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Pateri

91-7059-8825
Kester Solder

91-7059-8825

bahagian bahagian: 9138

Jenis: Wire Solder, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Diameter: 0.025" (0.64mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 22 AWG, 23 SWG,

Bersenang-senang
91-7059-8815
Kester Solder

91-7059-8815

bahagian bahagian: 9140

Jenis: Wire Solder, Komposisi: Sn95.8Ag3.5Cu0.7 (95.8/3.5/0.7), Diameter: 0.015" (0.38mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean, Wire Gauge: 27 AWG, 28 SWG,

Bersenang-senang
91-6337-9815
Kester Solder

91-6337-9815

bahagian bahagian: 9085

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 27 AWG, 28 SWG,

Bersenang-senang
91-6040-8806
Kester Solder

91-6040-8806

bahagian bahagian: 9088

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.015" (0.38mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: No-Clean, Wire Gauge: 27 AWG, 28 SWG,

Bersenang-senang
91-6337-8806
Kester Solder

91-6337-8806

bahagian bahagian: 9152

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 27 AWG, 28 SWG,

Bersenang-senang
91-6337-8834
Kester Solder

91-6337-8834

bahagian bahagian: 9112

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 24 AWG, 25 SWG,

Bersenang-senang
91-6337-9727
Kester Solder

91-6337-9727

bahagian bahagian: 9062

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 27 AWG, 28 SWG,

Bersenang-senang
91-6040-0007
Kester Solder

91-6040-0007

bahagian bahagian: 9070

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.015" (0.38mm), Takat lebur: 361 ~ 374°F (183 ~ 190°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 27 AWG, 28 SWG,

Bersenang-senang
90-7068-9851
Kester Solder

90-7068-9851

bahagian bahagian: 9088

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.010" (0.25mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean, Wire Gauge: 30 AWG, 33 SWG,

Bersenang-senang
SMD2SWLF.020 2OZ
Chip Quik Inc.

SMD2SWLF.020 2OZ

bahagian bahagian: 315

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.020" (0.51mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble,

Bersenang-senang
SMD4300AX10T5
Chip Quik Inc.

SMD4300AX10T5

bahagian bahagian: 2531

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
SMD2SW.020 4OZ
Chip Quik Inc.

SMD2SW.020 4OZ

bahagian bahagian: 577

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.020" (0.51mm), Takat lebur: 361 ~ 370°F (183 ~ 188°C), Jenis Flux: No-Clean, Water Soluble,

Bersenang-senang
SMDSWLF.031 2OZ
Chip Quik Inc.

SMDSWLF.031 2OZ

bahagian bahagian: 6388

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 22 SWG,

Bersenang-senang
SMDSW.031 1LB
Chip Quik Inc.

SMDSW.031 1LB

bahagian bahagian: 179

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 22 SWG,

Bersenang-senang
SMDLTLFP500T4C
Chip Quik Inc.

SMDLTLFP500T4C

bahagian bahagian: 497

Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

Bersenang-senang
SMD291SNL500T4C
Chip Quik Inc.

SMD291SNL500T4C

bahagian bahagian: 643

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

Bersenang-senang
SMD291SNL250T3
Chip Quik Inc.

SMD291SNL250T3

bahagian bahagian: 1379

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

Bersenang-senang
SMDSWLF.008 50G
Chip Quik Inc.

SMDSWLF.008 50G

bahagian bahagian: 235

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.008" (0.20mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 32 AWG, 35 SWG,

Bersenang-senang
SMDLTLFP250T3
Chip Quik Inc.

SMDLTLFP250T3

bahagian bahagian: 1108

Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

Bersenang-senang
SMD3SW.020 8OZ
Chip Quik Inc.

SMD3SW.020 8OZ

bahagian bahagian: 371

Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.020" (0.51mm), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,

Bersenang-senang
SMDSW.031 8OZ
Chip Quik Inc.

SMDSW.031 8OZ

bahagian bahagian: 258

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 22 SWG,

Bersenang-senang
SMDSWLF.015 2OZ
Chip Quik Inc.

SMDSWLF.015 2OZ

bahagian bahagian: 245

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble,

Bersenang-senang
SMD2055
Chip Quik Inc.

SMD2055

bahagian bahagian: 706

Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.025" (0.64mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),

Bersenang-senang
SMDLTLFPT5
Chip Quik Inc.

SMDLTLFPT5

bahagian bahagian: 51

Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

Bersenang-senang
SMD2020-25000
Chip Quik Inc.

SMD2020-25000

bahagian bahagian: 49

Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.010" (0.25mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),

Bersenang-senang
SMD4300SNL500T5C
Chip Quik Inc.

SMD4300SNL500T5C

bahagian bahagian: 352

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: Water Soluble,

Bersenang-senang
SMD2060-25000
Chip Quik Inc.

SMD2060-25000

bahagian bahagian: 2151

Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.030" (0.76mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),

Bersenang-senang
SMD291AX500T5C
Chip Quik Inc.

SMD291AX500T5C

bahagian bahagian: 436

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
TS391LT
Chip Quik Inc.

TS391LT

bahagian bahagian: 851

Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

Bersenang-senang
SMDLTLFPT4
Chip Quik Inc.

SMDLTLFPT4

bahagian bahagian: 135

Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

Bersenang-senang
SMD291AXT5
Chip Quik Inc.

SMD291AXT5

bahagian bahagian: 99

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
SMD3SW.031 4OZ
Chip Quik Inc.

SMD3SW.031 4OZ

bahagian bahagian: 625

Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.031" (0.79mm), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean, Water Soluble,

Bersenang-senang
SMDSW.020 8OZ
Chip Quik Inc.

SMDSW.020 8OZ

bahagian bahagian: 213

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,

Bersenang-senang
SS-S020AS
MENDA/EasyBraid

SS-S020AS

bahagian bahagian: 9104

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble, Wire Gauge: 24 AWG, 25 SWG,

Bersenang-senang
OS-S031
MENDA/EasyBraid

OS-S031

bahagian bahagian: 9036

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 22 SWG,

Bersenang-senang
SS-S031
MENDA/EasyBraid

SS-S031

bahagian bahagian: 9058

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble, Wire Gauge: 20 AWG, 22 SWG,

Bersenang-senang