Penyesuai, Papan Pecah | Prototaip, Produk Fabrikasi | 22

IPC0049

bahagian bahagian: 9356

Jenis Papan Proto: SMD to DIP, Pakej Diterima: PowerSOIC, PSOP, HSOP, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0107

bahagian bahagian: 5081

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LCC, JLCC, PLCC, Bilangan Kedudukan: 44, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0185

bahagian bahagian: 15289

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TO-263 (DDPAK/D2PAK), Bilangan Kedudukan: 5, Pitch: 0.067" (1.70mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DC1411J-10X

bahagian bahagian: 625

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: 1411, Bilangan Kedudukan: 2, Pitch: 0.114" (2.90mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0240

bahagian bahagian: 5392

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LQFP, Bilangan Kedudukan: 48, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0103

bahagian bahagian: 11690

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LGA, Bilangan Kedudukan: 16, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0020

bahagian bahagian: 12697

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 28, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

FPC030P025

bahagian bahagian: 10664

Jenis Papan Proto: SMD to DIP, Pakej Diterima: FPC Connector, Bilangan Kedudukan: 25, Pitch: 0.012" (0.30mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0039

bahagian bahagian: 10643

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 38, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

F200T254P10

bahagian bahagian: 38839

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Bilangan Kedudukan: 10, Pitch: 0.079" (2.00mm), 0.100" (2.54mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DC2220J-10X

bahagian bahagian: 608

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: 2220, Bilangan Kedudukan: 2, Pitch: 0.209" (5.31mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DC1206J-10X

bahagian bahagian: 543

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: 1206, Bilangan Kedudukan: 2, Pitch: 0.122" (3.10mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

IPC0088

bahagian bahagian: 13898

Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, Bilangan Kedudukan: 10, Pitch: 0.016" (0.40mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

CN0023

bahagian bahagian: 6982

Jenis Papan Proto: Connector to SIP, Pakej Diterima: microSD™ Card, Bilangan Kedudukan: 10, Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DR127D254P10F

bahagian bahagian: 9992

Jenis Papan Proto: Connector to DIP, Pakej Diterima: 1.27mm Header, Bilangan Kedudukan: 10, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0041

bahagian bahagian: 8226

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 56, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DC0603T-10X

bahagian bahagian: 14958

Jenis Papan Proto: SMD to DIP, Pakej Diterima: 0603, Bilangan Kedudukan: 2, Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DC2924J-10X

bahagian bahagian: 553

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: 2924, Bilangan Kedudukan: 2, Pitch: 0.245" (6.22mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0040

bahagian bahagian: 9955

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 48, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

F127T254P04

bahagian bahagian: 67219

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Bilangan Kedudukan: 4, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0088

bahagian bahagian: 27278

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SC-70, SOT-353, Bilangan Kedudukan: 5, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

IPC0142

bahagian bahagian: 21036

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOP, Bilangan Kedudukan: 8, Pitch: 0.100" (2.54mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

F127T254P06

bahagian bahagian: 49160

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Bilangan Kedudukan: 6, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0063

bahagian bahagian: 13877

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 20, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

FPC030P045

bahagian bahagian: 8231

Jenis Papan Proto: SMD to DIP, Pakej Diterima: FPC Connector, Bilangan Kedudukan: 45, Pitch: 0.012" (0.30mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

FPC050P020

bahagian bahagian: 15309

Jenis Papan Proto: SMD to DIP, Pakej Diterima: FPC Connector, Bilangan Kedudukan: 20, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

PA0030

bahagian bahagian: 12681

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QSOP, Bilangan Kedudukan: 24, Pitch: 0.025" (0.64mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

F127T254P08

bahagian bahagian: 43340

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

FPC050P040

bahagian bahagian: 10630

Jenis Papan Proto: SMD to DIP, Pakej Diterima: FPC Connector, Bilangan Kedudukan: 40, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

IPC0076

bahagian bahagian: 13919

Jenis Papan Proto: SMD to DIP, Pakej Diterima: MSOP, Bilangan Kedudukan: 8, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Chip Quik Inc.

DR050D254P060

bahagian bahagian: 8186

Jenis Papan Proto: SMD to DIP, Pakej Diterima: 0.5mm Connector, Bilangan Kedudukan: 60, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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Pi Supply

PIS-0835

bahagian bahagian: 465

Jenis Papan Proto: Connector to Plated Through Hole, Pakej Diterima: Connector,

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Texas Instruments

DIP-ADAPTER-EVM

bahagian bahagian: 7066

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: MSOP, SC70, SOIC, SOT23, SOT563, TSSOP, Bilangan Kedudukan: 8,

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Logical Systems Inc.

PA-SSD3SM18-14

bahagian bahagian: 10487

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, TSSOP, Bilangan Kedudukan: 14, Pitch: 0.026" (0.65mm),

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SparkFun Electronics

TOL-09419

bahagian bahagian: 7375

Jenis Papan Proto: Connector to Plated Through Hole, Pakej Diterima: microSD™ Card, Bilangan Kedudukan: 8, Pitch: 0.100" (2.54mm),

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Aries Electronics

LCQT-SOIC16

bahagian bahagian: 17202

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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