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Penyesuai, Papan Pecah

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  • Penyesuai, Papan Pecah
DC1206S-10X
Chip Quik Inc.

DC1206S-10X

bahagian bahagian: 14966

Jenis Papan Proto: SMD to DIP, Pakej Diterima: 1206, Bilangan Kedudukan: 2, Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

Senarai harapan
DR254D254P10M
Chip Quik Inc.

DR254D254P10M

bahagian bahagian: 11671

Jenis Papan Proto: Connector to DIP, Pakej Diterima: 2.54mm Header, Bilangan Kedudukan: 10, Pitch: 0.100" (2.54mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DR127D254P40M
Chip Quik Inc.

DR127D254P40M

bahagian bahagian: 3617

Jenis Papan Proto: Connector to DIP, Pakej Diterima: 1.27mm Header, Bilangan Kedudukan: 40, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0106SOCKET
Chip Quik Inc.

PA0106SOCKET

bahagian bahagian: 4422

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LCC, JLCC, PLCC, Bilangan Kedudukan: 28, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DR127D254P40F
Chip Quik Inc.

DR127D254P40F

bahagian bahagian: 3654

Jenis Papan Proto: Connector to DIP, Pakej Diterima: 1.27mm Header, Bilangan Kedudukan: 40, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
CN0072
Chip Quik Inc.

CN0072

bahagian bahagian: 236

Jenis Papan Proto: Connector to Plated Through Hole, Bilangan Kedudukan: 200, Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0072
Chip Quik Inc.

IPC0072

bahagian bahagian: 10690

Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, Bilangan Kedudukan: 14, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0190
Chip Quik Inc.

PA0190

bahagian bahagian: 4884

Jenis Papan Proto: SMD to PGA, Pakej Diterima: TQFP, Bilangan Kedudukan: 128, Pitch: 0.016" (0.40mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0189
Chip Quik Inc.

PA0189

bahagian bahagian: 4553

Jenis Papan Proto: SMD to PGA, Pakej Diterima: LQFP, Bilangan Kedudukan: 176, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DR127D254P20F
Chip Quik Inc.

DR127D254P20F

bahagian bahagian: 7406

Jenis Papan Proto: Connector to DIP, Pakej Diterima: 1.27mm Header, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0017
Chip Quik Inc.

PA0017

bahagian bahagian: 17972

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 16, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DR200D254P20F
Chip Quik Inc.

DR200D254P20F

bahagian bahagian: 7752

Jenis Papan Proto: Connector to DIP, Pakej Diterima: 2.00mm Header, Bilangan Kedudukan: 20, Pitch: 0.079" (2.00mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0210
Chip Quik Inc.

PA0210

bahagian bahagian: 7760

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSOP, Bilangan Kedudukan: 54, Pitch: 0.031" (0.80mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DR127D254P20M
Chip Quik Inc.

DR127D254P20M

bahagian bahagian: 7333

Jenis Papan Proto: Connector to DIP, Pakej Diterima: 1.27mm Header, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DC0402S-10X
Chip Quik Inc.

DC0402S-10X

bahagian bahagian: 14949

Jenis Papan Proto: SMD to DIP, Pakej Diterima: 0402, Bilangan Kedudukan: 2, Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0071
Chip Quik Inc.

PA0071

bahagian bahagian: 7042

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 40, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0103
Chip Quik Inc.

IPC0103

bahagian bahagian: 12710

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LGA, Bilangan Kedudukan: 10, Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
F200T254P08
Chip Quik Inc.

F200T254P08

bahagian bahagian: 43355

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Bilangan Kedudukan: 8, Pitch: 0.079" (2.00mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0016
Chip Quik Inc.

PA0016

bahagian bahagian: 17943

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 14, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0092
Chip Quik Inc.

PA0092

bahagian bahagian: 8781

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TQFP, Bilangan Kedudukan: 32, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DC0805J-10X
Chip Quik Inc.

DC0805J-10X

bahagian bahagian: 337

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: 0805, Bilangan Kedudukan: 2, Pitch: 0.078" (1.98mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
CN0035
Chip Quik Inc.

CN0035

bahagian bahagian: 13917

Jenis Papan Proto: Connector to SIP, Pakej Diterima: RJ45, Ethernet Plug, Bilangan Kedudukan: 8, Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0062
Chip Quik Inc.

PA0062

bahagian bahagian: 15369

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 16, Pitch: 0.031" (0.80mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DC0402J-10X
Chip Quik Inc.

DC0402J-10X

bahagian bahagian: 308

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: 0402, Bilangan Kedudukan: 2, Pitch: 0.036" (0.91mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
CN0007
Chip Quik Inc.

CN0007

bahagian bahagian: 13878

Jenis Papan Proto: Connector to SIP, Pakej Diterima: USB - B, Bilangan Kedudukan: 4, Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0094
Chip Quik Inc.

PA0094

bahagian bahagian: 5390

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LQFP, TQFP, Bilangan Kedudukan: 48, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0107SOCKET
Chip Quik Inc.

PA0107SOCKET

bahagian bahagian: 3715

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LCC, JLCC, PLCC, Bilangan Kedudukan: 44, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0188
Chip Quik Inc.

PA0188

bahagian bahagian: 4838

Jenis Papan Proto: SMD to PGA, Pakej Diterima: LQFP, Bilangan Kedudukan: 144, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0049
Chip Quik Inc.

PA0049

bahagian bahagian: 23000

Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, MLP, Bilangan Kedudukan: 6, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
CN0030
Chip Quik Inc.

CN0030

bahagian bahagian: 13871

Jenis Papan Proto: Connector to SIP, Pakej Diterima: DB9, Bilangan Kedudukan: 9, Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0194
Chip Quik Inc.

PA0194

bahagian bahagian: 12726

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 20, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DC0603J-10X
Chip Quik Inc.

DC0603J-10X

bahagian bahagian: 418

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: 0603, Bilangan Kedudukan: 2, Pitch: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
FPC100P030
Chip Quik Inc.

FPC100P030

bahagian bahagian: 12716

Jenis Papan Proto: SMD to DIP, Pakej Diterima: FPC Connector, Bilangan Kedudukan: 30, Pitch: 0.039" (1.00mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DR127D254P10M
Chip Quik Inc.

DR127D254P10M

bahagian bahagian: 9927

Jenis Papan Proto: Connector to DIP, Pakej Diterima: 1.27mm Header, Bilangan Kedudukan: 10, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
F200T254P20
Chip Quik Inc.

F200T254P20

bahagian bahagian: 21636

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Bilangan Kedudukan: 20, Pitch: 0.079" (2.00mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0018
Chip Quik Inc.

PA0018

bahagian bahagian: 15342

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 20, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan