| Type. | Perihalan |
| Status Bahagian | Active |
|---|---|
| Jenis | BGA |
| Bilangan Kedudukan atau Pin (Grid) | 504 (29 x 29) |
| Pitch - Berkawan | 0.050" (1.27mm) |
| Hubungi Selesai - Berkawan | Gold |
| Hubungi Ketebalan Selesai - Mengawan | 10.0µin (0.25µm) |
| Bahan Hubungan - Kawan | Beryllium Copper |
| Jenis Pemasangan | Through Hole |
| ciri-ciri | Closed Frame |
| Penamatan | Solder |
| Pitch - Pos | 0.050" (1.27mm) |
| Selesai Hubungi - Kirim | Gold |
| Hubungi Ketebalan Selesai - Kirim | 10.0µin (0.25µm) |
| Bahan Perhubungan - Pos | Brass |
| Bahan Perumahan | FR4 Epoxy Glass |
| Suhu Operasi | -55°C ~ 125°C |
| Status RoHS. | Patuh roh |
|---|---|
| Tahap Kepekaan Kelembapan (MSL) | Tidak berkenaan |
| Status kitaran hayat | Usang / akhir hidup |
| Kategori saham | Saham yang ada |
