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Pateri

4944-454G
MG Chemicals

4944-454G

bahagian bahagian: 1303

Jenis: Wire Solder, Komposisi: Sn99.5Cu0.5 (99.5/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 442°F (228°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
4875-454G
MG Chemicals

4875-454G

bahagian bahagian: 1645

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.032" (0.81mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
4895-454G
MG Chemicals

4895-454G

bahagian bahagian: 1623

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.032" (0.81mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
4916-112G
MG Chemicals

4916-112G

bahagian bahagian: 2208

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.050" (1.27mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
4942-112G
MG Chemicals

4942-112G

bahagian bahagian: 3443

Jenis: Wire Solder, Komposisi: Sn99.5Cu0.5 (99.5/0.5), Diameter: 0.020" (0.51mm), Takat lebur: 442°F (228°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 24 AWG, 25 SWG,

Senarai harapan
4884-454G
MG Chemicals

4884-454G

bahagian bahagian: 1647

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.025" (0.64mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
4896-227G
MG Chemicals

4896-227G

bahagian bahagian: 2595

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.040" (1.02mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 18 AWG, 19 SWG,

Senarai harapan
4894-227G
MG Chemicals

4894-227G

bahagian bahagian: 2576

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.025" (0.64mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
4886-227G
MG Chemicals

4886-227G

bahagian bahagian: 2586

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.040" (1.02mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 18 AWG, 19 SWG,

Senarai harapan
4895-227G
MG Chemicals

4895-227G

bahagian bahagian: 2573

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.032" (0.81mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
4915-112G
MG Chemicals

4915-112G

bahagian bahagian: 2219

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.040" (1.02mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean, Wire Gauge: 18 AWG, 19 SWG,

Senarai harapan
4935-112G
MG Chemicals

4935-112G

bahagian bahagian: 3734

Jenis: Wire Solder, Komposisi: Sn99.5Cu0.5 (99.5/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 442°F (228°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
4884-227G
MG Chemicals

4884-227G

bahagian bahagian: 2594

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.025" (0.64mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 22 AWG, 23 SWG,

Senarai harapan
4900-112G
MG Chemicals

4900-112G

bahagian bahagian: 2154

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
4901-112G
MG Chemicals

4901-112G

bahagian bahagian: 3081

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.032" (0.81mm), Takat lebur: 442°F (227°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
4865-454G
MG Chemicals

4865-454G

bahagian bahagian: 1668

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
4900P-25G
MG Chemicals

4900P-25G

bahagian bahagian: 2572

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean,

Senarai harapan
4902P-15G
MG Chemicals

4902P-15G

bahagian bahagian: 4044

Jenis: Solder Paste, Komposisi: Bi57Sn42Ag1 (57/42/1), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

Senarai harapan
4944-112G
MG Chemicals

4944-112G

bahagian bahagian: 3750

Jenis: Wire Solder, Komposisi: Sn99.5Cu0.5 (99.5/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 442°F (228°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
4880-18G
MG Chemicals

4880-18G

bahagian bahagian: 15576

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
4901-227G
MG Chemicals

4901-227G

bahagian bahagian: 1823

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.032" (0.81mm), Takat lebur: 442°F (227°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
4860-18G
MG Chemicals

4860-18G

bahagian bahagian: 18104

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
4901-454G
MG Chemicals

4901-454G

bahagian bahagian: 1183

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.032" (0.81mm), Takat lebur: 442°F (227°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
4900-35G
MG Chemicals

4900-35G

bahagian bahagian: 12135

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
4890-18G
MG Chemicals

4890-18G

bahagian bahagian: 15610

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.032" (0.81mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
4870-18G
MG Chemicals

4870-18G

bahagian bahagian: 15530

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.032" (0.81mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Senarai harapan
4877-227G
MG Chemicals

4877-227G

bahagian bahagian: 9099

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.050" (1.27mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
4867-227G
MG Chemicals

4867-227G

bahagian bahagian: 6949

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.050" (1.27mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,

Senarai harapan
4866-227G
MG Chemicals

4866-227G

bahagian bahagian: 6971

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.040" (1.02mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 18 AWG, 19 SWG,

Senarai harapan
4901-2LB
MG Chemicals

4901-2LB

bahagian bahagian: 9113

Jenis: Bar Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Takat lebur: 442°F (227°C), Jenis Flux: No-Clean,

Senarai harapan