Jenis: Wire Solder, Komposisi: Sn99.5Cu0.5 (99.5/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 442°F (228°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,
Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.050" (1.27mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 16 AWG, 18 SWG,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble, Wire Gauge: 20 AWG, 21 SWG,
Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.062" (1.57mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 14 AWG, 16 SWG,
Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.040" (1.02mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: No-Clean, Wire Gauge: 18 AWG, 19 SWG,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.040" (1.02mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 18 AWG, 19 SWG,
Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.040" (1.02mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 18 AWG, 19 SWG,
Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.040" (1.02mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean, Wire Gauge: 18 AWG, 19 SWG,
Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,
Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.025" (0.64mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 22 AWG, 23 SWG,
Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.050" (1.27mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.050" (1.27mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 16 AWG, 18 SWG,
Jenis: Wire Solder, Komposisi: Sn99.5Cu0.5 (99.5/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 442°F (228°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,
Jenis: Wire Solder, Komposisi: Sn99.5Cu0.5 (99.5/0.5), Diameter: 0.020" (0.51mm), Takat lebur: 442°F (228°C), Jenis Flux: No-Clean, Wire Gauge: 24 AWG, 25 SWG,
Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,
Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.040" (1.02mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 18 AWG, 19 SWG,
Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.062" (1.57mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 14 AWG, 16 SWG,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,
Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.020" (0.51mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean, Wire Gauge: 24 AWG, 25 SWG,
Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.032" (0.81mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,
Jenis: Solder Paste, Komposisi: Bi57Sn42Ag1 (57/42/1), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,
Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.062" (1.57mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean, Wire Gauge: 14 AWG, 16 SWG,
