Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 16, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 14, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: VSSOP, Bilangan Kedudukan: 8, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: Through Hole to SIP, Pakej Diterima: Non Specific, Bilangan Kedudukan: 6, Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,
Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32",
Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32",
Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOT23, Bilangan Kedudukan: 6, Pitch: 0.037" (0.95mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,
