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Penyesuai, Papan Pecah

08-350000-10-P
Aries Electronics

08-350000-10-P

bahagian bahagian: 16673

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
08-350000-11-RC-P
Aries Electronics

08-350000-11-RC-P

bahagian bahagian: 16715

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
08-350000-10
Aries Electronics

08-350000-10

bahagian bahagian: 8469

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
08-350000-11-RC
Aries Electronics

08-350000-11-RC

bahagian bahagian: 8464

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
14-350000-11-RC-P
Aries Electronics

14-350000-11-RC-P

bahagian bahagian: 14740

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 14, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
16-350000-11-RC-P
Aries Electronics

16-350000-11-RC-P

bahagian bahagian: 9690

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
10-350000-10
Aries Electronics

10-350000-10

bahagian bahagian: 10453

Jenis Papan Proto: SMD to DIP, Bilangan Kedudukan: 10, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
18-350000-11-RC-P
Aries Electronics

18-350000-11-RC-P

bahagian bahagian: 14748

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 18, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
18-350000-11-RC
Aries Electronics

18-350000-11-RC

bahagian bahagian: 8462

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 18, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
18-350000-10
Aries Electronics

18-350000-10

bahagian bahagian: 8417

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 18, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
16-350000-10-P
Aries Electronics

16-350000-10-P

bahagian bahagian: 14728

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
12-350000-10
Aries Electronics

12-350000-10

bahagian bahagian: 10444

Jenis Papan Proto: SMD to DIP, Bilangan Kedudukan: 12, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
14-350000-10-P
Aries Electronics

14-350000-10-P

bahagian bahagian: 14571

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 14, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
14-351000-10
Aries Electronics

14-351000-10

bahagian bahagian: 4616

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 14, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
16-351000-11-RC
Aries Electronics

16-351000-11-RC

bahagian bahagian: 4633

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 16, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16",

Bersenang-senang
16-665000-00
Aries Electronics

16-665000-00

bahagian bahagian: 4998

Jenis Papan Proto: SMD to SMD, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
14-351000-11-RC
Aries Electronics

14-351000-11-RC

bahagian bahagian: 4639

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 14, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16",

Bersenang-senang
16-351000-10
Aries Electronics

16-351000-10

bahagian bahagian: 4550

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 16, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
1110748
Aries Electronics

1110748

bahagian bahagian: 7133

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOT, Bilangan Kedudukan: 6, Pitch: 0.037" (0.95mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
16-666000-00
Aries Electronics

16-666000-00

bahagian bahagian: 6266

Jenis Papan Proto: SMD to SMD, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
16-350000-11-RC
Aries Electronics

16-350000-11-RC

bahagian bahagian: 8449

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
14-350000-10
Aries Electronics

14-350000-10

bahagian bahagian: 8438

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 14, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
14-350000-11-RC
Aries Electronics

14-350000-11-RC

bahagian bahagian: 8382

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 14, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
1109814
Aries Electronics

1109814

bahagian bahagian: 6009

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8, Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
16-350000-10
Aries Electronics

16-350000-10

bahagian bahagian: 8421

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
20-351000-11-RC
Aries Electronics

20-351000-11-RC

bahagian bahagian: 4582

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 20, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16",

Bersenang-senang
28-350002-10-P
Aries Electronics

28-350002-10-P

bahagian bahagian: 9600

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 28, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang
1868
Adafruit Industries LLC

1868

bahagian bahagian: 37556

Jenis Papan Proto: Connector to DIP, Pakej Diterima: CR1220, Bilangan Kedudukan: 4, Pitch: 0.100" (2.54mm),

Bersenang-senang
1377
Adafruit Industries LLC

1377

bahagian bahagian: 12349

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, QFP, Bilangan Kedudukan: 48,

Bersenang-senang
1871
Adafruit Industries LLC

1871

bahagian bahagian: 21017

Jenis Papan Proto: Connector to DIP, Pakej Diterima: CR2032, Bilangan Kedudukan: 4, Pitch: 0.100" (2.54mm), Ketebalan Papan: 0.060" (1.52mm),

Bersenang-senang
1163
Adafruit Industries LLC

1163

bahagian bahagian: 12308

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, QFP, Bilangan Kedudukan: 32,

Bersenang-senang
1870
Adafruit Industries LLC

1870

bahagian bahagian: 29374

Jenis Papan Proto: Connector to DIP, Pakej Diterima: CR2032, Bilangan Kedudukan: 4, Pitch: 0.100" (2.54mm), Ketebalan Papan: 0.060" (1.52mm),

Bersenang-senang
1325
Adafruit Industries LLC

1325

bahagian bahagian: 37627

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: FPC, Bilangan Kedudukan: 20,

Bersenang-senang
2947792
Phoenix Contact

2947792

bahagian bahagian: 9622

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Pitch: 0.197" (5.00mm),

Bersenang-senang
2947912
Phoenix Contact

2947912

bahagian bahagian: 4807

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Pitch: 0.197" (5.00mm),

Bersenang-senang
2947857
Phoenix Contact

2947857

bahagian bahagian: 9006

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Pitch: 0.197" (5.00mm),

Bersenang-senang