Garisan Kelewatan

GL1L5LS030S-C

GL1L5LS030S-C

bahagian bahagian: 2180

Masa Kelewatan: 300ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Bersenang-senang
DS1L5DJ055K-C

DS1L5DJ055K-C

bahagian bahagian: 2223

Masa Kelewatan: 550ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Bersenang-senang
GL2L5MS220D-C

GL2L5MS220D-C

bahagian bahagian: 2224

Masa Kelewatan: 2.2ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Bersenang-senang
GL1L5MS410S-C

GL1L5MS410S-C

bahagian bahagian: 2156

Masa Kelewatan: 4.1ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Bersenang-senang
GL1L5MS370S-C

GL1L5MS370S-C

bahagian bahagian: 9622

Masa Kelewatan: 3.7ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Bersenang-senang
DS1L5DJ375S-C

DS1L5DJ375S-C

bahagian bahagian: 9630

Masa Kelewatan: 3.75ns, Toleransi: ±0.125nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Bersenang-senang
DS1L5DJ110K-C

DS1L5DJ110K-C

bahagian bahagian: 2194

Masa Kelewatan: 1.1ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Bersenang-senang
GL1L5MS300S-C

GL1L5MS300S-C

bahagian bahagian: 2145

Masa Kelewatan: 3.0ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

Bersenang-senang
DS1L5DJ035K-C

DS1L5DJ035K-C

bahagian bahagian: 2181

Masa Kelewatan: 350ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Bersenang-senang
GL2L5MS230D-C

GL2L5MS230D-C

bahagian bahagian: 2224

Masa Kelewatan: 2.3ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Bersenang-senang
GL1L5MS330S-C

GL1L5MS330S-C

bahagian bahagian: 2202

Masa Kelewatan: 3.3ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Bersenang-senang
DS1L5DJ025K-C

DS1L5DJ025K-C

bahagian bahagian: 2170

Masa Kelewatan: 250ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Bersenang-senang
GL1L5LS080S-C

GL1L5LS080S-C

bahagian bahagian: 2204

Masa Kelewatan: 800ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Bersenang-senang
DS1L5DJ160S-C

DS1L5DJ160S-C

bahagian bahagian: 2184

Masa Kelewatan: 1.6ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Bersenang-senang
DS1L5DJ030K-C

DS1L5DJ030K-C

bahagian bahagian: 2172

Masa Kelewatan: 300ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Bersenang-senang
CL2LAAT008D-C-T1

CL2LAAT008D-C-T1

bahagian bahagian: 2187

Masa Kelewatan: 80ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

Bersenang-senang
DS1L5DJ300S-C

DS1L5DJ300S-C

bahagian bahagian: 6267

Masa Kelewatan: 3.0ns, Toleransi: ±0.125nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Bersenang-senang
DS1L5DJ090K-C

DS1L5DJ090K-C

bahagian bahagian: 2214

Masa Kelewatan: 900ps, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Bersenang-senang
GL2L5MS260D-C

GL2L5MS260D-C

bahagian bahagian: 2230

Masa Kelewatan: 2.6ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Bersenang-senang
GL1L5MS210S-C

GL1L5MS210S-C

bahagian bahagian: 6300

Masa Kelewatan: 2.1ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Bersenang-senang
CL2LAAT010D-C-T1

CL2LAAT010D-C-T1

bahagian bahagian: 2182

Masa Kelewatan: 100ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

Bersenang-senang
GL2L5MS300D-C

GL2L5MS300D-C

bahagian bahagian: 2234

Masa Kelewatan: 3.0ns, Toleransi: -0.5/+0.1 nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

Bersenang-senang
DS1L5DJ425S-C

DS1L5DJ425S-C

bahagian bahagian: 2196

Masa Kelewatan: 4.25ns, Toleransi: ±0.125nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Bersenang-senang
DS1L5DJ180S-C

DS1L5DJ180S-C

bahagian bahagian: 2192

Masa Kelewatan: 1.8ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Bersenang-senang
GL1L5MS360S-C

GL1L5MS360S-C

bahagian bahagian: 2200

Masa Kelewatan: 3.6ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Bersenang-senang
GL1L5MS430S-C

GL1L5MS430S-C

bahagian bahagian: 2205

Masa Kelewatan: 4.3ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Bersenang-senang
DS1L5DJ140S-C

DS1L5DJ140S-C

bahagian bahagian: 2215

Masa Kelewatan: 1.4ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Bersenang-senang
DS1L5VJ550S-C

DS1L5VJ550S-C

bahagian bahagian: 2187

Masa Kelewatan: 5.5ns, Toleransi: ±0.250nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Bersenang-senang
DS1L5DJ080S-C

DS1L5DJ080S-C

bahagian bahagian: 2210

Masa Kelewatan: 800ps, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Bersenang-senang
GL1L5MS490S-C

GL1L5MS490S-C

bahagian bahagian: 2191

Masa Kelewatan: 4.9ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Bersenang-senang
GL1L5MS440S-C

GL1L5MS440S-C

bahagian bahagian: 2156

Masa Kelewatan: 4.4ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Bersenang-senang
DS1L5DJ110S-C

DS1L5DJ110S-C

bahagian bahagian: 2143

Masa Kelewatan: 1.1ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Bersenang-senang
GL1L5MS180S-C

GL1L5MS180S-C

bahagian bahagian: 2163

Masa Kelewatan: 1.8ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Bersenang-senang
GL2L5MS180D-C

GL2L5MS180D-C

bahagian bahagian: 2233

Masa Kelewatan: 1.8ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Bersenang-senang
XDL20-7-115S

XDL20-7-115S

bahagian bahagian: 8179

Masa Kelewatan: 11.45ns, Toleransi: ±0.20nS, Suhu Operasi: -55°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: Nonstandard, 4 Lead,

Bersenang-senang
XDL20-8-140S

XDL20-8-140S

bahagian bahagian: 6417

Masa Kelewatan: 13.9ns, Toleransi: ±0.28nS, Suhu Operasi: -55°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: Nonstandard, 4 Lead,

Bersenang-senang