Pateri

24-6337-8807

24-6337-8807

bahagian bahagian: 1246

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 24 AWG, 25 SWG,

Senarai harapan
27-7080-0661

27-7080-0661

bahagian bahagian: 6985

Jenis: Wire Solder, Komposisi: Sn95Sb5 (95/5), Diameter: 0.062" (1.57mm), Takat lebur: 450 ~ 464°F (232 ~ 240°C), Jenis Flux: Water Soluble, Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
24-6040-0066

24-6040-0066

bahagian bahagian: 432

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.093" (2.36mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 11 AWG, 13 SWG,

Senarai harapan
24-9574-1402

24-9574-1402

bahagian bahagian: 1566

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Takat lebur: 441°F (227°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 22 SWG,

Senarai harapan
28-5050-2437

28-5050-2437

bahagian bahagian: 9228

Jenis: Wire Solder, Komposisi: Sn50Pb50 (50/50), Diameter: 0.125" (3.18mm), Takat lebur: 361 ~ 420°F (183 ~ 216°C), Jenis Flux: Acid Cored, Wire Gauge: 8 AWG, 10 SWG,

Senarai harapan
28-6040-0053

28-6040-0053

bahagian bahagian: 9244

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.050" (1.27mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
24-9574-7618

24-9574-7618

bahagian bahagian: 1670

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 22 SWG,

Senarai harapan
24-7068-7606

24-7068-7606

bahagian bahagian: 755

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.050" (1.27mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
24-6337-0061

24-6337-0061

bahagian bahagian: 1709

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.062" (1.57mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
24-7068-1400

24-7068-1400

bahagian bahagian: 800

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.062" (1.57mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
24-6040-0053

24-6040-0053

bahagian bahagian: 1771

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.050" (1.27mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
24-7068-7607

24-7068-7607

bahagian bahagian: 816

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.062" (1.57mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean, Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
24-6337-0018

24-6337-0018

bahagian bahagian: 1518

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.025" (0.64mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
24-6337-8834

24-6337-8834

bahagian bahagian: 1159

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 24 AWG, 25 SWG,

Senarai harapan
24-6337-8809

24-6337-8809

bahagian bahagian: 1504

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.025" (0.64mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
28-6040-0061

28-6040-0061

bahagian bahagian: 9200

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.062" (1.57mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
24-7068-6401

24-7068-6401

bahagian bahagian: 727

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.020" (0.51mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble, Wire Gauge: 24 AWG, 25 SWG,

Senarai harapan
24-6337-9702

24-6337-9702

bahagian bahagian: 1730

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 24 AWG, 25 SWG,

Senarai harapan
24-9574-7609

24-9574-7609

bahagian bahagian: 1265

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.015" (0.38mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
24-6337-0010

24-6337-0010

bahagian bahagian: 1375

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 24 AWG, 25 SWG,

Senarai harapan
24-6040-0010

24-6040-0010

bahagian bahagian: 1231

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.020" (0.51mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 24 AWG, 25 SWG,

Senarai harapan
24-6337-8802

24-6337-8802

bahagian bahagian: 1581

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 22 SWG,

Senarai harapan
22-9574-0079

22-9574-0079

bahagian bahagian: 9193

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.079" (2.01mm), Takat lebur: 441°F (227°C), Wire Gauge: 12 AWG, 14 SWG,

Senarai harapan
24-6337-0007

24-6337-0007

bahagian bahagian: 1102

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
26-5050-9602

26-5050-9602

bahagian bahagian: 9191

Jenis: Wire Solder, Komposisi: Sn50Pb50 (50/50), Diameter: 0.093" (2.36mm), Takat lebur: 361 ~ 420°F (183 ~ 216°C), Wire Gauge: 11 AWG, 13 SWG,

Senarai harapan
24-6337-8814

24-6337-8814

bahagian bahagian: 1651

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.050" (1.27mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
24-6040-0039

24-6040-0039

bahagian bahagian: 1690

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.040" (1.02mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 18 AWG, 19 SWG,

Senarai harapan
24-6337-6422

24-6337-6422

bahagian bahagian: 1057

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble, Wire Gauge: 27 AWG, 28 SWG,

Senarai harapan
25-7080-0025

25-7080-0025

bahagian bahagian: 9278

Jenis: Wire Solder, Komposisi: Sn95Sb5 (95/5), Diameter: 0.031" (0.79mm), Takat lebur: 450 ~ 464°F (232 ~ 240°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 22 SWG,

Senarai harapan
24-7068-1406

24-7068-1406

bahagian bahagian: 659

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.025" (0.64mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
24-6337-6401

24-6337-6401

bahagian bahagian: 1191

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble, Wire Gauge: 24 AWG, 25 SWG,

Senarai harapan
25-7080-0069

25-7080-0069

bahagian bahagian: 9196

Jenis: Wire Solder, Komposisi: Sn95Sb5 (95/5), Diameter: 0.125" (3.18mm), Takat lebur: 450 ~ 464°F (232 ~ 240°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 8 AWG, 10 SWG,

Senarai harapan
25-7068-7610

25-7068-7610

bahagian bahagian: 9254

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.020" (0.51mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean, Wire Gauge: 24 AWG, 25 SWG,

Senarai harapan
25-7070-6411

25-7070-6411

bahagian bahagian: 9267

Jenis: Wire Solder, Komposisi: Sn95Ag5 (95/5), Diameter: 0.062" (1.57mm), Takat lebur: 430 ~ 473°F (221 ~ 245°C), Jenis Flux: Water Soluble, Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan
24-7068-6403

24-7068-6403

bahagian bahagian: 737

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble, Wire Gauge: 20 AWG, 22 SWG,

Senarai harapan
26-6040-8227

26-6040-8227

bahagian bahagian: 9273

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.062" (1.57mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 14 AWG, 16 SWG,

Senarai harapan