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Penyesuai, Papan Pecah

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  • Penyesuai, Papan Pecah
PA0240
Chip Quik Inc.

PA0240

bahagian bahagian: 5392

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LQFP, Bilangan Kedudukan: 48, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0103
Chip Quik Inc.

PA0103

bahagian bahagian: 11690

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LGA, Bilangan Kedudukan: 16, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0020
Chip Quik Inc.

PA0020

bahagian bahagian: 12697

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SSOP, Bilangan Kedudukan: 28, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
FPC030P025
Chip Quik Inc.

FPC030P025

bahagian bahagian: 10664

Jenis Papan Proto: SMD to DIP, Pakej Diterima: FPC Connector, Bilangan Kedudukan: 25, Pitch: 0.012" (0.30mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0039
Chip Quik Inc.

PA0039

bahagian bahagian: 10643

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 38, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
F200T254P10
Chip Quik Inc.

F200T254P10

bahagian bahagian: 38839

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Bilangan Kedudukan: 10, Pitch: 0.079" (2.00mm), 0.100" (2.54mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
DC2220J-10X
Chip Quik Inc.

DC2220J-10X

bahagian bahagian: 608

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: 2220, Bilangan Kedudukan: 2, Pitch: 0.209" (5.31mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
DC1206J-10X
Chip Quik Inc.

DC1206J-10X

bahagian bahagian: 543

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: 1206, Bilangan Kedudukan: 2, Pitch: 0.122" (3.10mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0088
Chip Quik Inc.

IPC0088

bahagian bahagian: 13898

Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, Bilangan Kedudukan: 10, Pitch: 0.016" (0.40mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
CN0023
Chip Quik Inc.

CN0023

bahagian bahagian: 6982

Jenis Papan Proto: Connector to SIP, Pakej Diterima: microSD™ Card, Bilangan Kedudukan: 10, Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DR127D254P10F
Chip Quik Inc.

DR127D254P10F

bahagian bahagian: 9992

Jenis Papan Proto: Connector to DIP, Pakej Diterima: 1.27mm Header, Bilangan Kedudukan: 10, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0041
Chip Quik Inc.

PA0041

bahagian bahagian: 8226

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 56, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DC0603T-10X
Chip Quik Inc.

DC0603T-10X

bahagian bahagian: 14958

Jenis Papan Proto: SMD to DIP, Pakej Diterima: 0603, Bilangan Kedudukan: 2, Ketebalan Papan: 0.031" (0.79mm) 1/32", Bahan: FR4 Epoxy Glass,

Senarai harapan
DC2924J-10X
Chip Quik Inc.

DC2924J-10X

bahagian bahagian: 553

Jenis Papan Proto: SMD to Plated Through Hole, Pakej Diterima: 2924, Bilangan Kedudukan: 2, Pitch: 0.245" (6.22mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0040
Chip Quik Inc.

PA0040

bahagian bahagian: 9955

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 48, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
F127T254P04
Chip Quik Inc.

F127T254P04

bahagian bahagian: 67219

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Bilangan Kedudukan: 4, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0088
Chip Quik Inc.

PA0088

bahagian bahagian: 27278

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SC-70, SOT-353, Bilangan Kedudukan: 5, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0142
Chip Quik Inc.

IPC0142

bahagian bahagian: 21036

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOP, Bilangan Kedudukan: 8, Pitch: 0.100" (2.54mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
F127T254P06
Chip Quik Inc.

F127T254P06

bahagian bahagian: 49160

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Bilangan Kedudukan: 6, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0063
Chip Quik Inc.

PA0063

bahagian bahagian: 13877

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QFN, Bilangan Kedudukan: 20, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
FPC030P045
Chip Quik Inc.

FPC030P045

bahagian bahagian: 8231

Jenis Papan Proto: SMD to DIP, Pakej Diterima: FPC Connector, Bilangan Kedudukan: 45, Pitch: 0.012" (0.30mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
FPC050P020
Chip Quik Inc.

FPC050P020

bahagian bahagian: 15309

Jenis Papan Proto: SMD to DIP, Pakej Diterima: FPC Connector, Bilangan Kedudukan: 20, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0030
Chip Quik Inc.

PA0030

bahagian bahagian: 12681

Jenis Papan Proto: SMD to DIP, Pakej Diterima: QSOP, Bilangan Kedudukan: 24, Pitch: 0.025" (0.64mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
F127T254P08
Chip Quik Inc.

F127T254P08

bahagian bahagian: 43340

Jenis Papan Proto: Plated Through Hole to Plated Through Hole, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.063" (1.60mm), Bahan: FR4 Epoxy Glass,

Senarai harapan
FPC050P040
Chip Quik Inc.

FPC050P040

bahagian bahagian: 10630

Jenis Papan Proto: SMD to DIP, Pakej Diterima: FPC Connector, Bilangan Kedudukan: 40, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0076
Chip Quik Inc.

IPC0076

bahagian bahagian: 13919

Jenis Papan Proto: SMD to DIP, Pakej Diterima: MSOP, Bilangan Kedudukan: 8, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
DR050D254P060
Chip Quik Inc.

DR050D254P060

bahagian bahagian: 8186

Jenis Papan Proto: SMD to DIP, Pakej Diterima: 0.5mm Connector, Bilangan Kedudukan: 60, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
IPC0061
Chip Quik Inc.

IPC0061

bahagian bahagian: 13870

Jenis Papan Proto: SMD to DIP, Pakej Diterima: DFN, Bilangan Kedudukan: 8, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
LS0002
Chip Quik Inc.

LS0002

bahagian bahagian: 124131

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOT-23, Bilangan Kedudukan: 5, Pitch: 0.037" (0.95mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0037
Chip Quik Inc.

PA0037

bahagian bahagian: 12740

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TSSOP, Bilangan Kedudukan: 28, Pitch: 0.026" (0.65mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0101
Chip Quik Inc.

PA0101

bahagian bahagian: 15303

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LGA, Bilangan Kedudukan: 14, Pitch: 0.031" (0.80mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0008
Chip Quik Inc.

PA0008

bahagian bahagian: 15697

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 20, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0096
Chip Quik Inc.

PA0096

bahagian bahagian: 4683

Jenis Papan Proto: SMD to DIP, Pakej Diterima: LQFP, TQFP, VQFP, Bilangan Kedudukan: 64, Pitch: 0.020" (0.50mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0002
Chip Quik Inc.

PA0002

bahagian bahagian: 21063

Jenis Papan Proto: SMD to DIP, Pakej Diterima: SOIC, Bilangan Kedudukan: 8, Pitch: 0.050" (1.27mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
PA0184
Chip Quik Inc.

PA0184

bahagian bahagian: 17522

Jenis Papan Proto: SMD to DIP, Pakej Diterima: TO-263 (DDPAK/D2PAK), Bilangan Kedudukan: 3, Pitch: 0.100" (2.54mm), Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan
CN0029
Chip Quik Inc.

CN0029

bahagian bahagian: 13942

Jenis Papan Proto: Connector to SIP, Pakej Diterima: DB9, Bilangan Kedudukan: 9, Ketebalan Papan: 0.062" (1.57mm) 1/16", Bahan: FR4 Epoxy Glass,

Senarai harapan