Garisan Kelewatan

GL2L5MS130D-C

GL2L5MS130D-C

bahagian bahagian: 2190

Masa Kelewatan: 1.3ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL2L5MS160D-C

GL2L5MS160D-C

bahagian bahagian: 6295

Masa Kelewatan: 1.6ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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DS1L5DJ075K-C

DS1L5DJ075K-C

bahagian bahagian: 2227

Masa Kelewatan: 750ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL2L5MS450D-C

GL2L5MS450D-C

bahagian bahagian: 2136

Masa Kelewatan: 4.5ns, Toleransi: ±0.100nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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GL2L5LS030D-C

GL2L5LS030D-C

bahagian bahagian: 2234

Masa Kelewatan: 300ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL1L5LS070S-C

GL1L5LS070S-C

bahagian bahagian: 2165

Masa Kelewatan: 700ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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DS1L5DJ060S-C

DS1L5DJ060S-C

bahagian bahagian: 2188

Masa Kelewatan: 600ps, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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DS1L5DJ070K-C

DS1L5DJ070K-C

bahagian bahagian: 2223

Masa Kelewatan: 700ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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DS1L5DJ060K-C

DS1L5DJ060K-C

bahagian bahagian: 2196

Masa Kelewatan: 600ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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CL2LAAT014D-C-T1

CL2LAAT014D-C-T1

bahagian bahagian: 2145

Masa Kelewatan: 140ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

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DS1L5VJ600S-C

DS1L5VJ600S-C

bahagian bahagian: 2185

Masa Kelewatan: 6.0ns, Toleransi: ±0.250nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL2L5MS120D-C

GL2L5MS120D-C

bahagian bahagian: 2150

Masa Kelewatan: 1.2ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL2L5LS090D-C

GL2L5LS090D-C

bahagian bahagian: 2208

Masa Kelewatan: 900ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL1L5LS050S-C

GL1L5LS050S-C

bahagian bahagian: 2105

Masa Kelewatan: 500ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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DS1L5DJ350S-C

DS1L5DJ350S-C

bahagian bahagian: 6299

Masa Kelewatan: 3.5ns, Toleransi: ±0.125nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL2L5LS100D-C

GL2L5LS100D-C

bahagian bahagian: 2141

Masa Kelewatan: 1.0ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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DS1L5DJ120K-C

DS1L5DJ120K-C

bahagian bahagian: 9705

Masa Kelewatan: 1.2ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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DS1L5DJ190S-C

DS1L5DJ190S-C

bahagian bahagian: 2171

Masa Kelewatan: 1.9ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL2L5MS210D-C

GL2L5MS210D-C

bahagian bahagian: 2208

Masa Kelewatan: 2.1ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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CL1L5AT016L-T1

CL1L5AT016L-T1

bahagian bahagian: 2170

Masa Kelewatan: 160ps, Toleransi: ±10%, Suhu Operasi: -40°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 1210 (3225 Metric),

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GL1L5MS270S-C

GL1L5MS270S-C

bahagian bahagian: 6237

Masa Kelewatan: 2.7ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL1L5MS390S-C

GL1L5MS390S-C

bahagian bahagian: 2165

Masa Kelewatan: 3.9ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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DS1L5VJA00S-C

DS1L5VJA00S-C

bahagian bahagian: 2156

Masa Kelewatan: 10.0ns, Toleransi: ±0.250nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL2L5MS290D-C

GL2L5MS290D-C

bahagian bahagian: 2162

Masa Kelewatan: 2.9ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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DS1L5DJ450S-C

DS1L5DJ450S-C

bahagian bahagian: 2189

Masa Kelewatan: 4.5ns, Toleransi: ±0.125nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL1L5MS110S-C

GL1L5MS110S-C

bahagian bahagian: 2187

Masa Kelewatan: 1.1ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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DS1L5DJ500S-C

DS1L5DJ500S-C

bahagian bahagian: 2137

Masa Kelewatan: 5.0ns, Toleransi: ±0.125nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL2L5MS110D-C

GL2L5MS110D-C

bahagian bahagian: 6267

Masa Kelewatan: 1.1ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL1L5LS030S-C

GL1L5LS030S-C

bahagian bahagian: 2180

Masa Kelewatan: 300ps, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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DS1L5DJ055K-C

DS1L5DJ055K-C

bahagian bahagian: 2223

Masa Kelewatan: 550ps, Toleransi: ±0.025nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL2L5MS220D-C

GL2L5MS220D-C

bahagian bahagian: 2224

Masa Kelewatan: 2.2ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL1L5MS410S-C

GL1L5MS410S-C

bahagian bahagian: 2156

Masa Kelewatan: 4.1ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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GL1L5MS370S-C

GL1L5MS370S-C

bahagian bahagian: 9622

Masa Kelewatan: 3.7ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.220", 5.59mm Width),

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DS1L5DJ375S-C

DS1L5DJ375S-C

bahagian bahagian: 9630

Masa Kelewatan: 3.75ns, Toleransi: ±0.125nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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DS1L5DJ110K-C

DS1L5DJ110K-C

bahagian bahagian: 2194

Masa Kelewatan: 1.1ns, Toleransi: ±0.050nS, Suhu Operasi: -10°C ~ 85°C, Jenis Pemasangan: Through Hole, Pakej / Kes: 3-SIP,

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GL1L5MS300S-C

GL1L5MS300S-C

bahagian bahagian: 2145

Masa Kelewatan: 3.0ns, Toleransi: ±0.050nS, Suhu Operasi: -25°C ~ 85°C, Jenis Pemasangan: Surface Mount, Pakej / Kes: 16-SOIC (0.239", 6.06mm Width),

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