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Pateri

SMD2SWLF.031 .7OZ
Chip Quik Inc.

SMD2SWLF.031 .7OZ

bahagian bahagian: 677

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
SMDLTLFP500T3
Chip Quik Inc.

SMDLTLFP500T3

bahagian bahagian: 668

Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

Senarai harapan
SMD2140
Chip Quik Inc.

SMD2140

bahagian bahagian: 125

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.008" (0.20mm), Takat lebur: 361°F (183°C),

Senarai harapan
TS391SNL50
Chip Quik Inc.

TS391SNL50

bahagian bahagian: 996

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

Senarai harapan
SMD2200-25000
Chip Quik Inc.

SMD2200-25000

bahagian bahagian: 2778

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.024" (0.61mm), Takat lebur: 361°F (183°C),

Senarai harapan
SMD2SWLF.015 4OZ
Chip Quik Inc.

SMD2SWLF.015 4OZ

bahagian bahagian: 349

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.015" (0.38mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble,

Senarai harapan
SMDSWLF.015 8OZ
Chip Quik Inc.

SMDSWLF.015 8OZ

bahagian bahagian: 297

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
SMD2SWLF.031 4OZ
Chip Quik Inc.

SMD2SWLF.031 4OZ

bahagian bahagian: 323

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble,

Senarai harapan
SMD2215
Chip Quik Inc.

SMD2215

bahagian bahagian: 938

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.030" (0.76mm), Takat lebur: 361°F (183°C),

Senarai harapan
SMDIN97AG3
Chip Quik Inc.

SMDIN97AG3

bahagian bahagian: 250

Jenis: Wire Solder, Komposisi: In97Ag3 (97/3), Diameter: 0.031" (0.79mm), Takat lebur: 289°F (143°C), Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
SMDSWLTLFP32
Chip Quik Inc.

SMDSWLTLFP32

bahagian bahagian: 1985

Jenis: Wire Solder, Komposisi: Bi57Sn42Ag1 (57/42/1), Diameter: 0.030" (0.76mm), Takat lebur: 281°F (138°C), Wire Gauge: 21 AWG, 22 SWG,

Senarai harapan
SMD2190-25000
Chip Quik Inc.

SMD2190-25000

bahagian bahagian: 2704

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C),

Senarai harapan
SMDSW.031 .7OZ
Chip Quik Inc.

SMDSW.031 .7OZ

bahagian bahagian: 594

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
SMDLTLFP500T3C
Chip Quik Inc.

SMDLTLFP500T3C

bahagian bahagian: 618

Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

Senarai harapan
SMDLTLFP500T5C
Chip Quik Inc.

SMDLTLFP500T5C

bahagian bahagian: 422

Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

Senarai harapan
TS391AX250
Chip Quik Inc.

TS391AX250

bahagian bahagian: 185

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Senarai harapan
SMD291SNL250T4
Chip Quik Inc.

SMD291SNL250T4

bahagian bahagian: 1172

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

Senarai harapan
SMD4300AX250T4
Chip Quik Inc.

SMD4300AX250T4

bahagian bahagian: 1419

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Senarai harapan
SMD291SNL500T3
Chip Quik Inc.

SMD291SNL500T3

bahagian bahagian: 761

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

Senarai harapan
SMD3SW.020 1OZ
Chip Quik Inc.

SMD3SW.020 1OZ

bahagian bahagian: 311

Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.020" (0.51mm), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean, Water Soluble,

Senarai harapan
SMD2032-25000
Chip Quik Inc.

SMD2032-25000

bahagian bahagian: 101

Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.016" (0.40mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),

Senarai harapan
SMDLTLFP10
Chip Quik Inc.

SMDLTLFP10

bahagian bahagian: 3393

Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

Senarai harapan
SMD4300SNL250T3
Chip Quik Inc.

SMD4300SNL250T3

bahagian bahagian: 1403

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: Water Soluble,

Senarai harapan
SMD291AX500T3
Chip Quik Inc.

SMD291AX500T3

bahagian bahagian: 999

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Senarai harapan
SMD2036-25000
Chip Quik Inc.

SMD2036-25000

bahagian bahagian: 65

Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.018" (0.46mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),

Senarai harapan
SMD291AX10T4
Chip Quik Inc.

SMD291AX10T4

bahagian bahagian: 3017

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Senarai harapan
SMD2016-25000
Chip Quik Inc.

SMD2016-25000

bahagian bahagian: 122

Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.008" (0.20mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),

Senarai harapan
SMDSWLF.031 1OZ
Chip Quik Inc.

SMDSWLF.031 1OZ

bahagian bahagian: 10157

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 22 SWG,

Senarai harapan
SMD2165
Chip Quik Inc.

SMD2165

bahagian bahagian: 780

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.012" (0.31mm), Takat lebur: 361°F (183°C),

Senarai harapan
SMD2SWLF.031 2OZ
Chip Quik Inc.

SMD2SWLF.031 2OZ

bahagian bahagian: 316

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble,

Senarai harapan
SMD2SWLF.015 2OZ
Chip Quik Inc.

SMD2SWLF.015 2OZ

bahagian bahagian: 295

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.015" (0.38mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble,

Senarai harapan
SMD291AX50T3
Chip Quik Inc.

SMD291AX50T3

bahagian bahagian: 5735

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Senarai harapan
SMD4300AX500T5C
Chip Quik Inc.

SMD4300AX500T5C

bahagian bahagian: 504

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Senarai harapan
SMDSWLF.031 .7OZ
Chip Quik Inc.

SMDSWLF.031 .7OZ

bahagian bahagian: 661

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
SMDSW.031 1OZ
Chip Quik Inc.

SMDSW.031 1OZ

bahagian bahagian: 15756

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 22 SWG,

Senarai harapan
SMD2050
Chip Quik Inc.

SMD2050

bahagian bahagian: 740

Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.024" (0.61mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),

Senarai harapan