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SMD3SW.031 1OZ
Chip Quik Inc.

SMD3SW.031 1OZ

bahagian bahagian: 294

Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.031" (0.79mm), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean, Water Soluble,

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SMD2028
Chip Quik Inc.

SMD2028

bahagian bahagian: 61

Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.014" (0.36mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),

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SMDLTLFP10T4
Chip Quik Inc.

SMDLTLFP10T4

bahagian bahagian: 2787

Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

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SMD291SNL10
Chip Quik Inc.

SMD291SNL10

bahagian bahagian: 3001

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

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SMD291AX250T5
Chip Quik Inc.

SMD291AX250T5

bahagian bahagian: 821

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

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SMDAL50
Chip Quik Inc.

SMDAL50

bahagian bahagian: 98

Jenis: Solder Paste, Komposisi: Sn96.5Ag3.5 (96.5/3.5), Takat lebur: 430°F (221°C), Jenis Flux: Water Soluble,

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SMD2165-25000
Chip Quik Inc.

SMD2165-25000

bahagian bahagian: 2214

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.012" (0.31mm), Takat lebur: 361°F (183°C),

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SMD291SNL50T3
Chip Quik Inc.

SMD291SNL50T3

bahagian bahagian: 4361

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

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SMDSWLF.006 50G
Chip Quik Inc.

SMDSWLF.006 50G

bahagian bahagian: 399

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.006" (0.15mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 34 AWG, 38 SWG,

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SMD3SW.031 8OZ
Chip Quik Inc.

SMD3SW.031 8OZ

bahagian bahagian: 450

Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.031" (0.79mm), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 22 SWG,

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SMD2180
Chip Quik Inc.

SMD2180

bahagian bahagian: 12

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.016" (0.40mm), Takat lebur: 361°F (183°C),

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SMDAL400C
Chip Quik Inc.

SMDAL400C

bahagian bahagian: 62

Jenis: Solder Paste, Komposisi: Sn96.5Ag3.5 (96.5/3.5), Takat lebur: 430°F (221°C), Jenis Flux: Water Soluble,

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SMDSW.020 1OZ
Chip Quik Inc.

SMDSW.020 1OZ

bahagian bahagian: 14624

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,

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SMD2SWLF.015 .3OZ
Chip Quik Inc.

SMD2SWLF.015 .3OZ

bahagian bahagian: 664

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.015" (0.38mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 27 AWG, 28 SWG,

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SMD2205
Chip Quik Inc.

SMD2205

bahagian bahagian: 927

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.025" (0.64mm), Takat lebur: 361°F (183°C),

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SMD3SW.015 100G
Chip Quik Inc.

SMD3SW.015 100G

bahagian bahagian: 377

Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.015" (0.38mm), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 27 AWG, 28 SWG,

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SMD2170-25000
Chip Quik Inc.

SMD2170-25000

bahagian bahagian: 72

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.014" (0.36mm), Takat lebur: 361°F (183°C),

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TS391LT10
Chip Quik Inc.

TS391LT10

bahagian bahagian: 569

Jenis: Solder Paste, Komposisi: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

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SMD3SW.020 2OZ
Chip Quik Inc.

SMD3SW.020 2OZ

bahagian bahagian: 372

Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.020" (0.51mm), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean, Water Soluble,

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SMDSW.031 4OZ
Chip Quik Inc.

SMDSW.031 4OZ

bahagian bahagian: 7596

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.031" (0.79mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 22 SWG,

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SMD2215-25000
Chip Quik Inc.

SMD2215-25000

bahagian bahagian: 2888

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.030" (0.76mm), Takat lebur: 361°F (183°C),

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SMD2185-25000
Chip Quik Inc.

SMD2185-25000

bahagian bahagian: 52

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.018" (0.46mm), Takat lebur: 361°F (183°C),

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SMD291AX250T3
Chip Quik Inc.

SMD291AX250T3

bahagian bahagian: 1818

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
SMDSWLF.020 1LB
Chip Quik Inc.

SMDSWLF.020 1LB

bahagian bahagian: 148

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.020" (0.51mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,

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SMD2SWLF.015 1OZ
Chip Quik Inc.

SMD2SWLF.015 1OZ

bahagian bahagian: 270

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.015" (0.38mm), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean, Water Soluble,

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SMDIN52SN48
Chip Quik Inc.

SMDIN52SN48

bahagian bahagian: 598

Jenis: Wire Solder, Komposisi: In52Sn48 (52/48), Diameter: 0.031" (0.79mm), Takat lebur: 244°F (118°C), Wire Gauge: 20 AWG, 21 SWG,

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SMD3SW.031 2OZ
Chip Quik Inc.

SMD3SW.031 2OZ

bahagian bahagian: 370

Jenis: Wire Solder, Komposisi: Sn62Pb36Ag2 (62/36/2), Diameter: 0.031" (0.79mm), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean, Water Soluble,

Bersenang-senang
SMD2170
Chip Quik Inc.

SMD2170

bahagian bahagian: 87

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.014" (0.36mm), Takat lebur: 361°F (183°C),

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SMD291SNL500T3C
Chip Quik Inc.

SMD291SNL500T3C

bahagian bahagian: 710

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

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SMD2060
Chip Quik Inc.

SMD2060

bahagian bahagian: 762

Jenis: Solder Sphere, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.030" (0.76mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C),

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SMDSWLF.020 8OZ
Chip Quik Inc.

SMDSWLF.020 8OZ

bahagian bahagian: 261

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.020" (0.51mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 24 AWG, 25 SWG,

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TS391SNL250
Chip Quik Inc.

TS391SNL250

bahagian bahagian: 80

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

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TS391SNL10
Chip Quik Inc.

TS391SNL10

bahagian bahagian: 209

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean,

Bersenang-senang
SMDSWLF.031 8OZ
Chip Quik Inc.

SMDSWLF.031 8OZ

bahagian bahagian: 367

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.031" (0.79mm), Takat lebur: 423 ~ 428°F (217 ~ 220°C), Jenis Flux: No-Clean, Water Soluble, Wire Gauge: 20 AWG, 22 SWG,

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SMD2190
Chip Quik Inc.

SMD2190

bahagian bahagian: 886

Jenis: Solder Sphere, Komposisi: Sn63Pb37 (63/37), Diameter: 0.020" (0.51mm), Takat lebur: 361°F (183°C),

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MM01039
Multicore

MM01039

bahagian bahagian: 9055

Jenis: Wire Solder, Komposisi: Sn62Pb38 (62/38), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

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