Jenis: Solder Paste, Komposisi: Ag40Cu30Zn28Ni2 (40/30/28/2), Takat lebur: 1220 ~ 1435°F (660 ~ 780°C),
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 22 SWG,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble, Wire Gauge: 24 AWG, 25 SWG,
Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,
Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: Water Soluble,
Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,
Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.018" (0.46mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),
Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.008" (0.20mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),
Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 22 SWG,
Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.012" (0.31mm), Takat lebur: 361°F (183°C),
Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble,
Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.015" (0.38mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble,
Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,
Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 21 SWG,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 22 SWG,
Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.024" (0.61mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),
Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 22 SWG,
Jenis: Solder Paste, Komposisi: Sn96.5Ag3.5 (96.5/3.5), Takat lebur: 430°F (221°C), Jenis Flux: Water Soluble,
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,
Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,
Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.031" (0.79mm), Takat lebur: 361 ~ 370°F (183 ~ 188°C), Jenis Flux: No-Clean, Water Soluble,
Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble,
Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.020" (0.51mm), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,
Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.020" (0.51mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,
Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.024" (0.61mm), Takat lebur: 361°F (183°C),
Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.020" (0.51mm), Takat lebur: 361 ~ 370°F (183 ~ 188°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,
Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.012" (0.31mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),
Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 27 AWG, 28 SWG,
