Permohonan: Handheld/Mobile Devices, Semasa - Bekalan: 10µA, Voltan - Bekalan: 2.7V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-WFQFN Exposed Pad,
Permohonan: Handheld/Mobile Devices, Semasa - Bekalan: 220µA, Voltan - Bekalan: 2.5V ~ 80V, Suhu Operasi: 0°C ~ 70°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-VFSOP (0.049", 1.25mm Width),
Permohonan: Handheld/Mobile Devices, Semasa - Bekalan: 220µA, Voltan - Bekalan: 2.5V ~ 80V, Suhu Operasi: 0°C ~ 70°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: SOT-23-8 Thin, TSOT-23-8,
Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Permohonan: Heating Controller, Voltan - Bekalan: 4V ~ 5.5V, Suhu Operasi: -20°C ~ 85°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 24-SOIC (0.295", 7.50mm Width),
Permohonan: Heating Controller, Voltan - Bekalan: 4V ~ 5.5V, Suhu Operasi: -20°C ~ 85°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Jenis Pemasangan: Threaded, Pakej / Kes: 16-DIP (0.300", 7.62mm),
Permohonan: Heating Controller, Voltan - Bekalan: 3.5V ~ 5.5V, Suhu Operasi: -20°C ~ 85°C (TA), Jenis Pemasangan: Through Hole, Pakej / Kes: 8-DIP (0.300", 7.62mm),
Permohonan: Heating Controller, Voltan - Bekalan: 4V ~ 5.5V, Suhu Operasi: -20°C ~ 85°C (TA), Jenis Pemasangan: Through Hole, Pakej / Kes: 8-DIP (0.300", 7.62mm),
Jenis Pemasangan: Through Hole, Pakej / Kes: 8-DIP (0.300", 7.62mm),
Permohonan: Smart Iron Controller, Semasa - Bekalan: 400µA, Voltan - Bekalan: 4.5V ~ 5.5V, Suhu Operasi: -10°C ~ 85°C (TA), Jenis Pemasangan: Through Hole, Pakej / Kes: 8-DIP (0.300", 7.62mm),
Permohonan: Heating Controller, Voltan - Bekalan: 3.5V ~ 5.5V, Suhu Operasi: -20°C ~ 85°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Permohonan: Heating Controller, Voltan - Bekalan: 4V ~ 6V, Suhu Operasi: -20°C ~ 85°C (TA), Jenis Pemasangan: Through Hole, Pakej / Kes: 16-DIP (0.300", 7.62mm),
Permohonan: Ground Fault Protection, Semasa - Bekalan: 2mA, Voltan - Bekalan: 6V ~ 12V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-TSSOP (0.173", 4.40mm Width),
Permohonan: Wireless Power Transmitter, Semasa - Bekalan: 24mA, Voltan - Bekalan: 11.4V ~ 12.6V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-WFQFN Exposed Pad,
Permohonan: Wireless Power Receiver, Jenis Pemasangan: Surface Mount,
Permohonan: Wireless Power Receiver, Jenis Pemasangan: Surface Mount, Pakej / Kes: 79-UFBGA, DSBGA,
Permohonan: Automotive, Semasa - Bekalan: 500µA, Voltan - Bekalan: 8V ~ 16V, Suhu Operasi: -40°C ~ 105°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 28-SOIC (0.295", 7.50mm Width),
Permohonan: Portable Equipment, Semasa - Bekalan: 160µA, Voltan - Bekalan: 2.7V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 30-WFBGA, WLBGA,
Permohonan: Processor, Semasa - Bekalan: 1.3mA, Voltan - Bekalan: 2.5V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width),
Permohonan: Cellular, CDMA Handset, Semasa - Bekalan: 367µA, Voltan - Bekalan: 2.5V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-TSSOP (0.173", 4.40mm Width),
Permohonan: Mobile/OMAP™, Voltan - Bekalan: 2.7V ~ 4.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 209-VFBGA,
Permohonan: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply, Jenis Pemasangan: Surface Mount, Pakej / Kes: 120-VFBGA,