Jenis: Wire Solder, Komposisi: Sn95.8Ag3.5Cu0.7 (95.8/3.5/0.7), Diameter: 0.010" (0.25mm), Jenis Flux: No-Clean, Wire Gauge: 30 AWG, 33 SWG,
Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean, Wire Gauge: 27 AWG, 28 SWG,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.040" (1.02mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 18 AWG, 19 SWG,
Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.010" (0.25mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: No-Clean, Wire Gauge: 30 AWG, 33 SWG,
Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.050" (1.27mm), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,
Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.020" (0.51mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean, Wire Gauge: 24 AWG, 25 SWG,
Jenis: Wire Solder, Komposisi: Sn95Sb5 (95/5), Diameter: 0.025" (0.64mm), Takat lebur: 450 ~ 464°F (232 ~ 240°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 22 AWG, 23 SWG,
Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.010" (0.25mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean, Wire Gauge: 30 AWG, 33 SWG,
Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.040" (1.02mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: No-Clean, Wire Gauge: 18 AWG, 19 SWG,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 27 AWG, 28 SWG,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 24 AWG, 25 SWG,
Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.031" (0.79mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 22 SWG,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.025" (0.64mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 22 AWG, 23 SWG,
Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.010" (0.25mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble, Wire Gauge: 30 AWG, 33 SWG,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble, Wire Gauge: 24 AWG, 25 SWG,
Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.025" (0.64mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Wire Gauge: 22 AWG, 23 SWG,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.025" (0.64mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 22 AWG, 23 SWG,
Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.040" (1.02mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Wire Gauge: 18 AWG, 19 SWG,
Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.047" (1.19mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Wire Gauge: 17 AWG, 18 SWG,
Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 22 SWG,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 20 AWG, 22 SWG,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.062" (1.57mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 14 AWG, 16 SWG,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 22 SWG,
