Permohonan: Heating Controller, Voltan - Bekalan: 3.5V ~ 5.5V, Suhu Operasi: -20°C ~ 85°C (TA), Jenis Pemasangan: Through Hole, Pakej / Kes: 8-DIP (0.300", 7.62mm),
Permohonan: Smart Iron Controller, Semasa - Bekalan: 400µA, Voltan - Bekalan: 4.5V ~ 5.5V, Suhu Operasi: -10°C ~ 85°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Permohonan: Heating Controller, Voltan - Bekalan: 3.5V ~ 5.5V, Suhu Operasi: -20°C ~ 85°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Permohonan: Heating Controller, Voltan - Bekalan: 4V ~ 5.5V, Suhu Operasi: -20°C ~ 85°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Permohonan: Heating Controller, Voltan - Bekalan: 4V ~ 5.5V, Suhu Operasi: -20°C ~ 85°C (TA), Jenis Pemasangan: Through Hole, Pakej / Kes: 8-DIP (0.300", 7.62mm),
Permohonan: Smart Iron Controller, Semasa - Bekalan: 400µA, Voltan - Bekalan: 4.5V ~ 5.5V, Suhu Operasi: -10°C ~ 85°C (TA), Jenis Pemasangan: Through Hole, Pakej / Kes: 8-DIP (0.300", 7.62mm),
Jenis Pemasangan: Through Hole, Pakej / Kes: 8-DIP (0.300", 7.62mm),
Permohonan: Processor, Semasa - Bekalan: 60µA, Voltan - Bekalan: 2.7V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-WFQFN Exposed Pad,
Permohonan: Handheld/Mobile Devices, Voltan - Bekalan: 2.5V ~ 6V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-WFQFN Exposed Pad,
Permohonan: Handheld/Mobile Devices, Voltan - Bekalan: 3V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 14-WFDFN Exposed Pad,
Permohonan: Digital Cores, Semasa - Bekalan: 60µA, Voltan - Bekalan: 2.7V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 24-WFQFN Exposed Pad,
Permohonan: Cellular, CDMA Handset, Voltan - Bekalan: 3V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 30-WFBGA,
Permohonan: Wireless Power Receiver, Jenis Pemasangan: Surface Mount, Pakej / Kes: 79-UFBGA, DSBGA,
Permohonan: Wireless Power Transmitter, Suhu Operasi: -40°C ~ 85°C,
Permohonan: Wireless Power Receiver, Suhu Operasi: 0°C ~ 85°C,
Permohonan: General Purpose, Semasa - Bekalan: 30µA, Voltan - Bekalan: 2V ~ 50V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-WFDFN Exposed Pad,
Permohonan: Handheld/Mobile Devices, Semasa - Bekalan: 220µA, Voltan - Bekalan: 2.5V ~ 80V, Suhu Operasi: 0°C ~ 70°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-WFDFN Exposed Pad,
Permohonan: Handheld/Mobile Devices, Semasa - Bekalan: 220µA, Voltan - Bekalan: 2.5V ~ 80V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-VFSOP (0.049", 1.25mm Width),
Permohonan: Automotive, Voltan - Bekalan: 6V ~ 36V, Suhu Operasi: -40°C ~ 175°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: Die,
Permohonan: Processor, Voltan - Bekalan: 2.7V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 81-VQFN Dual Rows, Exposed Pad,
Permohonan: Handheld/Mobile Devices, Voltan - Bekalan: 3.3V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-WFQFN Exposed Pad,
Permohonan: USB, Peripherals, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-VFQFN Exposed Pad,
