Pateri

70-1002-0511

70-1002-0511

bahagian bahagian: 9211

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-1003-0511

70-1003-0511

bahagian bahagian: 9184

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-0102-0310

70-0102-0310

bahagian bahagian: 9145

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0102-0610

70-0102-0610

bahagian bahagian: 9172

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
70-4105-0810

70-4105-0810

bahagian bahagian: 9188

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-4105-0910

70-4105-0910

bahagian bahagian: 9169

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-4021-1410

70-4021-1410

bahagian bahagian: 9194

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-4021-0810

70-4021-0810

bahagian bahagian: 9194

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0202-0610

70-0202-0610

bahagian bahagian: 9198

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
70-1003-0610

70-1003-0610

bahagian bahagian: 9202

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-0202-0510

70-0202-0510

bahagian bahagian: 6991

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
70-1003-0510

70-1003-0510

bahagian bahagian: 9202

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-1608-0804

70-1608-0804

bahagian bahagian: 9115

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-1709-0820

70-1709-0820

bahagian bahagian: 9148

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-1608-0820

70-1608-0820

bahagian bahagian: 9150

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-4722-0910

70-4722-0910

bahagian bahagian: 9079

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-2002-0311

70-2002-0311

bahagian bahagian: 9064

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-1506-1410

70-1506-1410

bahagian bahagian: 9085

Jenis: Solder Paste, Komposisi: Sn95Sb5 (95/5), Takat lebur: 450 ~ 464°F (232 ~ 240°C), Jenis Flux: No-Clean,

Bersenang-senang
70-4722-0911

70-4722-0911

bahagian bahagian: 9097

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-2002-0310

70-2002-0310

bahagian bahagian: 9126

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: Water Soluble,

Bersenang-senang
86-7068-0118

86-7068-0118

bahagian bahagian: 196

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.118" (3.00mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Wire Gauge: 9 AWG, 11 SWG,

Bersenang-senang
84-7033-0118

84-7033-0118

bahagian bahagian: 9311

Jenis: Wire Solder, Komposisi: Sn97Ag3 (97/3), Diameter: 0.118" (3.00mm), Takat lebur: 430 ~ 435°F (221 ~ 224°C), Wire Gauge: 9 AWG, 11 SWG,

Bersenang-senang
84-7068-0118

84-7068-0118

bahagian bahagian: 9289

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.118" (3.00mm), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Wire Gauge: 9 AWG, 11 SWG,

Bersenang-senang
86-7033-0118

86-7033-0118

bahagian bahagian: 9194

Jenis: Wire Solder, Komposisi: Sn97Ag3 (97/3), Diameter: 0.118" (3.00mm), Takat lebur: 430 ~ 435°F (221 ~ 224°C), Wire Gauge: 9 AWG, 11 SWG,

Bersenang-senang
85-9601-0118

85-9601-0118

bahagian bahagian: 9244

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.118" (3.00mm), Takat lebur: 361°F (183°C), Wire Gauge: 9 AWG, 11 SWG,

Bersenang-senang
84-6337-0118

84-6337-0118

bahagian bahagian: 9260

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.118" (3.00mm), Takat lebur: 361°F (183°C), Wire Gauge: 9 AWG, 11 SWG,

Bersenang-senang
86-6337-0118

86-6337-0118

bahagian bahagian: 9209

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.118" (3.00mm), Takat lebur: 361°F (183°C), Wire Gauge: 9 AWG, 11 SWG,

Bersenang-senang
733002

733002

bahagian bahagian: 1052

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Bersenang-senang
733001

733001

bahagian bahagian: 1790

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.022" (0.56mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

Bersenang-senang
733010

733010

bahagian bahagian: 9081

Jenis: Wire Solder, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Diameter: 0.032" (0.81mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Bersenang-senang
848874

848874

bahagian bahagian: 1460

Jenis: Wire Solder, Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Bersenang-senang
865940

865940

bahagian bahagian: 2047

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.032" (0.81mm), Takat lebur: 440 ~ 464°F (227 ~ 240°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Bersenang-senang
840933

840933

bahagian bahagian: 2457

Jenis: Wire Solder, Diameter: 0.022" (0.56mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

Bersenang-senang
893357

893357

bahagian bahagian: 2447

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Takat lebur: 423°F (217°C), Jenis Flux: Water Soluble, Wire Gauge: 27 AWG, 28 SWG,

Bersenang-senang
838498

838498

bahagian bahagian: 1827

Jenis: Wire Solder, Diameter: 0.025" (0.64mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 22 AWG, 23 SWG,

Bersenang-senang
818006

818006

bahagian bahagian: 3362

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.028" (0.71mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 21 AWG, 22 SWG,

Bersenang-senang