Jenis Papan Proto: SMD to PGA, Pakej Diterima: PLCC, Bilangan Kedudukan: 68, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to SIP, Pakej Diterima: SOT-89, Bilangan Kedudukan: 3, Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to SIP, Pakej Diterima: SOT-23, Bilangan Kedudukan: 3, Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to SIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,
Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: TSSOP, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16",
Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: TSSOP,
Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC, Ketebalan Papan: 0.062" (1.57mm) 1/16",
Jenis Papan Proto: SMD to DIP, Pakej Diterima: PSOP, SSOP, TSOP, Ketebalan Papan: 0.062" (1.57mm) 1/16",
Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: QFP, Ketebalan Papan: 0.062" (1.57mm) 1/16",
Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: PLCC, Ketebalan Papan: 0.062" (1.57mm) 1/16",
Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: TQFP,
Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC,
Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16",
Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 16, Pitch: 0.025" (0.64mm),
Jenis Papan Proto: Through Hole to SIP, Pakej Diterima: Rotary Switch, Bilangan Kedudukan: 11,
Jenis Papan Proto: Through Hole to SIP, Pakej Diterima: Tactile Switch, Bilangan Kedudukan: 6,
Jenis Papan Proto: SMD to SIP, Pakej Diterima: 1/4" TRS Jack, Bilangan Kedudukan: 7,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: BGA, Bilangan Kedudukan: 42, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to PGA, Pakej Diterima: BGA, Bilangan Kedudukan: 484, Pitch: 0.039" (1.00mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to PGA, Pakej Diterima: BGA, Bilangan Kedudukan: 100, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to PGA, Pakej Diterima: BGA, Bilangan Kedudukan: 484, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to PGA, Pakej Diterima: BGA, Bilangan Kedudukan: 100, Pitch: 0.031" (0.80mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to PGA, Pakej Diterima: BGA, Bilangan Kedudukan: 100, Pitch: 0.039" (1.00mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: BGA, Bilangan Kedudukan: 54, Pitch: 0.029" (0.75mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: BGA, Bilangan Kedudukan: 25, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to PGA, Pakej Diterima: BGA, Bilangan Kedudukan: 324, Pitch: 0.031" (0.80mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to PGA, Pakej Diterima: BGA, Bilangan Kedudukan: 100, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: BGA, Bilangan Kedudukan: 25, Pitch: 0.016" (0.40mm),
Jenis Papan Proto: SMD to DIP, Pakej Diterima: BGA, Bilangan Kedudukan: 54, Pitch: 0.047" (1.20mm),
