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Garisan Kelewatan

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DS1L5DJ035K-C
Susumu

DS1L5DJ035K-C

bahagian bahagian: 2181

Masa Kelewatan: 350ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
GL2L5MS230D-C
Susumu

GL2L5MS230D-C

bahagian bahagian: 2224

Masa Kelewatan: 2.3ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Senarai harapan
GL1L5MS330S-C
Susumu

GL1L5MS330S-C

bahagian bahagian: 2202

Masa Kelewatan: 3.3ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Senarai harapan
DS1L5DJ025K-C
Susumu

DS1L5DJ025K-C

bahagian bahagian: 2170

Masa Kelewatan: 250ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
GL1L5LS080S-C
Susumu

GL1L5LS080S-C

bahagian bahagian: 2204

Masa Kelewatan: 800ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Senarai harapan
DS1L5DJ160S-C
Susumu

DS1L5DJ160S-C

bahagian bahagian: 2184

Masa Kelewatan: 1.6ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
DS1L5DJ030K-C
Susumu

DS1L5DJ030K-C

bahagian bahagian: 2172

Masa Kelewatan: 300ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
CL2LAAT008D-C-T1
Susumu

CL2LAAT008D-C-T1

bahagian bahagian: 2187

Masa Kelewatan: 80ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

Senarai harapan
DS1L5DJ300S-C
Susumu

DS1L5DJ300S-C

bahagian bahagian: 6267

Masa Kelewatan: 3.0ns, Toleransi: ±0.125nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
DS1L5DJ090K-C
Susumu

DS1L5DJ090K-C

bahagian bahagian: 2214

Masa Kelewatan: 900ps, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
GL2L5MS260D-C
Susumu

GL2L5MS260D-C

bahagian bahagian: 2230

Masa Kelewatan: 2.6ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Senarai harapan
GL1L5MS210S-C
Susumu

GL1L5MS210S-C

bahagian bahagian: 6300

Masa Kelewatan: 2.1ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Senarai harapan
CL2LAAT010D-C-T1
Susumu

CL2LAAT010D-C-T1

bahagian bahagian: 2182

Masa Kelewatan: 100ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

Senarai harapan
GL2L5MS300D-C
Susumu

GL2L5MS300D-C

bahagian bahagian: 2234

Masa Kelewatan: 3.0ns, Toleransi: -0.5/+0.1 nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

Senarai harapan
DS1L5DJ425S-C
Susumu

DS1L5DJ425S-C

bahagian bahagian: 2196

Masa Kelewatan: 4.25ns, Toleransi: ±0.125nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
DS1L5DJ180S-C
Susumu

DS1L5DJ180S-C

bahagian bahagian: 2192

Masa Kelewatan: 1.8ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
GL1L5MS360S-C
Susumu

GL1L5MS360S-C

bahagian bahagian: 2200

Masa Kelewatan: 3.6ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Senarai harapan
GL1L5MS430S-C
Susumu

GL1L5MS430S-C

bahagian bahagian: 2205

Masa Kelewatan: 4.3ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Senarai harapan
DS1L5DJ140S-C
Susumu

DS1L5DJ140S-C

bahagian bahagian: 2215

Masa Kelewatan: 1.4ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
DS1L5VJ550S-C
Susumu

DS1L5VJ550S-C

bahagian bahagian: 2187

Masa Kelewatan: 5.5ns, Toleransi: ±0.250nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
DS1L5DJ080S-C
Susumu

DS1L5DJ080S-C

bahagian bahagian: 2210

Masa Kelewatan: 800ps, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
GL1L5MS490S-C
Susumu

GL1L5MS490S-C

bahagian bahagian: 2191

Masa Kelewatan: 4.9ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Senarai harapan
GL1L5MS440S-C
Susumu

GL1L5MS440S-C

bahagian bahagian: 2156

Masa Kelewatan: 4.4ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Senarai harapan
DS1L5DJ110S-C
Susumu

DS1L5DJ110S-C

bahagian bahagian: 2143

Masa Kelewatan: 1.1ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
GL1L5MS180S-C
Susumu

GL1L5MS180S-C

bahagian bahagian: 2163

Masa Kelewatan: 1.8ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Senarai harapan
GL2L5MS180D-C
Susumu

GL2L5MS180D-C

bahagian bahagian: 2233

Masa Kelewatan: 1.8ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Senarai harapan
GL1L5MS420S-C
Susumu

GL1L5MS420S-C

bahagian bahagian: 2214

Masa Kelewatan: 4.2ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Senarai harapan
DS1L5DJ250S-C
Susumu

DS1L5DJ250S-C

bahagian bahagian: 2184

Masa Kelewatan: 2.5ns, Toleransi: ±0.125nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
DS1L5DJ070S-C
Susumu

DS1L5DJ070S-C

bahagian bahagian: 2130

Masa Kelewatan: 700ps, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
DS1L5DJ040S-C
Susumu

DS1L5DJ040S-C

bahagian bahagian: 2179

Masa Kelewatan: 400ps, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
GL1L5MS350S-C
Susumu

GL1L5MS350S-C

bahagian bahagian: 2155

Masa Kelewatan: 3.5ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

Senarai harapan
DS1L5DJ475S-C
Susumu

DS1L5DJ475S-C

bahagian bahagian: 2131

Masa Kelewatan: 4.75ns, Toleransi: ±0.125nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
GL1L5LS010S-C
Susumu

GL1L5LS010S-C

bahagian bahagian: 2120

Masa Kelewatan: 100ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

Senarai harapan
GL1L5MS240S-C
Susumu

GL1L5MS240S-C

bahagian bahagian: 2173

Masa Kelewatan: 2.4ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

Senarai harapan
DS1L5DJ040K-C
Susumu

DS1L5DJ040K-C

bahagian bahagian: 2186

Masa Kelewatan: 400ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan
DS1L5VJ950S-C
Susumu

DS1L5VJ950S-C

bahagian bahagian: 2165

Masa Kelewatan: 9.5ns, Toleransi: ±0.250nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

Senarai harapan