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Pateri

70-1506-1510
Kester Solder

70-1506-1510

bahagian bahagian: 9260

Jenis: Solder Paste, Komposisi: Sn96.3Ag3.7 (96.3/3.7), Takat lebur: 430 ~ 444°F (221 ~ 223°C), Jenis Flux: No-Clean,

Senarai harapan
70-2102-0518
Kester Solder

70-2102-0518

bahagian bahagian: 9190

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Senarai harapan
70-1003-0618
Kester Solder

70-1003-0618

bahagian bahagian: 9184

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Senarai harapan
70-0102-0518
Kester Solder

70-0102-0518

bahagian bahagian: 9227

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Senarai harapan
70-1903-0819
Kester Solder

70-1903-0819

bahagian bahagian: 9230

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Senarai harapan
70-3205-1812
Kester Solder

70-3205-1812

bahagian bahagian: 9230

Jenis: Solder Paste, Komposisi: Sn99Cu0.7Ag0.3 (99/0.7/0.3), Jenis Flux: No-Clean,

Senarai harapan
70-1903-0911
Kester Solder

70-1903-0911

bahagian bahagian: 9164

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Senarai harapan
70-0605-0819
Kester Solder

70-0605-0819

bahagian bahagian: 9205

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Senarai harapan
70-0403-0824
Kester Solder

70-0403-0824

bahagian bahagian: 9191

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Senarai harapan
70-1903-0811
Kester Solder

70-1903-0811

bahagian bahagian: 9165

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Senarai harapan
70-3205-0819
Kester Solder

70-3205-0819

bahagian bahagian: 9236

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Senarai harapan
70-2002-0611
Kester Solder

70-2002-0611

bahagian bahagian: 9229

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Senarai harapan
70-2002-0511
Kester Solder

70-2002-0511

bahagian bahagian: 9185

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Senarai harapan
70-4021-0819
Kester Solder

70-4021-0819

bahagian bahagian: 9238

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Senarai harapan
70-4105-0819
Kester Solder

70-4105-0819

bahagian bahagian: 9173

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Senarai harapan
70-0102-0519
Kester Solder

70-0102-0519

bahagian bahagian: 9169

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Senarai harapan
70-4105-0919
Kester Solder

70-4105-0919

bahagian bahagian: 9186

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Senarai harapan
70-4021-0919
Kester Solder

70-4021-0919

bahagian bahagian: 9179

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Senarai harapan
70-0202-0519
Kester Solder

70-0202-0519

bahagian bahagian: 9199

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Senarai harapan
70-1003-0519
Kester Solder

70-1003-0519

bahagian bahagian: 9235

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Senarai harapan
70-2102-0311
Kester Solder

70-2102-0311

bahagian bahagian: 9157

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: Water Soluble,

Senarai harapan
70-0605-0911
Kester Solder

70-0605-0911

bahagian bahagian: 9241

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Senarai harapan
70-4006-2011
Kester Solder

70-4006-2011

bahagian bahagian: 9208

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Senarai harapan
70-0306-0810
Kester Solder

70-0306-0810

bahagian bahagian: 9160

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Senarai harapan
70-2102-0519
Kester Solder

70-2102-0519

bahagian bahagian: 9199

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Senarai harapan
70-1002-0311
Kester Solder

70-1002-0311

bahagian bahagian: 9237

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: Water Soluble,

Senarai harapan
70-0102-0411
Kester Solder

70-0102-0411

bahagian bahagian: 9160

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean,

Senarai harapan
70-1302-0511
Kester Solder

70-1302-0511

bahagian bahagian: 9249

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA),

Senarai harapan
70-4006-2010
Kester Solder

70-4006-2010

bahagian bahagian: 9189

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Senarai harapan
70-0403-0910
Kester Solder

70-0403-0910

bahagian bahagian: 9157

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Senarai harapan
70-0403-0923
Kester Solder

70-0403-0923

bahagian bahagian: 9223

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Senarai harapan
70-0605-0811
Kester Solder

70-0605-0811

bahagian bahagian: 6972

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Senarai harapan
70-0202-0311
Kester Solder

70-0202-0311

bahagian bahagian: 5757

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean,

Senarai harapan
70-2102-0611
Kester Solder

70-2102-0611

bahagian bahagian: 9239

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Senarai harapan
70-3213-0811
Kester Solder

70-3213-0811

bahagian bahagian: 9174

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Senarai harapan
70-4102-0611
Kester Solder

70-4102-0611

bahagian bahagian: 9199

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Senarai harapan