Pateri | Produk Pematerian, Pematrian, Pengerjaan Semula | 32

4925-112G

bahagian bahagian: 2215

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4912-227G

bahagian bahagian: 1239

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.020" (0.51mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean, Wire Gauge: 24 AWG, 25 SWG,

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MG Chemicals

4875-227G

bahagian bahagian: 2546

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.032" (0.81mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4902P-25G

bahagian bahagian: 2701

Jenis: Solder Paste, Komposisi: Bi57Sn42Ag1 (57/42/1), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

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MG Chemicals

4926-112G

bahagian bahagian: 2226

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.040" (1.02mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 18 AWG, 19 SWG,

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MG Chemicals

4917-227G

bahagian bahagian: 1274

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.062" (1.57mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean, Wire Gauge: 14 AWG, 16 SWG,

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MG Chemicals

4898-227G

bahagian bahagian: 2580

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.062" (1.57mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 14 AWG, 16 SWG,

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MG Chemicals

4944-454G

bahagian bahagian: 1303

Jenis: Wire Solder, Komposisi: Sn99.5Cu0.5 (99.5/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 442°F (228°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4875-454G

bahagian bahagian: 1645

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.032" (0.81mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4895-454G

bahagian bahagian: 1623

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.032" (0.81mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4916-112G

bahagian bahagian: 2208

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.050" (1.27mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,

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MG Chemicals

4942-112G

bahagian bahagian: 3443

Jenis: Wire Solder, Komposisi: Sn99.5Cu0.5 (99.5/0.5), Diameter: 0.020" (0.51mm), Takat lebur: 442°F (228°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 24 AWG, 25 SWG,

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MG Chemicals

4884-454G

bahagian bahagian: 1647

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.025" (0.64mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 22 AWG, 23 SWG,

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MG Chemicals

4896-227G

bahagian bahagian: 2595

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.040" (1.02mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 18 AWG, 19 SWG,

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MG Chemicals

4894-227G

bahagian bahagian: 2576

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.025" (0.64mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 22 AWG, 23 SWG,

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MG Chemicals

4886-227G

bahagian bahagian: 2586

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.040" (1.02mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 18 AWG, 19 SWG,

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MG Chemicals

4895-227G

bahagian bahagian: 2573

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.032" (0.81mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4915-112G

bahagian bahagian: 2219

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.040" (1.02mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean, Wire Gauge: 18 AWG, 19 SWG,

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MG Chemicals

4935-112G

bahagian bahagian: 3734

Jenis: Wire Solder, Komposisi: Sn99.5Cu0.5 (99.5/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 442°F (228°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4884-227G

bahagian bahagian: 2594

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.025" (0.64mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 22 AWG, 23 SWG,

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MG Chemicals

4900-112G

bahagian bahagian: 2154

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4901-112G

bahagian bahagian: 3081

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.032" (0.81mm), Takat lebur: 442°F (227°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4865-454G

bahagian bahagian: 1668

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4900P-25G

bahagian bahagian: 2572

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean,

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MG Chemicals

4902P-15G

bahagian bahagian: 4044

Jenis: Solder Paste, Komposisi: Bi57Sn42Ag1 (57/42/1), Takat lebur: 281°F (138°C), Jenis Flux: No-Clean,

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MG Chemicals

4944-112G

bahagian bahagian: 3750

Jenis: Wire Solder, Komposisi: Sn99.5Cu0.5 (99.5/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 442°F (228°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4880-18G

bahagian bahagian: 15576

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4901-227G

bahagian bahagian: 1823

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.032" (0.81mm), Takat lebur: 442°F (227°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4860-18G

bahagian bahagian: 18104

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.032" (0.81mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4901-454G

bahagian bahagian: 1183

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.032" (0.81mm), Takat lebur: 442°F (227°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4900-35G

bahagian bahagian: 12135

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 423 ~ 430°F (217 ~ 221°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4890-18G

bahagian bahagian: 15610

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.032" (0.81mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 20 AWG, 21 SWG,

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MG Chemicals

4870-18G

bahagian bahagian: 15530

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.032" (0.81mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

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Multicore

450314

bahagian bahagian: 1924

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.022" (0.56mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

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Multicore

421562

bahagian bahagian: 2282

Jenis: Wire Solder, Diameter: 0.040" (1.02mm), Jenis Flux: No-Clean, Wire Gauge: 18 AWG, 19 SWG,

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Multicore

403674

bahagian bahagian: 4559

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.015" (0.38mm), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 27 AWG, 28 SWG,

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