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Penyesuai, Papan Pecah

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  • Penyesuai, Papan Pecah
08-350000-10-P
Aries Electronics

08-350000-10-P

bahagian bahagian: 16673

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
08-350000-11-RC-P
Aries Electronics

08-350000-11-RC-P

bahagian bahagian: 16715

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
08-350000-10
Aries Electronics

08-350000-10

bahagian bahagian: 8469

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
08-350000-11-RC
Aries Electronics

08-350000-11-RC

bahagian bahagian: 8464

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
14-350000-11-RC-P
Aries Electronics

14-350000-11-RC-P

bahagian bahagian: 14740

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 14, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
16-350000-11-RC-P
Aries Electronics

16-350000-11-RC-P

bahagian bahagian: 9690

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
10-350000-10
Aries Electronics

10-350000-10

bahagian bahagian: 10453

Jenis Papan Proto: SMD to DIP, Bilangan Kedudukan: 10, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
18-350000-11-RC-P
Aries Electronics

18-350000-11-RC-P

bahagian bahagian: 14748

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 18, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
18-350000-11-RC
Aries Electronics

18-350000-11-RC

bahagian bahagian: 8462

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 18, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
18-350000-10
Aries Electronics

18-350000-10

bahagian bahagian: 8417

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 18, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
16-350000-10-P
Aries Electronics

16-350000-10-P

bahagian bahagian: 14728

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
12-350000-10
Aries Electronics

12-350000-10

bahagian bahagian: 10444

Jenis Papan Proto: SMD to DIP, Bilangan Kedudukan: 12, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
14-350000-10-P
Aries Electronics

14-350000-10-P

bahagian bahagian: 14571

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 14, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
14-351000-10
Aries Electronics

14-351000-10

bahagian bahagian: 4616

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 14, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
16-351000-11-RC
Aries Electronics

16-351000-11-RC

bahagian bahagian: 4633

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 16, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16",

Senarai harapan
16-665000-00
Aries Electronics

16-665000-00

bahagian bahagian: 4998

Jenis Papan Proto: SMD to SMD, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
14-351000-11-RC
Aries Electronics

14-351000-11-RC

bahagian bahagian: 4639

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 14, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16",

Senarai harapan
16-351000-10
Aries Electronics

16-351000-10

bahagian bahagian: 4550

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 16, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
1110748
Aries Electronics

1110748

bahagian bahagian: 7133

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOT, Bilangan Kedudukan: 6, Pitch: 0.037" (0.95mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
16-666000-00
Aries Electronics

16-666000-00

bahagian bahagian: 6266

Jenis Papan Proto: SMD to SMD, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
16-350000-11-RC
Aries Electronics

16-350000-11-RC

bahagian bahagian: 8449

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
14-350000-10
Aries Electronics

14-350000-10

bahagian bahagian: 8438

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 14, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
14-350000-11-RC
Aries Electronics

14-350000-11-RC

bahagian bahagian: 8382

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 14, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
1109814
Aries Electronics

1109814

bahagian bahagian: 6009

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8, Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
16-350000-10
Aries Electronics

16-350000-10

bahagian bahagian: 8421

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
20-351000-11-RC
Aries Electronics

20-351000-11-RC

bahagian bahagian: 4582

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 20, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16",

Senarai harapan
28-350002-10-P
Aries Electronics

28-350002-10-P

bahagian bahagian: 9600

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 28, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
28-505-111P
Aries Electronics

28-505-111P

bahagian bahagian: 9550

Jenis Papan Proto: SMD to PGA, Pakej Diterima: PLCC, Bilangan Kedudukan: 28, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
20-350000-10-P
Aries Electronics

20-350000-10-P

bahagian bahagian: 14724

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
20-350000-11-RC-P
Aries Electronics

20-350000-11-RC-P

bahagian bahagian: 14730

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
22-350000-10
Aries Electronics

22-350000-10

bahagian bahagian: 9913

Jenis Papan Proto: SMD to DIP, Bilangan Kedudukan: 22, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
28-351000-10
Aries Electronics

28-351000-10

bahagian bahagian: 4607

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 28, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
20-35W000-11-RC
Aries Electronics

20-35W000-11-RC

bahagian bahagian: 4855

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
20-350000-10
Aries Electronics

20-350000-10

bahagian bahagian: 8384

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
24-650000-10
Aries Electronics

24-650000-10

bahagian bahagian: 5044

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 24, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
24-350000-10
Aries Electronics

24-350000-10

bahagian bahagian: 8740

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 24, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan