Penyesuai, Papan Pecah

PA-SOD3SM18-20

PA-SOD3SM18-20

bahagian bahagian: 7357

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32",

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PA-SSD3SM18-24

PA-SSD3SM18-24

bahagian bahagian: 6119

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, TSSOP, Bilangan Kedudukan: 24, Pitch: 0.026" (0.65mm),

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PA-SOD3SM18-24

PA-SOD3SM18-24

bahagian bahagian: 6133

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 24, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32",

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PA-SSD3SM18-20

PA-SSD3SM18-20

bahagian bahagian: 7367

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, TSSOP, Bilangan Kedudukan: 20, Pitch: 0.026" (0.65mm),

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PA-SOD3SM18-14

PA-SOD3SM18-14

bahagian bahagian: 10544

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 14, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.031" (0.79mm) 1/32",

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PA0005

PA0005

bahagian bahagian: 17912

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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LS0003

LS0003

bahagian bahagian: 124125

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOT-23, Bilangan Kedudukan: 5, Pitch: 0.037" (0.95mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0004

PA0004

bahagian bahagian: 21063

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 14, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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IPC0079

IPC0079

bahagian bahagian: 10683

Jenis Papan Proto: SMD to DIP, Pakej Diterima: MSOP, Bilangan Kedudukan: 16, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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IPC0051

IPC0051

bahagian bahagian: 13928

Jenis Papan Proto: SMD to DIP, Pakej Diterima: PowerSOIC, PSOP, HSOP, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0027

PA0027

bahagian bahagian: 17953

Jenis Papan Proto: SMD to DIP, Pakej Diterima: MSOP, uMAX, uSOP, Bilangan Kedudukan: 10, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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IPC0067

IPC0067

bahagian bahagian: 12677

Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, Bilangan Kedudukan: 10, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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FPC100P020

FPC100P020

bahagian bahagian: 15298

Jenis Papan Proto: SMD to DIP, Pakej Diterima: FPC Connector, Bilangan Kedudukan: 20, Pitch: 0.039" (1.00mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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DC0805T-10X

DC0805T-10X

bahagian bahagian: 15031

Jenis Papan Proto: SMD to DIP, Pakej Diterima: 0805, Bilangan Kedudukan: 2, Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

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PA0193

PA0193

bahagian bahagian: 13843

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 16, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0036

PA0036

bahagian bahagian: 13939

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 24, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PCB3001-1

PCB3001-1

bahagian bahagian: 23029

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, SOP, Bilangan Kedudukan: 28, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0086

PA0086

bahagian bahagian: 27298

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOT-23, SC-59, SC-74A, Bilangan Kedudukan: 5, Pitch: 0.037" (0.95mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0089

PA0089

bahagian bahagian: 22995

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOT-23, TSOT, Bilangan Kedudukan: 8, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0035

PA0035

bahagian bahagian: 15350

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 20, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0003

PA0003

bahagian bahagian: 21080

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 14, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0009

PA0009

bahagian bahagian: 13848

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 24, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0032

PA0032

bahagian bahagian: 23036

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 8, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PCB3008-1

PCB3008-1

bahagian bahagian: 22967

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 14, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0085

PA0085

bahagian bahagian: 27278

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOT-23, SC-59, Bilangan Kedudukan: 6, Pitch: 0.037" (0.95mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PCB3007-1

PCB3007-1

bahagian bahagian: 35045

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOT-23, Bilangan Kedudukan: 6, Pitch: 0.037" (0.95mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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FPC050P010

FPC050P010

bahagian bahagian: 19896

Jenis Papan Proto: SMD to DIP, Pakej Diterima: FPC Connector, Bilangan Kedudukan: 10, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PCB3005A1

PCB3005A1

bahagian bahagian: 35097

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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PA0026

PA0026

bahagian bahagian: 20990

Jenis Papan Proto: SMD to DIP, Pakej Diterima: MSOP, uMAX, uSOP, Bilangan Kedudukan: 8, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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US-4008

US-4008

bahagian bahagian: 45254

Jenis Papan Proto: Through Hole to SIP, Pakej Diterima: Non Specific, Bilangan Kedudukan: 8, Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

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FIT0291

FIT0291

bahagian bahagian: 77154

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOP, Bilangan Kedudukan: 8, 16, 28, Ketebalan Papan: 0.060" (1.52mm),

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LCQT-SOIC16W

LCQT-SOIC16W

bahagian bahagian: 17171

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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LCQT-SOIC14

LCQT-SOIC14

bahagian bahagian: 18044

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 14, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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LCQT-MSOP10

LCQT-MSOP10

bahagian bahagian: 22767

Jenis Papan Proto: SMD to DIP, Pakej Diterima: MSOP, Bilangan Kedudukan: 10, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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LCQT-TSSOP16

LCQT-TSSOP16

bahagian bahagian: 17161

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 16, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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LCQT-SOIC28

LCQT-SOIC28

bahagian bahagian: 10227

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 28, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

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