Pateri

SMD2SWLF.020 1LB

SMD2SWLF.020 1LB

bahagian bahagian: 176

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.020" (0.51mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,

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SMD291SNLT4

SMD291SNLT4

bahagian bahagian: 9

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

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SMD291SNL

SMD291SNL

bahagian bahagian: 4598

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

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SMDSWLF.015 1LB

SMDSWLF.015 1LB

bahagian bahagian: 186

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 27 AWG, 28 SWG,

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SMD2SWLF.031 8OZ

SMD2SWLF.031 8OZ

bahagian bahagian: 240

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 22 SWG,

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SMD291SNL10T4

SMD291SNL10T4

bahagian bahagian: 2534

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

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TS391SNL500C

TS391SNL500C

bahagian bahagian: 91

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

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SMD2195

SMD2195

bahagian bahagian: 130

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.022" (0.56mm), Takat lebur: 361°F (183°C),

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SMD2040

SMD2040

bahagian bahagian: 632

Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.020" (0.51mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),

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SMD291SNLT5

SMD291SNLT5

bahagian bahagian: 58

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

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SMD2140-25000

SMD2140-25000

bahagian bahagian: 158

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.008" (0.20mm), Takat lebur: 361°F (183°C),

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SMDLTLFP10T5

SMDLTLFP10T5

bahagian bahagian: 2288

Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

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SMD2SWLF.031 .7OZ

SMD2SWLF.031 .7OZ

bahagian bahagian: 677

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 21 SWG,

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SMDLTLFP500T3

SMDLTLFP500T3

bahagian bahagian: 668

Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

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SMD2140

SMD2140

bahagian bahagian: 125

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.008" (0.20mm), Takat lebur: 361°F (183°C),

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TS391SNL50

TS391SNL50

bahagian bahagian: 996

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

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SMD2200-25000

SMD2200-25000

bahagian bahagian: 2778

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.024" (0.61mm), Takat lebur: 361°F (183°C),

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SMD2SWLF.015 4OZ

SMD2SWLF.015 4OZ

bahagian bahagian: 349

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.015" (0.38mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble,

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SMDSWLF.015 8OZ

SMDSWLF.015 8OZ

bahagian bahagian: 297

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 27 AWG, 28 SWG,

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SMD2SWLF.031 4OZ

SMD2SWLF.031 4OZ

bahagian bahagian: 323

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.031" (0.79mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble,

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SMD2215

SMD2215

bahagian bahagian: 938

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.030" (0.76mm), Takat lebur: 361°F (183°C),

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SMDIN97AG3

SMDIN97AG3

bahagian bahagian: 250

Jenis: Wire Solder, Komposisi: In97Ag3 (97/3), Diameter: 0.031" (0.79mm), Takat lebur: 289°F (143°C), Wire Gauge: 20 AWG, 21 SWG,

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SMDSWLTLFP32

SMDSWLTLFP32

bahagian bahagian: 1985

Jenis: Wire Solder, Komposisi: Bi57Sn42Ag1 (57/42/1), Diameter: 0.030" (0.76mm), Takat lebur: 281°F (138°C), Wire Gauge: 21 AWG, 22 SWG,

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SMD2190-25000

SMD2190-25000

bahagian bahagian: 2704

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C),

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SMDSW.031 .7OZ

SMDSW.031 .7OZ

bahagian bahagian: 594

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 21 SWG,

Bersenang-senang
SMDLTLFP500T3C

SMDLTLFP500T3C

bahagian bahagian: 618

Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

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SMDLTLFP500T5C

SMDLTLFP500T5C

bahagian bahagian: 422

Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

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TS391AX250

TS391AX250

bahagian bahagian: 185

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
SMD291SNL250T4

SMD291SNL250T4

bahagian bahagian: 1172

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

Bersenang-senang
SMD4300AX250T4

SMD4300AX250T4

bahagian bahagian: 1419

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

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SMD291SNL500T3

SMD291SNL500T3

bahagian bahagian: 761

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

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SMD3SW.020 1OZ

SMD3SW.020 1OZ

bahagian bahagian: 311

Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.020" (0.51mm), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean, Water Soluble,

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SMD2032-25000

SMD2032-25000

bahagian bahagian: 101

Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.016" (0.40mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),

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MMF301501

MMF301501

bahagian bahagian: 143

Jenis: Wire Solder, Komposisi: Sn95Sb5 (95/5), Diameter: 0.020" (0.51mm), Takat lebur: 450 ~ 460°F (232 ~ 238°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 24 AWG, 25 SWG,

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MM01075

MM01075

bahagian bahagian: 9080

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.024" (0.61mm), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble, Wire Gauge: 22 AWG, 23 SWG,

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S200

S200

bahagian bahagian: 1811

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.040" (1.02mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 18 AWG, 19 SWG,

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