Pateri

24-9574-6417

24-9574-6417

bahagian bahagian: 1625

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.025" (0.64mm), Takat lebur: 441°F (227°C), Jenis Flux: Water Soluble, Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
24-9574-7613

24-9574-7613

bahagian bahagian: 1703

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.050" (1.27mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
24-9574-1404

24-9574-1404

bahagian bahagian: 1783

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.050" (1.27mm), Takat lebur: 441°F (227°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
24-9574-6403

24-9574-6403

bahagian bahagian: 1620

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Takat lebur: 441°F (227°C), Jenis Flux: Water Soluble, Wire Gauge: 20 AWG, 22 SWG,

Senarai harapan
24-7150-0018

24-7150-0018

bahagian bahagian: 128

Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.025" (0.64mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
24-9574-1401

24-9574-1401

bahagian bahagian: 1367

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.020" (0.51mm), Takat lebur: 441°F (227°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 24 AWG, 25 SWG,

Senarai harapan
24-6337-7612

24-6337-7612

bahagian bahagian: 1553

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.050" (1.27mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
24-6337-7602

24-6337-7602

bahagian bahagian: 1611

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 24 AWG, 25 SWG,

Senarai harapan
24-6337-7600

24-6337-7600

bahagian bahagian: 2077

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 22 SWG,

Senarai harapan
24-9574-1406

24-9574-1406

bahagian bahagian: 1599

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.025" (0.64mm), Takat lebur: 441°F (227°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
24-6337-7604

24-6337-7604

bahagian bahagian: 1495

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
24-6337-9744

24-6337-9744

bahagian bahagian: 95

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.010" (0.25mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 30 AWG, 33 SWG,

Senarai harapan
24-7068-1405

24-7068-1405

bahagian bahagian: 176

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.040" (1.02mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 18 AWG, 19 SWG,

Senarai harapan
24-6337-9727

24-6337-9727

bahagian bahagian: 179

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
24-6040-9718

24-6040-9718

bahagian bahagian: 176

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.025" (0.64mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
24-7068-9716

24-7068-9716

bahagian bahagian: 179

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.040" (1.02mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 18 AWG, 19 SWG,

Senarai harapan
24-7068-7618

24-7068-7618

bahagian bahagian: 153

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 22 SWG,

Senarai harapan
24-7150-9727

24-7150-9727

bahagian bahagian: 121

Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.015" (0.38mm), Takat lebur: 354°F (179°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
24-6337-9715

24-6337-9715

bahagian bahagian: 206

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.050" (1.27mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
24-6040-9702

24-6040-9702

bahagian bahagian: 171

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.020" (0.51mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 24 AWG, 25 SWG,

Senarai harapan
24-7068-7609

24-7068-7609

bahagian bahagian: 155

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean, Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
24-6337-9717

24-6337-9717

bahagian bahagian: 136

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.025" (0.64mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
24-7150-9703

24-7150-9703

bahagian bahagian: 183

Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.015" (0.38mm), Takat lebur: 354°F (179°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
24-7150-9702

24-7150-9702

bahagian bahagian: 200

Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.020" (0.51mm), Jenis Flux: Rosin Activated (RA),

Senarai harapan
24-9574-1400

24-9574-1400

bahagian bahagian: 1733

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.062" (1.57mm), Takat lebur: 441°F (227°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
24-6040-9711

24-6040-9711

bahagian bahagian: 137

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.062" (1.57mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
24-6337-8813

24-6337-8813

bahagian bahagian: 1118

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.040" (1.02mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 18 AWG, 19 SWG,

Senarai harapan
24-6040-9710

24-6040-9710

bahagian bahagian: 187

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.031" (0.79mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 20 AWG, 22 SWG,

Senarai harapan
24-7068-7608

24-7068-7608

bahagian bahagian: 936

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean, Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
24-7068-7623

24-7068-7623

bahagian bahagian: 206

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.010" (0.25mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean, Wire Gauge: 30 AWG, 33 SWG,

Senarai harapan
24-6337-9716

24-6337-9716

bahagian bahagian: 223

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.040" (1.02mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 18 AWG, 19 SWG,

Senarai harapan
24-6040-9721

24-6040-9721

bahagian bahagian: 148

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.062" (1.57mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
24-7068-6411

24-7068-6411

bahagian bahagian: 737

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.062" (1.57mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble, Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
24-6337-9746

24-6337-9746

bahagian bahagian: 240

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.025" (0.64mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
24-6040-9713

24-6040-9713

bahagian bahagian: 180

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.031" (0.79mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 20 AWG, 22 SWG,

Senarai harapan
24-7150-9710

24-7150-9710

bahagian bahagian: 202

Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.031" (0.79mm), Takat lebur: 354°F (179°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 20 AWG, 22 SWG,

Senarai harapan