Menu
MelayuMelayu
Rfqs / order.
0Rfqs / order.

Penyesuai, Papan Pecah

  • Rumah
  •  
  • Penyesuai, Papan Pecah
CN0009
Chip Quik Inc.

CN0009

bahagian bahagian: 13896

Jenis Papan Proto: Connector to SIP, Pakej Diterima: USB - micro B, Bilangan Kedudukan: 5, Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0168
Chip Quik Inc.

PA0168

bahagian bahagian: 23031

Jenis Papan Proto: SMD to DIP, Pakej Diterima: MiniSOIC, Bilangan Kedudukan: 8, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0083
Chip Quik Inc.

IPC0083

bahagian bahagian: 15381

Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, Bilangan Kedudukan: 6, Pitch: 0.037" (0.95mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0011
Chip Quik Inc.

PA0011

bahagian bahagian: 12740

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 28, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0070
Chip Quik Inc.

IPC0070

bahagian bahagian: 11658

Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, Bilangan Kedudukan: 12, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0109
Chip Quik Inc.

PA0109

bahagian bahagian: 3772

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TQFP, VQFP, Bilangan Kedudukan: 100, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0113
Chip Quik Inc.

PA0113

bahagian bahagian: 4736

Jenis Papan Proto: SMD to DIP, Pakej Diterima: PQFP, TQFP, Bilangan Kedudukan: 64, Pitch: 0.031" (0.80mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0182
Chip Quik Inc.

PA0182

bahagian bahagian: 19887

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 16, Pitch: 0.025" (0.64mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0048
Chip Quik Inc.

IPC0048

bahagian bahagian: 8163

Jenis Papan Proto: SMD to DIP, Pakej Diterima: PowerSOIC, PSOP, HSOP, Bilangan Kedudukan: 24, Pitch: 0.039" (1.00mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DR050D254P020
Chip Quik Inc.

DR050D254P020

bahagian bahagian: 15322

Jenis Papan Proto: SMD to DIP, Pakej Diterima: 0.5mm Connector, Bilangan Kedudukan: 20, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
F127T254P16
Chip Quik Inc.

F127T254P16

bahagian bahagian: 24587

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Bilangan Kedudukan: 16, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0093
Chip Quik Inc.

PA0093

bahagian bahagian: 7062

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LQFP, PQFP, TQFP, VQFP, Bilangan Kedudukan: 44, Pitch: 0.031" (0.80mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DC2010J-10X
Chip Quik Inc.

DC2010J-10X

bahagian bahagian: 426

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: 2010, Bilangan Kedudukan: 2, Pitch: 0.185" (4.70mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0019
Chip Quik Inc.

PA0019

bahagian bahagian: 13907

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 24, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0012
Chip Quik Inc.

IPC0012

bahagian bahagian: 8821

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 20, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DC2512J-10X
Chip Quik Inc.

DC2512J-10X

bahagian bahagian: 548

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: 2512, Bilangan Kedudukan: 2, Pitch: 0.240" (6.10mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
DC1813J-10X
Chip Quik Inc.

DC1813J-10X

bahagian bahagian: 595

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: 1813, Bilangan Kedudukan: 2, Pitch: 0.161" (4.09mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0195
Chip Quik Inc.

PA0195

bahagian bahagian: 10707

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 28, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
CN0006
Chip Quik Inc.

CN0006

bahagian bahagian: 13905

Jenis Papan Proto: Connector to SIP, Pakej Diterima: USB - A, Bilangan Kedudukan: 4, Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
FPC050P050
Chip Quik Inc.

FPC050P050

bahagian bahagian: 9354

Jenis Papan Proto: SMD to DIP, Pakej Diterima: FPC Connector, Bilangan Kedudukan: 50, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DC2413J-10X
Chip Quik Inc.

DC2413J-10X

bahagian bahagian: 597

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: 2413, Bilangan Kedudukan: 2, Pitch: 0.191" (4.85mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0036
Chip Quik Inc.

IPC0036

bahagian bahagian: 12689

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 10, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0091
Chip Quik Inc.

PA0091

bahagian bahagian: 9947

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LQFP, TQFP, Bilangan Kedudukan: 32, Pitch: 0.031" (0.80mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DC1210J-10X
Chip Quik Inc.

DC1210J-10X

bahagian bahagian: 632

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: 1210, Bilangan Kedudukan: 2, Pitch: 0.118" (3.00mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0064
Chip Quik Inc.

PA0064

bahagian bahagian: 12719

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN THIN, Bilangan Kedudukan: 24, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
F127T254P20
Chip Quik Inc.

F127T254P20

bahagian bahagian: 21680

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0096
Chip Quik Inc.

IPC0096

bahagian bahagian: 11683

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LGA, Bilangan Kedudukan: 12, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0020
Chip Quik Inc.

IPC0020

bahagian bahagian: 7026

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 32, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
CN0073
Chip Quik Inc.

CN0073

bahagian bahagian: 584

Jenis Papan Proto: Connector to DIP, Pakej Diterima: USB - C, Bilangan Kedudukan: 24, Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0067
Chip Quik Inc.

PA0067

bahagian bahagian: 8806

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 32, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0186
Chip Quik Inc.

PA0186

bahagian bahagian: 13917

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TO-263 (DDPAK/D2PAK), Bilangan Kedudukan: 7, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PCB3006-1
Chip Quik Inc.

PCB3006-1

bahagian bahagian: 17571

Jenis Papan Proto: SMD to PGA, Pakej Diterima: QFP, Bilangan Kedudukan: 48, 64, 80, 100, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0049
Chip Quik Inc.

IPC0049

bahagian bahagian: 9356

Jenis Papan Proto: SMD to DIP, Pakej Diterima: PowerSOIC, PSOP, HSOP, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0107
Chip Quik Inc.

PA0107

bahagian bahagian: 5081

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LCC, JLCC, PLCC, Bilangan Kedudukan: 44, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0185
Chip Quik Inc.

PA0185

bahagian bahagian: 15289

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TO-263 (DDPAK/D2PAK), Bilangan Kedudukan: 5, Pitch: 0.067" (1.70mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DC1411J-10X
Chip Quik Inc.

DC1411J-10X

bahagian bahagian: 625

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: 1411, Bilangan Kedudukan: 2, Pitch: 0.114" (2.90mm), Bahan: FR4 Epoxy Glass,

Senarai harapan