-00716

bahagian bahagian: 77180

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Pakej Diterima: RJ45, Bilangan Kedudukan: 8,

Senarai harapan
BOB-13655

BOB-13655

bahagian bahagian: 24843

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8,

Senarai harapan
BOB-00717

BOB-00717

bahagian bahagian: 77172

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOT-23, Bilangan Kedudukan: 6,

Senarai harapan
PRT-10588

PRT-10588

bahagian bahagian: 77148

Bilangan Kedudukan: 10,

Senarai harapan
TOL-11468

TOL-11468

bahagian bahagian: 7426

Jenis Papan Proto: Connector to Plated Through Hole, Pakej Diterima: SD Card, Bilangan Kedudukan: 11,

Senarai harapan
TOL-09419

TOL-09419

bahagian bahagian: 7375

Jenis Papan Proto: Connector to Plated Through Hole, Pakej Diterima: microSD™ Card, Bilangan Kedudukan: 8, Pitch: 0.100" (2.54mm),

Senarai harapan