| Type. | Perihalan |
| Status Bahagian | Active |
|---|---|
| Jenis | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Bilangan Kedudukan atau Pin (Grid) | 28 (2 x 14) |
| Pitch - Berkawan | 0.100" (2.54mm) |
| Hubungi Selesai - Berkawan | Tin |
| Hubungi Ketebalan Selesai - Mengawan | 200.0µin (5.08µm) |
| Bahan Hubungan - Kawan | Beryllium Copper |
| Jenis Pemasangan | Through Hole |
| ciri-ciri | Closed Frame |
| Penamatan | Solder |
| Pitch - Pos | 0.100" (2.54mm) |
| Selesai Hubungi - Kirim | Tin |
| Hubungi Ketebalan Selesai - Kirim | 200.0µin (5.08µm) |
| Bahan Perhubungan - Pos | Beryllium Copper |
| Bahan Perumahan | Polyphenylene Sulfide (PPS), Glass Filled |
| Suhu Operasi | - |
| Status RoHS. | Patuh roh |
|---|---|
| Tahap Kepekaan Kelembapan (MSL) | Tidak berkenaan |
| Status kitaran hayat | Usang / akhir hidup |
| Kategori saham | Saham yang ada |
