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Penyesuai, Papan Pecah

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  • Penyesuai, Papan Pecah
IPC0151
Chip Quik Inc.

IPC0151

bahagian bahagian: 10785

Jenis Papan Proto: SMD to DIP, Pakej Diterima: MSOP, Bilangan Kedudukan: 12, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0172
Chip Quik Inc.

IPC0172

bahagian bahagian: 12246

Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, MLP, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0188
Chip Quik Inc.

IPC0188

bahagian bahagian: 7377

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 28, Pitch: 0.026" (0.65mm),

Senarai harapan
IPC0173
Chip Quik Inc.

IPC0173

bahagian bahagian: 9548

Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, Bilangan Kedudukan: 8, Pitch: 0.038" (0.97mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0178
Chip Quik Inc.

IPC0178

bahagian bahagian: 7118

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 56, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0176
Chip Quik Inc.

IPC0176

bahagian bahagian: 10326

Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, Bilangan Kedudukan: 12, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0177
Chip Quik Inc.

IPC0177

bahagian bahagian: 7926

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 48, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0163
Chip Quik Inc.

IPC0163

bahagian bahagian: 8789

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 32, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0164
Chip Quik Inc.

IPC0164

bahagian bahagian: 12224

Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, Bilangan Kedudukan: 8, Pitch: 0.018" (0.45mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0122
Chip Quik Inc.

PA0122

bahagian bahagian: 4498

Jenis Papan Proto: SMD to PGA, Pakej Diterima: LQFP, Bilangan Kedudukan: 128, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0158
Chip Quik Inc.

IPC0158

bahagian bahagian: 7401

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 24, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0108
Chip Quik Inc.

PA0108

bahagian bahagian: 5048

Jenis Papan Proto: SMD to PGA, Pakej Diterima: LCC, JLCC, PLCC, Bilangan Kedudukan: 68, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0155
Chip Quik Inc.

IPC0155

bahagian bahagian: 10293

Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, Bilangan Kedudukan: 12, Pitch: 0.016" (0.40mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0165
Chip Quik Inc.

IPC0165

bahagian bahagian: 34

Jenis Papan Proto: SMD to DIP, Bilangan Kedudukan: 6, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0183
Chip Quik Inc.

IPC0183

bahagian bahagian: 8333

Jenis Papan Proto: SMD to DIP, Pakej Diterima: PowerSOIC, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0154
Chip Quik Inc.

IPC0154

bahagian bahagian: 9372

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 12, Pitch: 0.016" (0.40mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0110
Chip Quik Inc.

PA0110

bahagian bahagian: 4664

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LQFP, TQFP, Bilangan Kedudukan: 80, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0090
Chip Quik Inc.

PA0090

bahagian bahagian: 27230

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSOC, Bilangan Kedudukan: 6, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0223
Chip Quik Inc.

PA0223

bahagian bahagian: 3844

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TQFP, Bilangan Kedudukan: 100, Pitch: 0.016" (0.40mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
CN0010
Chip Quik Inc.

CN0010

bahagian bahagian: 13861

Jenis Papan Proto: Connector to SIP, Pakej Diterima: USB - mini B, Bilangan Kedudukan: 5, Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DC0805S-10X
Chip Quik Inc.

DC0805S-10X

bahagian bahagian: 14959

Jenis Papan Proto: SMD to DIP, Pakej Diterima: 0805, Bilangan Kedudukan: 2, Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

Senarai harapan
CN0008
Chip Quik Inc.

CN0008

bahagian bahagian: 13883

Jenis Papan Proto: Connector to SIP, Pakej Diterima: USB - micro AB, Bilangan Kedudukan: 5, Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0007
Chip Quik Inc.

PA0007

bahagian bahagian: 15660

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 18, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DC0603S-10X
Chip Quik Inc.

DC0603S-10X

bahagian bahagian: 15001

Jenis Papan Proto: SMD to DIP, Pakej Diterima: 0603, Bilangan Kedudukan: 2, Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0105SOCKET
Chip Quik Inc.

PA0105SOCKET

bahagian bahagian: 4638

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LCC, JLCC, PLCC, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA-TQFP-BB001-1
Chip Quik Inc.

PA-TQFP-BB001-1

bahagian bahagian: 4999

Jenis Papan Proto: SMD to PGA, Pakej Diterima: TQFP, Bilangan Kedudukan: 48, 64, 80, 100, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DC1210S-10X
Chip Quik Inc.

DC1210S-10X

bahagian bahagian: 14970

Jenis Papan Proto: SMD to DIP, Pakej Diterima: 1210, Bilangan Kedudukan: 2, Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

Senarai harapan
F200T254P16
Chip Quik Inc.

F200T254P16

bahagian bahagian: 24575

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Bilangan Kedudukan: 16, Pitch: 0.079" (2.00mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
CN0020
Chip Quik Inc.

CN0020

bahagian bahagian: 13888

Jenis Papan Proto: Connector to SIP, Pakej Diterima: 2.5mm ID, 5.5mm OD Plug, Bilangan Kedudukan: 3, Pitch: 0.098" (2.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0065
Chip Quik Inc.

PA0065

bahagian bahagian: 9988

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 28, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DR050D254P040
Chip Quik Inc.

DR050D254P040

bahagian bahagian: 10726

Jenis Papan Proto: SMD to DIP, Pakej Diterima: 0.5mm Connector, Bilangan Kedudukan: 40, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0219SOCKET
Chip Quik Inc.

PA0219SOCKET

bahagian bahagian: 3587

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LCC, JLCC, PLCC, Bilangan Kedudukan: 52, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
CN0036
Chip Quik Inc.

CN0036

bahagian bahagian: 3004

Jenis Papan Proto: Connector to DIP, Pakej Diterima: Header, Bilangan Kedudukan: 120, Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0107
Chip Quik Inc.

IPC0107

bahagian bahagian: 8238

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 24, Pitch: 0.016" (0.40mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DC1210T-10X
Chip Quik Inc.

DC1210T-10X

bahagian bahagian: 14954

Jenis Papan Proto: SMD to DIP, Pakej Diterima: 1210, Bilangan Kedudukan: 2, Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

Senarai harapan
DC1813T-10X
Chip Quik Inc.

DC1813T-10X

bahagian bahagian: 14996

Jenis Papan Proto: SMD to DIP, Pakej Diterima: 1813, Bilangan Kedudukan: 2, Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

Senarai harapan