Pateri

70-4823-0911

70-4823-0911

bahagian bahagian: 147

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0102-0618

70-0102-0618

bahagian bahagian: 9247

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
70-2102-0618

70-2102-0618

bahagian bahagian: 9195

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-1506-1710

70-1506-1710

bahagian bahagian: 9254

Jenis: Solder Paste, Komposisi: Sn95Sb5 (95/5), Takat lebur: 450 ~ 464°F (232 ~ 240°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0605-0922

70-0605-0922

bahagian bahagian: 9215

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-1506-1510

70-1506-1510

bahagian bahagian: 9260

Jenis: Solder Paste, Komposisi: Sn96.3Ag3.7 (96.3/3.7), Takat lebur: 430 ~ 444°F (221 ~ 223°C), Jenis Flux: No-Clean,

Bersenang-senang
70-2102-0518

70-2102-0518

bahagian bahagian: 9190

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-1003-0618

70-1003-0618

bahagian bahagian: 9184

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-0102-0518

70-0102-0518

bahagian bahagian: 9227

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
70-1903-0819

70-1903-0819

bahagian bahagian: 9230

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-3205-1812

70-3205-1812

bahagian bahagian: 9230

Jenis: Solder Paste, Komposisi: Sn99Cu0.7Ag0.3 (99/0.7/0.3), Jenis Flux: No-Clean,

Bersenang-senang
70-1903-0911

70-1903-0911

bahagian bahagian: 9164

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-0605-0819

70-0605-0819

bahagian bahagian: 9205

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0403-0824

70-0403-0824

bahagian bahagian: 9191

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-1903-0811

70-1903-0811

bahagian bahagian: 9165

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-3205-0819

70-3205-0819

bahagian bahagian: 9236

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-2002-0611

70-2002-0611

bahagian bahagian: 9229

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-2002-0511

70-2002-0511

bahagian bahagian: 9185

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-4021-0819

70-4021-0819

bahagian bahagian: 9238

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-4105-0819

70-4105-0819

bahagian bahagian: 9173

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0102-0519

70-0102-0519

bahagian bahagian: 9169

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
70-4105-0919

70-4105-0919

bahagian bahagian: 9186

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-4021-0919

70-4021-0919

bahagian bahagian: 9179

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0202-0519

70-0202-0519

bahagian bahagian: 9199

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
70-1003-0519

70-1003-0519

bahagian bahagian: 9235

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-2102-0311

70-2102-0311

bahagian bahagian: 9157

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-0605-0911

70-0605-0911

bahagian bahagian: 9241

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-4006-2011

70-4006-2011

bahagian bahagian: 9208

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0306-0810

70-0306-0810

bahagian bahagian: 9160

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-2102-0519

70-2102-0519

bahagian bahagian: 9199

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-1002-0311

70-1002-0311

bahagian bahagian: 9237

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-0102-0411

70-0102-0411

bahagian bahagian: 9160

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean,

Bersenang-senang
732998

732998

bahagian bahagian: 1045

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.064" (1.63mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 14 AWG, 16 SWG,

Bersenang-senang
732977

732977

bahagian bahagian: 1027

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.064" (1.63mm), Takat lebur: 423°F (217°C), Jenis Flux: Water Soluble, Wire Gauge: 14 AWG, 16 SWG,

Bersenang-senang
796065

796065

bahagian bahagian: 1423

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Takat lebur: 423°F (217°C), Jenis Flux: No-Clean, Wire Gauge: 27 AWG, 28 SWG,

Bersenang-senang
796037

796037

bahagian bahagian: 1476

Jenis: Wire Solder, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diameter: 0.015" (0.38mm), Takat lebur: 423°F (217°C), Jenis Flux: Rosin Mildly Activated (RMA), Wire Gauge: 27 AWG, 28 SWG,

Bersenang-senang