Soket untuk IC, Transistor | Penyambung, Sambungan | 100

28-0518-11

bahagian bahagian: 19079

Jenis: SIP, Bilangan Kedudukan atau Pin (Grid): 28 (1 x 28), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

28-1518-11

bahagian bahagian: 19130

Jenis: DIP, 0.2" (5.08mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 28 (2 x 14), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

28-6513-10

bahagian bahagian: 19549

Jenis: DIP, 0.6" (15.24mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 28 (2 x 14), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

27-0518-11

bahagian bahagian: 19697

Jenis: SIP, Bilangan Kedudukan atau Pin (Grid): 27 (1 x 27), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

20-0513-10H

bahagian bahagian: 19631

Jenis: SIP, Bilangan Kedudukan atau Pin (Grid): 20 (1 x 20), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

20-9513-10T

bahagian bahagian: 20133

Jenis: DIP, 0.9" (22.86mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 20 (2 x 10), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

20-4518-10H

bahagian bahagian: 20183

Jenis: DIP, 0.4" (10.16mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 20 (2 x 10), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

20-3518-10H

bahagian bahagian: 20095

Jenis: DIP, 0.3" (7.62mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 20 (2 x 10), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

26-3513-10T

bahagian bahagian: 20283

Jenis: DIP, 0.3" (7.62mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 26 (2 x 13), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

26-0518-11

bahagian bahagian: 20352

Jenis: SIP, Bilangan Kedudukan atau Pin (Grid): 26 (1 x 26), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

26-1518-11

bahagian bahagian: 20482

Jenis: DIP, 0.2" (5.08mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 26 (2 x 13), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

28-6518-00

bahagian bahagian: 20914

Jenis: DIP, 0.6" (15.24mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 28 (2 x 14), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

24-6513-10

bahagian bahagian: 21057

Jenis: DIP, 0.6" (15.24mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 24 (2 x 12), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

25-0518-11

bahagian bahagian: 21134

Jenis: SIP, Bilangan Kedudukan atau Pin (Grid): 25 (1 x 25), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

Senarai harapan

Aries Electronics

24-4518-10

bahagian bahagian: 21247

Jenis: DIP, 0.4" (10.16mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 24 (2 x 12), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

Senarai harapan

Aries Electronics

24-3513-10

bahagian bahagian: 21420

Jenis: DIP, 0.3" (7.62mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 24 (2 x 12), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

28-6513-10T

bahagian bahagian: 21618

Jenis: DIP, 0.6" (15.24mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 28 (2 x 14), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

Senarai harapan

Aries Electronics

20-4518-11

bahagian bahagian: 21847

Jenis: DIP, 0.4" (10.16mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 20 (2 x 10), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

Senarai harapan

Aries Electronics

22-6513-10

bahagian bahagian: 22053

Jenis: DIP, 0.6" (15.24mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 22 (2 x 11), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

Senarai harapan

Aries Electronics

24-1518-11

bahagian bahagian: 22024

Jenis: DIP, 0.2" (5.08mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 24 (2 x 12), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

Senarai harapan

Aries Electronics

24-0518-11

bahagian bahagian: 22035

Jenis: SIP, Bilangan Kedudukan atau Pin (Grid): 24 (1 x 24), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

Senarai harapan

Aries Electronics

24-4518-00

bahagian bahagian: 22348

Jenis: DIP, 0.4" (10.16mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 24 (2 x 12), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

29-0518-10H

bahagian bahagian: 22494

Jenis: SIP, Bilangan Kedudukan atau Pin (Grid): 29 (1 x 29), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

24-0513-10

bahagian bahagian: 22641

Jenis: SIP, Bilangan Kedudukan atau Pin (Grid): 24 (1 x 24), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

Senarai harapan

Aries Electronics

22-3513-10

bahagian bahagian: 22849

Jenis: DIP, 0.3" (7.62mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 22 (2 x 11), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

Senarai harapan

Aries Electronics

22-4511-10

bahagian bahagian: 22788

Jenis: DIP, 0.4" (10.16mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 22 (2 x 11), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Tin, Hubungi Ketebalan Selesai - Mengawan: 200.0µin (5.08µm), Bahan Hubungan - Kawan: Phosphor Bronze,

Senarai harapan

Aries Electronics

24-3518-00

bahagian bahagian: 22792

Jenis: DIP, 0.3" (7.62mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 24 (2 x 12), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

23-0518-11

bahagian bahagian: 22990

Jenis: SIP, Bilangan Kedudukan atau Pin (Grid): 23 (1 x 23), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

Senarai harapan

Aries Electronics

20-3518-11

bahagian bahagian: 23161

Jenis: DIP, 0.3" (7.62mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 20 (2 x 10), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

28-1518-10H

bahagian bahagian: 23287

Jenis: DIP, 0.2" (5.08mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 28 (2 x 14), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

Senarai harapan

Aries Electronics

28-0518-10H

bahagian bahagian: 23282

Jenis: SIP, Bilangan Kedudukan atau Pin (Grid): 28 (1 x 28), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

Senarai harapan

Aries Electronics

24-6513-10T

bahagian bahagian: 23441

Jenis: DIP, 0.6" (15.24mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 24 (2 x 12), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

23-0513-10

bahagian bahagian: 23627

Jenis: SIP, Bilangan Kedudukan atau Pin (Grid): 23 (1 x 23), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

20-3511-10

bahagian bahagian: 23621

Jenis: DIP, 0.3" (7.62mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 20 (2 x 10), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Tin, Hubungi Ketebalan Selesai - Mengawan: 200.0µin (5.08µm), Bahan Hubungan - Kawan: Phosphor Bronze,

Senarai harapan

Aries Electronics

20-0518-10T

bahagian bahagian: 23768

Jenis: SIP, Bilangan Kedudukan atau Pin (Grid): 20 (1 x 20), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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Aries Electronics

24-3513-10T

bahagian bahagian: 23764

Jenis: DIP, 0.3" (7.62mm) Row Spacing, Bilangan Kedudukan atau Pin (Grid): 24 (2 x 12), Pitch - Berkawan: 0.100" (2.54mm), Hubungi Selesai - Berkawan: Gold, Hubungi Ketebalan Selesai - Mengawan: 10.0µin (0.25µm), Bahan Hubungan - Kawan: Beryllium Copper,

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