Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: TSSOP, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16",
Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: TSSOP,
Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC, Ketebalan Papan: 0.062" (1.57mm) 1/16",
Jenis Papan Proto: SMD to DIP, Pakej Diterima: PSOP, SSOP, TSOP, Ketebalan Papan: 0.062" (1.57mm) 1/16",
Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: QFP, Ketebalan Papan: 0.062" (1.57mm) 1/16",
Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: PLCC, Ketebalan Papan: 0.062" (1.57mm) 1/16",
Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: TQFP,
Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC,
Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16",
