Garisan Kelewatan

GL2L5MS250D-C

GL2L5MS250D-C

bahagian bahagian: 2140

Masa Kelewatan: 2.5ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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GL2L5LS080D-C

GL2L5LS080D-C

bahagian bahagian: 2234

Masa Kelewatan: 800ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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CL1L5AT020L-T1

CL1L5AT020L-T1

bahagian bahagian: 2212

Masa Kelewatan: 200ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

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GL1L5MS260S-C

GL1L5MS260S-C

bahagian bahagian: 2222

Masa Kelewatan: 2.6ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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DS1L5DJ400S-C

DS1L5DJ400S-C

bahagian bahagian: 2160

Masa Kelewatan: 4.0ns, Toleransi: ±0.125nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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DS1L5VJ650S-C

DS1L5VJ650S-C

bahagian bahagian: 2130

Masa Kelewatan: 6.5ns, Toleransi: ±0.250nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL2L5LS070D-C

GL2L5LS070D-C

bahagian bahagian: 2149

Masa Kelewatan: 700ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL1L5MS290S-C

GL1L5MS290S-C

bahagian bahagian: 2108

Masa Kelewatan: 2.9ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL2L5MS400D-C

GL2L5MS400D-C

bahagian bahagian: 6271

Masa Kelewatan: 4.0ns, Toleransi: ±0.100nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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CL1L5AT014L-T1

CL1L5AT014L-T1

bahagian bahagian: 2198

Masa Kelewatan: 140ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

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GL1L5MS400S-C

GL1L5MS400S-C

bahagian bahagian: 2206

Masa Kelewatan: 4.0ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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GL1L5MS250S-C

GL1L5MS250S-C

bahagian bahagian: 2160

Masa Kelewatan: 2.5ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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CL1L5AT006L-T1

CL1L5AT006L-T1

bahagian bahagian: 2150

Masa Kelewatan: 60ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

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GL2L5MS150D-C

GL2L5MS150D-C

bahagian bahagian: 2123

Masa Kelewatan: 1.5ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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DS1L5VJ750S-C

DS1L5VJ750S-C

bahagian bahagian: 2171

Masa Kelewatan: 7.5ns, Toleransi: ±0.250nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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DS1L5DJ150S-C

DS1L5DJ150S-C

bahagian bahagian: 2116

Masa Kelewatan: 1.5ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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DS1L5DJ030S-C

DS1L5DJ030S-C

bahagian bahagian: 2215

Masa Kelewatan: 300ps, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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CL2LAAT006D-C-T1

CL2LAAT006D-C-T1

bahagian bahagian: 2178

Masa Kelewatan: 60ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

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GL1L5LS100S-C

GL1L5LS100S-C

bahagian bahagian: 2192

Masa Kelewatan: 1.0ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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GL2L5MS270D-C

GL2L5MS270D-C

bahagian bahagian: 2251

Masa Kelewatan: 2.7ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL1L5MS450S-C

GL1L5MS450S-C

bahagian bahagian: 2161

Masa Kelewatan: 4.5ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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CL1L5AT004L-T1

CL1L5AT004L-T1

bahagian bahagian: 6278

Masa Kelewatan: 40ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

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CL1L5AT022L-T1

CL1L5AT022L-T1

bahagian bahagian: 2149

Masa Kelewatan: 220ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

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DS1L5DJ065K-C

DS1L5DJ065K-C

bahagian bahagian: 2216

Masa Kelewatan: 650ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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CL2LAAT018D-C-T1

CL2LAAT018D-C-T1

bahagian bahagian: 2141

Masa Kelewatan: 180ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

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DS1L5VJ850S-C

DS1L5VJ850S-C

bahagian bahagian: 6235

Masa Kelewatan: 8.5ns, Toleransi: ±0.250nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL1L5LS040S-C

GL1L5LS040S-C

bahagian bahagian: 2150

Masa Kelewatan: 400ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL2L5LS050D-C

GL2L5LS050D-C

bahagian bahagian: 2140

Masa Kelewatan: 500ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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GL1L5MS480S-C

GL1L5MS480S-C

bahagian bahagian: 2218

Masa Kelewatan: 4.8ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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DS1L5DJ100K-C

DS1L5DJ100K-C

bahagian bahagian: 2180

Masa Kelewatan: 1.0ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL1L5MS130S-C

GL1L5MS130S-C

bahagian bahagian: 2187

Masa Kelewatan: 1.3ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL1L5MS310S-C

GL1L5MS310S-C

bahagian bahagian: 2179

Masa Kelewatan: 3.1ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL2L5MS350D-C

GL2L5MS350D-C

bahagian bahagian: 2169

Masa Kelewatan: 3.5ns, Toleransi: ±0.100nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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DS1L5DJ225S-C

DS1L5DJ225S-C

bahagian bahagian: 2146

Masa Kelewatan: 2.25ns, Toleransi: ±0.125nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL1L5MS470S-C

GL1L5MS470S-C

bahagian bahagian: 2186

Masa Kelewatan: 4.7ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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XDL09-9-224S

XDL09-9-224S

bahagian bahagian: 3755

Masa Kelewatan: 22.6ns, Toleransi: ±0.30nS, Jenis Pemasangan: Surface Mount, Pakej / Kes: Nonstandard, 4 Lead,

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