Penyesuai, Papan Pecah

20-350000-10-P

bahagian bahagian: 14724

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang

20-350000-11-RC-P

bahagian bahagian: 14730

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang

22-350000-10

bahagian bahagian: 9913

Jenis Papan Proto: SMD to DIP, Bilangan Kedudukan: 22, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang

28-351000-10

bahagian bahagian: 4607

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 28, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang

20-35W000-11-RC

bahagian bahagian: 4855

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang

20-350000-10

bahagian bahagian: 8384

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang

24-650000-10

bahagian bahagian: 5044

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 24, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang

24-350000-10

bahagian bahagian: 8740

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 24, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang

28-351000-11-RC

bahagian bahagian: 4598

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 28, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16",

Bersenang-senang

28-650000-11-RC

bahagian bahagian: 2010

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 28, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang

20-350000-11-RC

bahagian bahagian: 8431

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang

28-350002-10

bahagian bahagian: 6658

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 28, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang

28-35W000-10

bahagian bahagian: 5329

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 28, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang

24-350000-11-RC

bahagian bahagian: 8704

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 24, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang

28-650000-10

bahagian bahagian: 4047

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 28, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang

Phoenix Contact

2947187

bahagian bahagian: 10124

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Pitch: 0.197" (5.00mm),

Bersenang-senang

Phoenix Contact

2947394

bahagian bahagian: 2337

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Pitch: 0.197" (5.00mm),

Bersenang-senang

Phoenix Contact

2947077

bahagian bahagian: 4441

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Pitch: 0.197" (5.00mm),

Bersenang-senang

319010351

bahagian bahagian: 24023

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: QFP, Bilangan Kedudukan: 80, Pitch: 0.031" (0.80mm),

Bersenang-senang

319010053

bahagian bahagian: 7250

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP, Bilangan Kedudukan: 6, 8, Pitch: 0.026" (0.65mm),

Bersenang-senang

319010042

bahagian bahagian: 5042

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP, Bilangan Kedudukan: 6, 8, Pitch: 0.020" (0.50mm),

Bersenang-senang

319010045

bahagian bahagian: 4248

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: QFP, Bilangan Kedudukan: 80, Pitch: 0.026" (0.65mm),

Bersenang-senang

319010352

bahagian bahagian: 23969

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: QFP, Bilangan Kedudukan: 80, Pitch: 0.020" (0.50mm),

Bersenang-senang

319010047

bahagian bahagian: 7199

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP, Bilangan Kedudukan: 6, 8, Pitch: 0.020" (0.50mm),

Bersenang-senang

Vector Electronics

3677-3

bahagian bahagian: 11614

Jenis Papan Proto: SMD to Plated Through Hole, Pitch: 0.100" (2.54mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Bersenang-senang

33408

bahagian bahagian: 27805

Jenis Papan Proto: SMD to SIP, Bilangan Kedudukan: 8, Pitch: 0.100" (2.54mm), Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

Bersenang-senang

33310

bahagian bahagian: 24146

Jenis Papan Proto: SMD to SIP, Bilangan Kedudukan: 10, Pitch: 0.100" (2.54mm), Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

Bersenang-senang

33305

bahagian bahagian: 40915

Jenis Papan Proto: SMD to SIP, Pakej Diterima: SOT-953, Bilangan Kedudukan: 5, Pitch: 0.100" (2.54mm), Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

Bersenang-senang

Jenis Papan Proto: SMD to SIP, Pakej Diterima: SC-8, SC-70-8, US8, Bilangan Kedudukan: 10, Pitch: 0.100" (2.54mm), Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

Bersenang-senang

33106

bahagian bahagian: 37777

Jenis Papan Proto: SMD to SIP, Pakej Diterima: SOT-963, Bilangan Kedudukan: 6, Pitch: 0.100" (2.54mm), Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

Bersenang-senang

33110

bahagian bahagian: 24144

Jenis Papan Proto: SMD to SIP, Bilangan Kedudukan: 10, Pitch: 0.100" (2.54mm), Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

Bersenang-senang

33405

bahagian bahagian: 40949

Jenis Papan Proto: SMD to SIP, Pakej Diterima: SOT-553, SOT-665, Bilangan Kedudukan: 5, Pitch: 0.100" (2.54mm), Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

Bersenang-senang

33306

bahagian bahagian: 36873

Jenis Papan Proto: SMD to SIP, Bilangan Kedudukan: 6, Pitch: 0.100" (2.54mm), Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

Bersenang-senang