Pateri

1844657

bahagian bahagian: 63

Jenis: Solder Paste, Komposisi: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Takat lebur: 410 ~ 424°F (209 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang

1993881

bahagian bahagian: 824

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Bersenang-senang

1844644

bahagian bahagian: 47

Jenis: Solder Paste, Komposisi: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Takat lebur: 409 ~ 424°F (209 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang

1846154

bahagian bahagian: 79

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Bersenang-senang

1844641

bahagian bahagian: 97

Jenis: Solder Paste, Komposisi: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Takat lebur: 408 ~ 424°F (209 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang

1434537

bahagian bahagian: 46

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 350°F (177°C), Jenis Flux: No-Clean,

Bersenang-senang

1434501

bahagian bahagian: 49

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 350°F (177°C), Jenis Flux: No-Clean,

Bersenang-senang

1844685

bahagian bahagian: 41

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 401 ~ 424°F (205 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang

1434504

bahagian bahagian: 27

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 350°F (177°C), Jenis Flux: No-Clean,

Bersenang-senang

1747469

bahagian bahagian: 156

Jenis: Solder Paste, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Bersenang-senang

1769647

bahagian bahagian: 724

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Bersenang-senang

1405711

bahagian bahagian: 85

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang

1769646

bahagian bahagian: 797

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean,

Bersenang-senang

1817240

bahagian bahagian: 1319

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C),

Bersenang-senang

1817250

bahagian bahagian: 1110

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423°F (217°C),

Bersenang-senang

1394819

bahagian bahagian: 2054

Jenis: Solder Paste, Takat lebur: 546 ~ 567°F (286 ~ 297°C),

Bersenang-senang

1042100

bahagian bahagian: 750

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.064" (1.63mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: No-Clean, Wire Gauge: 14 AWG, 16 SWG,

Bersenang-senang

14-6337-0015

bahagian bahagian: 1477

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Takat lebur: 361°F (183°C), Wire Gauge: 27 AWG, 28 SWG,

Bersenang-senang

16-6337-0125

bahagian bahagian: 2397

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.125" (3.18mm), Takat lebur: 361°F (183°C), Wire Gauge: 8 AWG, 10 SWG,

Bersenang-senang

14-6040-0062

bahagian bahagian: 1903

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.062" (1.57mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Wire Gauge: 14 AWG, 16 SWG,

Bersenang-senang

14-6337-0125

bahagian bahagian: 2402

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.125" (3.18mm), Takat lebur: 361°F (183°C), Wire Gauge: 8 AWG, 10 SWG,

Bersenang-senang

16-6040-0125

bahagian bahagian: 2485

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.125" (3.18mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Wire Gauge: 8 AWG, 10 SWG,

Bersenang-senang

16-6337-0062

bahagian bahagian: 2341

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.062" (1.57mm), Takat lebur: 361°F (183°C), Wire Gauge: 14 AWG, 16 SWG,

Bersenang-senang

14-6337-0062

bahagian bahagian: 1692

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.062" (1.57mm), Takat lebur: 361°F (183°C), Wire Gauge: 14 AWG, 16 SWG,

Bersenang-senang

14-6040-0125

bahagian bahagian: 2439

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.125" (3.18mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Wire Gauge: 8 AWG, 10 SWG,

Bersenang-senang

18-7068-0093

bahagian bahagian: 9273

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.093" (2.36mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Wire Gauge: 11 AWG, 13 SWG,

Bersenang-senang

18-7068-0125

bahagian bahagian: 9311

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.125" (3.18mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Wire Gauge: 8 AWG, 10 SWG,

Bersenang-senang

18-7000-0045

bahagian bahagian: 9272

Jenis: Wire Solder, Komposisi: Sn99 (99), Diameter: 0.045" (1.14mm), Wire Gauge: 17 AWG, 18 SWG,

Bersenang-senang

18-7000-0078

bahagian bahagian: 9277

Jenis: Wire Solder, Komposisi: Sn99 (99), Diameter: 0.078" (1.98mm), Wire Gauge: 12 AWG, 14 SWG,

Bersenang-senang

14-6337-0031

bahagian bahagian: 1525

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Takat lebur: 361°F (183°C), Wire Gauge: 20 AWG, 22 SWG,

Bersenang-senang

18-7000-0062

bahagian bahagian: 9281

Jenis: Wire Solder, Komposisi: Sn99 (99), Diameter: 0.062" (1.57mm), Wire Gauge: 14 AWG, 16 SWG,

Bersenang-senang

17553LF

bahagian bahagian: 7508

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.047" (1.19mm), Takat lebur: 440°F (227°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 17 AWG, 18 SWG,

Bersenang-senang

17555LF

bahagian bahagian: 7552

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.039" (0.99mm), Takat lebur: 440°F (227°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 18 AWG, 19 SWG,

Bersenang-senang

17553

bahagian bahagian: 11210

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.047" (1.19mm), Takat lebur: 360°F (180°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 17 AWG, 18 SWG,

Bersenang-senang