Jenis Pemasangan: Through Hole, Pakej / Kes: 8-DIP (0.300", 7.62mm),
Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Permohonan: Heating Controller, Voltan - Bekalan: 3.5V ~ 5.5V, Suhu Operasi: -20°C ~ 85°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Permohonan: Smart Iron Controller, Semasa - Bekalan: 400µA, Voltan - Bekalan: 4.5V ~ 5.5V, Suhu Operasi: -10°C ~ 85°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Permohonan: Smart Iron Controller, Semasa - Bekalan: 400µA, Voltan - Bekalan: 4.5V ~ 5.5V, Suhu Operasi: -10°C ~ 85°C (TA), Jenis Pemasangan: Through Hole, Pakej / Kes: 8-DIP (0.300", 7.62mm),
Permohonan: Heating Controller, Voltan - Bekalan: 4V ~ 5.5V, Suhu Operasi: -20°C ~ 85°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-SOIC (0.154", 3.90mm Width),
Permohonan: Heating Controller, Voltan - Bekalan: 3.5V ~ 5.5V, Suhu Operasi: -20°C ~ 85°C (TA), Jenis Pemasangan: Through Hole, Pakej / Kes: 8-DIP (0.300", 7.62mm),
Permohonan: Wireless Power Receiver, Jenis Pemasangan: Surface Mount, Pakej / Kes: 79-UFBGA, DSBGA,
Permohonan: Wireless Power Receiver, Suhu Operasi: 0°C ~ 85°C, Jenis Pemasangan: Surface Mount,
Permohonan: Wireless Power Receiver, Suhu Operasi: 0°C ~ 85°C,
Permohonan: Wireless Power Transmitter, Semasa - Bekalan: 20mA, Voltan - Bekalan: 4.75V ~ 5.25V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-WFQFN Exposed Pad,
Permohonan: Power Supplies, Semasa - Bekalan: 2.5mA, Voltan - Bekalan: 9.3V ~ 28V, Suhu Operasi: -40°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 28-TSSOP (0.173", 4.40mm Width) Exposed Pad,
Permohonan: USB, Peripherals, Semasa - Bekalan: 150µA, Voltan - Bekalan: 3.5V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 10-XFQFN,
Permohonan: General Purpose, Semasa - Bekalan: 20mA, Voltan - Bekalan: 20V ~ 76V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 56-WFQFN Exposed Pad,
Permohonan: Handheld/Mobile Devices, Voltan - Bekalan: 2.6V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-WFQFN Exposed Pad,
Permohonan: Processor, Semasa - Bekalan: 60µA, Voltan - Bekalan: 2.7V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 40-WFQFN Exposed Pad,
Permohonan: Handheld/Mobile Devices, OMAP™, Semasa - Bekalan: 20µA, Voltan - Bekalan: 2.5V ~ 4.8V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 155-UFBGA, DSBGA,
Permohonan: Handheld/Mobile Devices, Semasa - Bekalan: 12µA, Voltan - Bekalan: 4.3V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-WFQFN Exposed Pad,
Permohonan: General Purpose, Semasa - Bekalan: 90mA, Voltan - Bekalan: 1.6V ~ 5.5V, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 44-PowerWFQFN,
Permohonan: Overvoltage, Undervoltage Protection, Semasa - Bekalan: 125µA, Voltan - Bekalan: 2.5V ~ 34V, Suhu Operasi: 0°C ~ 70°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 8-WFDFN Exposed Pad,
Permohonan: System Basis Chip, Voltan - Bekalan: -1.0V ~ 40V, Suhu Operasi: -40°C ~ 150°C (TA), Jenis Pemasangan: Surface Mount, Pakej / Kes: 48-LQFP Exposed Pad,
Permohonan: Processor, Semasa - Bekalan: 8mA, Voltan - Bekalan: 8V ~ 16V, Suhu Operasi: 0°C ~ 100°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 32-VFQFN Exposed Pad,
Permohonan: Processor, Semasa - Bekalan: 4mA, Voltan - Bekalan: 8V ~ 28V, Suhu Operasi: 0°C ~ 125°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 20-VFQFN Exposed Pad,