Pateri

70-1302-0511

70-1302-0511

bahagian bahagian: 9249

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA),

Bersenang-senang
70-4006-2010

70-4006-2010

bahagian bahagian: 9189

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0403-0910

70-0403-0910

bahagian bahagian: 9157

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-0403-0923

70-0403-0923

bahagian bahagian: 9223

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-0605-0811

70-0605-0811

bahagian bahagian: 6972

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0202-0311

70-0202-0311

bahagian bahagian: 5757

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean,

Bersenang-senang
70-2102-0611

70-2102-0611

bahagian bahagian: 9239

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-3213-0811

70-3213-0811

bahagian bahagian: 9174

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-4102-0611

70-4102-0611

bahagian bahagian: 9199

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0902-0511

70-0902-0511

bahagian bahagian: 9159

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0403-0810

70-0403-0810

bahagian bahagian: 9219

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-0605-0910

70-0605-0910

bahagian bahagian: 9210

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0403-0823

70-0403-0823

bahagian bahagian: 9174

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-2102-0310

70-2102-0310

bahagian bahagian: 9237

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-4021-0811

70-4021-0811

bahagian bahagian: 9149

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0203-0311

70-0203-0311

bahagian bahagian: 9219

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean,

Bersenang-senang
70-4105-0811

70-4105-0811

bahagian bahagian: 9224

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-4105-0911

70-4105-0911

bahagian bahagian: 9204

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0102-0311

70-0102-0311

bahagian bahagian: 9150

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0102-0611

70-0102-0611

bahagian bahagian: 9154

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
70-4021-1411

70-4021-1411

bahagian bahagian: 9155

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-1302-0510

70-1302-0510

bahagian bahagian: 9225

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Rosin Mildly Activated (RMA),

Bersenang-senang
70-1002-0310

70-1002-0310

bahagian bahagian: 9208

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-0102-0410

70-0102-0410

bahagian bahagian: 9215

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean,

Bersenang-senang
70-2103-0511

70-2103-0511

bahagian bahagian: 9135

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-2102-0511

70-2102-0511

bahagian bahagian: 6975

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-1003-0611

70-1003-0611

bahagian bahagian: 9156

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-0202-0611

70-0202-0611

bahagian bahagian: 9211

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0902-0510

70-0902-0510

bahagian bahagian: 9215

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0202-0310

70-0202-0310

bahagian bahagian: 9151

Jenis: Solder Paste, Komposisi: Sn62Pb36Ag2 (62/36/2), Takat lebur: 354°F (179°C), Jenis Flux: No-Clean,

Bersenang-senang
70-2102-0610

70-2102-0610

bahagian bahagian: 9152

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: Water Soluble,

Bersenang-senang
70-3205-1810

70-3205-1810

bahagian bahagian: 9190

Jenis: Solder Paste, Komposisi: Sn99.3Cu0.7 (99.3/0.7), Takat lebur: 441°F (227°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0605-0810

70-0605-0810

bahagian bahagian: 9132

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-4102-0610

70-4102-0610

bahagian bahagian: 9141

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang
70-3213-0810

70-3213-0810

bahagian bahagian: 9186

Jenis: Solder Paste, Komposisi: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Takat lebur: 423 ~ 424°F (217 ~ 218°C), Jenis Flux: No-Clean,

Bersenang-senang
70-0202-0511

70-0202-0511

bahagian bahagian: 9177

Jenis: Solder Paste, Komposisi: Sn63Pb37 (63/37), Takat lebur: 361°F (183°C), Jenis Flux: No-Clean,

Bersenang-senang