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MMF301501
Micro-Measurements (Division of Vishay Precision G

MMF301501

bahagian bahagian: 143

Jenis: Wire Solder, Komposisi: Sn95Sb5 (95/5), Diameter: 0.020" (0.51mm), Takat lebur: 450 ~ 460°F (232 ~ 238°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 24 AWG, 25 SWG,

Senarai harapan
MMF006630
Micro-Measurements (Division of Vishay Precision G

MMF006630

bahagian bahagian: 491

Jenis: Solder Paste, Komposisi: Ag40Cu30Zn28Ni2 (40/30/28/2), Takat lebur: 1220 ~ 1435°F (660 ~ 780°C),

Senarai harapan
MMF006619
Micro-Measurements (Division of Vishay Precision G

MMF006619

bahagian bahagian: 2696

Jenis: Wire Solder, Komposisi: Sn63Pb36.65Sb0.35 (63/36.65/0.35), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 24 AWG, 25 SWG,

Senarai harapan
MMF006620
Micro-Measurements (Division of Vishay Precision G

MMF006620

bahagian bahagian: 751

Jenis: Wire Solder, Komposisi: Sn63Pb36.65Sb0.35 (63/36.65/0.35), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 24 AWG, 25 SWG,

Senarai harapan
MMF006622
Micro-Measurements (Division of Vishay Precision G

MMF006622

bahagian bahagian: 706

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.040" (1.02mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 18 AWG, 19 SWG,

Senarai harapan