Garisan Kelewatan

CL1L5AT008L-T1

CL1L5AT008L-T1

bahagian bahagian: 2137

Masa Kelewatan: 80ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

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GL2L5LS060D-C

GL2L5LS060D-C

bahagian bahagian: 2162

Masa Kelewatan: 600ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL2L5MS200D-C

GL2L5MS200D-C

bahagian bahagian: 2209

Masa Kelewatan: 2.0ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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GL1L5MS200S-C

GL1L5MS200S-C

bahagian bahagian: 2146

Masa Kelewatan: 2.0ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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GL1L5MS220S-C

GL1L5MS220S-C

bahagian bahagian: 2197

Masa Kelewatan: 2.2ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL1L5LS090S-C

GL1L5LS090S-C

bahagian bahagian: 2173

Masa Kelewatan: 900ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL1L5MS340S-C

GL1L5MS340S-C

bahagian bahagian: 2228

Masa Kelewatan: 3.4ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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CL1L5AT010L-T1

CL1L5AT010L-T1

bahagian bahagian: 2126

Masa Kelewatan: 100ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

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GL2L5LS050D-T1-C

GL2L5LS050D-T1-C

bahagian bahagian: 2231

Masa Kelewatan: 500ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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CL2LAAT004D-C-T1

CL2LAAT004D-C-T1

bahagian bahagian: 2158

Masa Kelewatan: 40ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

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GL1L5MS460S-C

GL1L5MS460S-C

bahagian bahagian: 2204

Masa Kelewatan: 4.6ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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DS1L5VJ700S-C

DS1L5VJ700S-C

bahagian bahagian: 2149

Masa Kelewatan: 7.0ns, Toleransi: ±0.250nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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DS1L5DJ080K-C

DS1L5DJ080K-C

bahagian bahagian: 2201

Masa Kelewatan: 800ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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DS1L5DJ200S-C

DS1L5DJ200S-C

bahagian bahagian: 2144

Masa Kelewatan: 2.0ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL2L5MS170D-C

GL2L5MS170D-C

bahagian bahagian: 2154

Masa Kelewatan: 1.7ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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DS1L5DJ090S-C

DS1L5DJ090S-C

bahagian bahagian: 2196

Masa Kelewatan: 900ps, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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DS1L5DJ010K-C

DS1L5DJ010K-C

bahagian bahagian: 2200

Masa Kelewatan: 100ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL1L5LS020S-C

GL1L5LS020S-C

bahagian bahagian: 2162

Masa Kelewatan: 200ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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DS1L5DJ050S-C

DS1L5DJ050S-C

bahagian bahagian: 2191

Masa Kelewatan: 500ps, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL2L5MS280D-C

GL2L5MS280D-C

bahagian bahagian: 2242

Masa Kelewatan: 2.8ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL2L5LS020D-C

GL2L5LS020D-C

bahagian bahagian: 2185

Masa Kelewatan: 200ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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DS1L5DJ015K-C

DS1L5DJ015K-C

bahagian bahagian: 2169

Masa Kelewatan: 150ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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DS1L5DJ130S-C

DS1L5DJ130S-C

bahagian bahagian: 2178

Masa Kelewatan: 1.3ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL1L5MS170S-C

GL1L5MS170S-C

bahagian bahagian: 2158

Masa Kelewatan: 1.7ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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CL1L5AT012L-T1

CL1L5AT012L-T1

bahagian bahagian: 2166

Masa Kelewatan: 120ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

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DS1L5DJ045K-C

DS1L5DJ045K-C

bahagian bahagian: 2181

Masa Kelewatan: 450ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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CL2LAAT020D-C-T1

CL2LAAT020D-C-T1

bahagian bahagian: 2131

Masa Kelewatan: 200ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

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GL1L5MS280S-C

GL1L5MS280S-C

bahagian bahagian: 2216

Masa Kelewatan: 2.8ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL2L5MS190D-C

GL2L5MS190D-C

bahagian bahagian: 2133

Masa Kelewatan: 1.9ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL1L5MS120S-C

GL1L5MS120S-C

bahagian bahagian: 2222

Masa Kelewatan: 1.2ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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DS1L5VJ900S-C

DS1L5VJ900S-C

bahagian bahagian: 2187

Masa Kelewatan: 9.0ns, Toleransi: ±0.250nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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DS1L5DJ120S-C

DS1L5DJ120S-C

bahagian bahagian: 2217

Masa Kelewatan: 1.2ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL1L5MS150S-C

GL1L5MS150S-C

bahagian bahagian: 2151

Masa Kelewatan: 1.5ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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GL1L5MS500S-C

GL1L5MS500S-C

bahagian bahagian: 2172

Masa Kelewatan: 5.0ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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GL1L5MS230S-C

GL1L5MS230S-C

bahagian bahagian: 2165

Masa Kelewatan: 2.3ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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DS1L5DJ325S-C

DS1L5DJ325S-C

bahagian bahagian: 2201

Masa Kelewatan: 3.25ns, Toleransi: ±0.125nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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