Penyesuai, Papan Pecah

68-505-110

68-505-110

bahagian bahagian: 4755

Jenis Papan Proto: SMD to PGA, Pakej Diterima: PLCC, Bilangan Kedudukan: 68, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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6303

6303

bahagian bahagian: 53080

Jenis Papan Proto: SMD to SIP, Pakej Diterima: SOT-89, Bilangan Kedudukan: 3, Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

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6103

6103

bahagian bahagian: 53103

Jenis Papan Proto: SMD to SIP, Pakej Diterima: SOT-23, Bilangan Kedudukan: 3, Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

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9164

9164

bahagian bahagian: 12089

Jenis Papan Proto: SMD to SIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

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9165

9165

bahagian bahagian: 11541

Jenis Papan Proto: SMD to SIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

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9163

9163

bahagian bahagian: 12468

Jenis Papan Proto: SMD to SIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

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9162

9162

bahagian bahagian: 36519

Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

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9161

9161

bahagian bahagian: 38603

Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

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8100-SMT10

8100-SMT10

bahagian bahagian: 1877

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: TSSOP, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16",

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8100-SMT10-LF

8100-SMT10-LF

bahagian bahagian: 1804

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: TSSOP,

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8100-SMT6

8100-SMT6

bahagian bahagian: 2626

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC, Ketebalan Papan: 0.062" (1.57mm) 1/16",

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8100-SMT9

8100-SMT9

bahagian bahagian: 1170

Jenis Papan Proto: SMD to DIP, Pakej Diterima: PSOP, SSOP, TSOP, Ketebalan Papan: 0.062" (1.57mm) 1/16",

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8100-SMT11

8100-SMT11

bahagian bahagian: 1923

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: QFP, Ketebalan Papan: 0.062" (1.57mm) 1/16",

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8100-SMT3

8100-SMT3

bahagian bahagian: 1521

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: PLCC, Ketebalan Papan: 0.062" (1.57mm) 1/16",

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8100-SMT7

8100-SMT7

bahagian bahagian: 1771

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC, Ketebalan Papan: 0.062" (1.57mm) 1/16",

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8100-SMT14

8100-SMT14

bahagian bahagian: 1914

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: TQFP,

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8100-SMT8-LF

8100-SMT8-LF

bahagian bahagian: 1754

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC,

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8100-SMT8

8100-SMT8

bahagian bahagian: 1789

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16",

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8100-SMT4

8100-SMT4

bahagian bahagian: 3410

Jenis Papan Proto: SMD to Plated Through Hole Board, Pakej Diterima: SOIC, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16",

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BOB-00494

BOB-00494

bahagian bahagian: 7334

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8,

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BOB-00498

BOB-00498

bahagian bahagian: 24852

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 16, Pitch: 0.025" (0.64mm),

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BOB-13098

BOB-13098

bahagian bahagian: 37613

Jenis Papan Proto: Through Hole to SIP, Pakej Diterima: Rotary Switch, Bilangan Kedudukan: 11,

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BOB-10467

BOB-10467

bahagian bahagian: 48907

Jenis Papan Proto: Through Hole to SIP, Pakej Diterima: Tactile Switch, Bilangan Kedudukan: 6,

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BOB-13005

BOB-13005

bahagian bahagian: 29363

Jenis Papan Proto: SMD to SIP, Pakej Diterima: 1/4" TRS Jack, Bilangan Kedudukan: 7,

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BGA0010

BGA0010

bahagian bahagian: 2180

Jenis Papan Proto: SMD to DIP, Pakej Diterima: BGA, Bilangan Kedudukan: 42, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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BGA0006

BGA0006

bahagian bahagian: 1327

Jenis Papan Proto: SMD to PGA, Pakej Diterima: BGA, Bilangan Kedudukan: 484, Pitch: 0.039" (1.00mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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BGA0007

BGA0007

bahagian bahagian: 2866

Jenis Papan Proto: SMD to PGA, Pakej Diterima: BGA, Bilangan Kedudukan: 100, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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BGA0009

BGA0009

bahagian bahagian: 1366

Jenis Papan Proto: SMD to PGA, Pakej Diterima: BGA, Bilangan Kedudukan: 484, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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BGA0001

BGA0001

bahagian bahagian: 2861

Jenis Papan Proto: SMD to PGA, Pakej Diterima: BGA, Bilangan Kedudukan: 100, Pitch: 0.031" (0.80mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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BGA0004

BGA0004

bahagian bahagian: 2881

Jenis Papan Proto: SMD to PGA, Pakej Diterima: BGA, Bilangan Kedudukan: 100, Pitch: 0.039" (1.00mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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BGA0014

BGA0014

bahagian bahagian: 2123

Jenis Papan Proto: SMD to DIP, Pakej Diterima: BGA, Bilangan Kedudukan: 54, Pitch: 0.029" (0.75mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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BGA0011

BGA0011

bahagian bahagian: 3542

Jenis Papan Proto: SMD to DIP, Pakej Diterima: BGA, Bilangan Kedudukan: 25, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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BGA0002

BGA0002

bahagian bahagian: 1744

Jenis Papan Proto: SMD to PGA, Pakej Diterima: BGA, Bilangan Kedudukan: 324, Pitch: 0.031" (0.80mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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BGA0015

BGA0015

bahagian bahagian: 1439

Jenis Papan Proto: SMD to PGA, Pakej Diterima: BGA, Bilangan Kedudukan: 100, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

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BGA0016

BGA0016

bahagian bahagian: 2860

Jenis Papan Proto: SMD to DIP, Pakej Diterima: BGA, Bilangan Kedudukan: 25, Pitch: 0.016" (0.40mm),

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BGA0012

BGA0012

bahagian bahagian: 2014

Jenis Papan Proto: SMD to DIP, Pakej Diterima: BGA, Bilangan Kedudukan: 54, Pitch: 0.047" (1.20mm),

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