Permohonan: Current Biasing, Semasa - Bekalan: 20mA, Voltan - Bekalan: 5V ~ 16.5V, Suhu Operasi: -55°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 24-VFQFN Exposed Pad,
Permohonan: Current Biasing, Semasa - Bekalan: 7.5mA, Voltan - Bekalan: 4V ~ 12V, Suhu Operasi: -55°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: Die,
Permohonan: System Basis Chip, Semasa - Bekalan: 7mA, Voltan - Bekalan: 3.5V ~ 28V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,
Permohonan: Small Engine, Semasa - Bekalan: 10mA, Voltan - Bekalan: 4.7V ~ 36V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-SSOP (0.295", 7.50mm Width) Exposed Pad,
Permohonan: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Voltan - Bekalan: 3.8V ~ 7V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-VFQFN Exposed Pad,
Permohonan: Motorcycle Braking, Voltan - Bekalan: 6V ~ 20V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-VFQFN Exposed Pad,
Permohonan: Ignition Buffer, Regulator, Semasa - Bekalan: 110µA, Voltan - Bekalan: 9.5V ~ 18V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-SOIC (0.433", 11.00mm Width) Exposed Pad,
Permohonan: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 186-LFBGA,
Permohonan: Processor, Semasa - Bekalan: 500µA, Voltan - Bekalan: 9.5V ~ 18V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-SOIC (0.433", 11.00mm Width) Exposed Pad,
Permohonan: Handheld/Mobile Devices, Semasa - Bekalan: 9mA, Voltan - Bekalan: 0.9V ~ 4.2V, Suhu Operasi: -10°C ~ 65°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 64-VFQFN Exposed Pad,
Permohonan: Processor, Semasa - Bekalan: 10mA, Voltan - Bekalan: 8.4V ~ 14V, Suhu Operasi: 0°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-VFQFN Exposed Pad,
Permohonan: Automotive, Semasa - Bekalan: 750mA, Voltan - Bekalan: 3V ~ 5.5V, 4V ~ 28V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad,
Permohonan: Load Dump, Voltage Protection, Semasa - Bekalan: 224µA, Voltan - Bekalan: 3V ~ 30V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 12-WFQFN Exposed Pad,
Permohonan: Power Supplies, Semasa - Bekalan: 70µA, Voltan - Bekalan: 3.5V ~ 16.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Permohonan: Medical Ultrasound Imaging, Sonar, Semasa - Bekalan: 36mA, Voltan - Bekalan: 2.7V~ 6V, Suhu Operasi: 0°C ~ 70°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 56-WFQFN Exposed Pad,
Permohonan: Medical Ultrasound Imaging, Sonar, Voltan - Bekalan: 2.37V ~ 6V, Suhu Operasi: 0°C ~ 70°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 56-WFQFN Exposed Pad,
Permohonan: Camera, Voltan - Bekalan: 2.7V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 24-WFQFN Exposed Pad,
Permohonan: Handheld/Mobile Devices, OMAP™, Semasa - Bekalan: 8µA, Voltan - Bekalan: 2.7V ~ 5.5V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-WFQFN Exposed Pad,
Permohonan: Handheld/Mobile Devices, OMAP™, Semasa - Bekalan: 8µA, Voltan - Bekalan: 2.7V ~ 5.5V, Suhu Operasi: -40°C ~ 150°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-WFQFN Exposed Pad,
Permohonan: Energy Harvesting, Jenis Pemasangan: Surface Mount, Pakej / Kes: Module,
Permohonan: Thermoelectric Cooler, Semasa - Bekalan: 4mA, Voltan - Bekalan: 2.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-LQFP Exposed Pad,
Permohonan: Handheld/Mobile Devices, Semasa - Bekalan: 10µA, Voltan - Bekalan: 1.8V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-TSSOP (0.173", 4.40mm Width),
Permohonan: Energy Management Unit (EMU), Voltan - Bekalan: 3V ~ 5.5V, Suhu Operasi: -40°C ~ 70°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 36-WFQFN Exposed Pad,
Permohonan: Processor, Semasa - Bekalan: 60µA, Voltan - Bekalan: 2.7V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-WFQFN Exposed Pad,
Permohonan: Heating Controller, Voltan - Bekalan: 3.5V ~ 5.5V, Suhu Operasi: -20°C ~ 85°C (TA), Jenis Pemasangan: Through Hole, Pakej / Kes: 8-DIP (0.300", 7.62mm),
Jenis Pemasangan: Through Hole, Pakej / Kes: 8-DIP (0.300", 7.62mm),
Permohonan: Wireless Power Receiver, Suhu Operasi: -40°C ~ 85°C,
Permohonan: Wireless Power Receiver,
Permohonan: Pulse Generator, Semasa - Bekalan: 1A, Voltan - Bekalan: -60V ~ 60V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 56-VFQFN Exposed Pad,
Permohonan: Avionics Sensor, Low Side Driver, Semasa - Bekalan: 15mA, Voltan - Bekalan: 3V ~ 3.6V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 44-BQFP,