Pateri | Produk Pematerian, Pematrian, Pengerjaan Semula | 6

SMDSWLF.020 1LB

bahagian bahagian: 148

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.020" (0.51mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,

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Chip Quik Inc.

SMD2SWLF.015 1OZ

bahagian bahagian: 270

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.015" (0.38mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble,

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Chip Quik Inc.

SMDIN52SN48

bahagian bahagian: 598

Jenis: Wire Solder, Komposisi: In52Sn48 (52/48), Diameter: 0.031" (0.79mm), Takat lebur: 244°F (118°C), Wire Gauge: 20 AWG, 21 SWG,

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Chip Quik Inc.

SMD3SW.031 2OZ

bahagian bahagian: 370

Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.031" (0.79mm), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean, Water Soluble,

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Chip Quik Inc.

SMD2170

bahagian bahagian: 87

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.014" (0.36mm), Takat lebur: 361°F (183°C),

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Chip Quik Inc.

SMD291SNL500T3C

bahagian bahagian: 710

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

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Chip Quik Inc.

SMD2060

bahagian bahagian: 762

Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.030" (0.76mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),

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Chip Quik Inc.

SMDSWLF.020 8OZ

bahagian bahagian: 261

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.020" (0.51mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,

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Chip Quik Inc.

TS391SNL250

bahagian bahagian: 80

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

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Chip Quik Inc.

TS391SNL10

bahagian bahagian: 209

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

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Chip Quik Inc.

SMDSWLF.031 8OZ

bahagian bahagian: 367

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 22 SWG,

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Chip Quik Inc.

SMD2190

bahagian bahagian: 886

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C),

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Chip Quik Inc.

SMD4300AX500T4C

bahagian bahagian: 788

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

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Chip Quik Inc.

SMD291SNL15T4

bahagian bahagian: 3588

Jenis: Solder Paste, Two Part Mix, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

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Chip Quik Inc.

TS391SNL

bahagian bahagian: 647

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

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Chip Quik Inc.

TS391LT250

bahagian bahagian: 136

Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

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Chip Quik Inc.

SMDSWLF.020 .4OZ

bahagian bahagian: 1771

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.020" (0.51mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,

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Chip Quik Inc.

SMD4300AX250T5

bahagian bahagian: 820

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

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Chip Quik Inc.

SMD2028-25000

bahagian bahagian: 68

Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.014" (0.36mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),

Senarai harapan

Chip Quik Inc.

SMD4300SNL500T3C

bahagian bahagian: 707

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: Water Soluble,

Senarai harapan

Chip Quik Inc.

SMD2SWLF.020 1OZ

bahagian bahagian: 314

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.020" (0.51mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble,

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Chip Quik Inc.

SMDAL200

bahagian bahagian: 78

Jenis: Solder Paste, Komposisi: Sn96.5Ag3.5 (96.5/3.5), Takat lebur: 430°F (221°C), Jenis Flux: Water Soluble,

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Chip Quik Inc.

SMD2024

bahagian bahagian: 79

Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.012" (0.31mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),

Senarai harapan

Chip Quik Inc.

SMDSWLF.031 1LB

bahagian bahagian: 185

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 22 SWG,

Senarai harapan

Chip Quik Inc.

SMD291AX10T5

bahagian bahagian: 2453

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

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