Pateri

544784

bahagian bahagian: 2648

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang

536290

bahagian bahagian: 178

Jenis: Wire Solder, Komposisi: Sn97Cu3 (97/3), Diameter: 0.128" (3.25mm), Wire Gauge: 8 AWG, 10 SWG,

Bersenang-senang

568759

bahagian bahagian: 7001

Jenis: Wire Solder, Komposisi: Sn50Pb48.5Cu1.5 (50/48.5/1.5), Diameter: 0.048" (1.22mm), Takat lebur: 361 ~ 420°F (183 ~ 216°C), Jenis Flux: Rosin Activated (RA), Wire Gauge: 16 AWG, 18 SWG,

Bersenang-senang

554889

bahagian bahagian: 9039

Jenis: Bar Solder, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C),

Bersenang-senang

583489

bahagian bahagian: 9083

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang

550014

bahagian bahagian: 6912

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang

662727

bahagian bahagian: 1880

Jenis: Solder Paste, Jenis Flux: No-Clean,

Bersenang-senang

692857

bahagian bahagian: 1257

Jenis: Wire Solder, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Diameter: 0.032" (0.81mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Bersenang-senang

605500

bahagian bahagian: 2228

Jenis: Wire Solder, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Diameter: 0.022" (0.56mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

Bersenang-senang

673832

bahagian bahagian: 1097

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.064" (1.63mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 14 AWG, 16 SWG,

Bersenang-senang

673831

bahagian bahagian: 1016

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.048" (1.22mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,

Bersenang-senang

673828

bahagian bahagian: 1703

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.022" (0.56mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

Bersenang-senang

673829

bahagian bahagian: 1036

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 20 AWG, 21 SWG,

Bersenang-senang

680290

bahagian bahagian: 2194

Jenis: Bar Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Takat lebur: 440 ~ 464°F (227 ~ 240°C),

Bersenang-senang

721473

bahagian bahagian: 2015

Jenis: Solder Paste, Jenis Flux: No-Clean,

Bersenang-senang

732997

bahagian bahagian: 1370

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.032" (0.81mm), Takat lebur: 423°F (217°C), Jenis Flux: Water Soluble, Wire Gauge: 20 AWG, 21 SWG,

Bersenang-senang

732999

bahagian bahagian: 1406

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.048" (1.22mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,

Bersenang-senang

716856

bahagian bahagian: 1151

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.064" (1.63mm), Takat lebur: 440 ~ 464°F (227 ~ 240°C), Jenis Flux: No-Clean, Wire Gauge: 14 AWG, 16 SWG,

Bersenang-senang

733024

bahagian bahagian: 2200

Jenis: Wire Solder, Komposisi: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Diameter: 0.022" (0.56mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

Bersenang-senang

727190

bahagian bahagian: 1836

Jenis: Wire Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Diameter: 0.022" (0.56mm), Takat lebur: 440 ~ 464°F (227 ~ 240°C), Jenis Flux: No-Clean, Wire Gauge: 23 AWG, 24 SWG,

Bersenang-senang

4877-227G

bahagian bahagian: 9099

Jenis: Wire Solder, Komposisi: Sn60Pb40 (60/40), Diameter: 0.050" (1.27mm), Takat lebur: 361 ~ 376°F (183 ~ 191°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,

Bersenang-senang

4867-227G

bahagian bahagian: 6949

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.050" (1.27mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 16 AWG, 18 SWG,

Bersenang-senang

4866-227G

bahagian bahagian: 6971

Jenis: Wire Solder, Komposisi: Sn63Pb37 (63/37), Diameter: 0.040" (1.02mm), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean, Wire Gauge: 18 AWG, 19 SWG,

Bersenang-senang

4901-2LB

bahagian bahagian: 9113

Jenis: Bar Solder, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Takat lebur: 442°F (227°C), Jenis Flux: No-Clean,

Bersenang-senang

57-3201-5515

bahagian bahagian: 486

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang

57-3343-8109

bahagian bahagian: 9046

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C),

Bersenang-senang

57-3901-5607

bahagian bahagian: 1194

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang

57-3201-4815

bahagian bahagian: 526

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang

70-1708-0520

bahagian bahagian: 34

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang

70-4823-0910

bahagian bahagian: 59

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang

70-1002-0510

bahagian bahagian: 1046

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang