| Type. | Perihalan |
| Status Bahagian | Active |
|---|---|
| Jenis | LGA |
| Bilangan Kedudukan atau Pin (Grid) | 1151 |
| Pitch - Berkawan | 0.036" (0.91mm) |
| Hubungi Selesai - Berkawan | Gold |
| Hubungi Ketebalan Selesai - Mengawan | 15.0µin (0.38µm) |
| Bahan Hubungan - Kawan | Copper Alloy |
| Jenis Pemasangan | Surface Mount |
| ciri-ciri | Closed Frame |
| Penamatan | Solder |
| Pitch - Pos | 0.036" (0.91mm) |
| Selesai Hubungi - Kirim | Gold |
| Hubungi Ketebalan Selesai - Kirim | 15.0µin (0.38µm) |
| Bahan Perhubungan - Pos | Copper Alloy |
| Bahan Perumahan | Thermoplastic |
| Suhu Operasi | - |
| Status RoHS. | Patuh roh |
|---|---|
| Tahap Kepekaan Kelembapan (MSL) | Tidak berkenaan |
| Status kitaran hayat | Usang / akhir hidup |
| Kategori saham | Saham yang ada |
